1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Original date of drawing YY-MM-DD CHECKE
2、D BY RAJESH PITHADIA TITLE MICROCIRCUIT, LINEAR, ULTRALOW POWER, 100 mA, LOW DROPOUT VOLTAGE REGULATOR, MONOLITHIC SILICON 10-04-22 APPROVED BY CHARLES F. SAFFLE SIZE A CODE IDENT. NO. 16236 DWG NO. V62/10607 REV PAGE 1 OF 10 AMSC N/A 5962-V020-10 Provided by IHSNot for ResaleNo reproduction or netw
3、orking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/10607 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a ultralow power, 10 mA, low dropout voltage regulator microcircuit, with an op
4、erating temperature range of -55C to +150C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/10607 - 01 X E D
5、rawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 TPS76901-EP Ultralow power, 10 mA, low dropout voltage regulator 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Num
6、ber of pins JEDEC PUB 95 Package style X 5 MO-178-AA Plastic surface mount 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash pa
7、lladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/10607 REV PAGE 3 1.3 Absolute maximum ratings. 1/ Input voltage range (VREF) -0.3 V to 13.5 V 2/ Vo
8、ltage range at EN -0.3 V to VIN+ 0.3 V Voltage on OUT, FB . 7 V Peak output current Internally limited Electrostatic discharge rating: Human body model (HBM) . 2 kV Continuous total power dissipation . See 1.5 thermal characteristics. Operating virtual junction temperature range (TJ) -55C to +150C 1
9、.4 Recommended operating conditions. 3/ Input voltage range (VIN) . 5 V to 10 V 4/ Output voltage range (VOUT) . 1.2 V to 4.5 V Continuous output current (IOUT) . 0 mA to 100 mA 5/ Operating junction temperature range (TJ) -55C to +150C 1.5 Thermal characteristics. Board JCJADerating factor Power di
10、ssipation above TA= 25C above TA= 25C Low K 6/ 65.8C/W 324.1C/W 3.9 mWC 482.6 mW High K 7/ 65.8C/W 255.4C/W 5.6 mW/C 694.4 mW 1/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the devic
11、e at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ All voltages are within respect to network ground terminal. 3/ Use of this product b
12、eyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. 4/ To calculate the minimum input voltage for maximum output current, use the following formula:
13、 VIN(min) = VOUT(max) + VDO(max load). 5/ Continuous output current and operating junction temperature are limited by internal protection circuitry, but it is not recommended that the device operate under conditions beyond those specified in this paragraph for extended periods of time. 6/ The JEDEC
14、Low K (1s) board design used to derive this data was a 3 inch x 3 inch, two layer board with 2 ounce copper traces on top of the board. 7/ The JEDEC High K (2s2p) board design used to derive this data was a 3 inch x 3 inch, multilayer board with 1 ounce internal power and ground planes and 2 ounce c
15、opper traces on top and bottom of the board. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/10607 REV PAGE 4 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and S
16、tandard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufac
17、turers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electr
18、ical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagram
19、s. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUM
20、BUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/10607 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol ConditionsTemperature, TJDevice type Limits Unit Min Max Output voltage 2/ (10 A to 100 mA load) VOUT12 V VOUT 4.5 V +25C 01 VOUTtypical V -55C to +150C 0.97 x VOUT1.03
21、x VOUTQuiescent current 2/ (GND current) IQEN = 0 V, 0 mA IOUT 100 mA +25C 01 17 typical A EN = 4 V, IOUT= 100 mA -55C to +150C 28 Load regulation EN = 0 V, +25C 01 12 typical mV IOUT= 0 mA to 100 mA +150C 13.5 typical Output voltage line 3/ regulation (VOUT/ VOUT) 5 V VIN 10 V 2/ +25C 01 0.04 typic
22、al % -55C to +150C 0.1 Output noise voltage VNBW = 300 Hz to 50 kHz, COUT= 10 F +25C 01 190 typical Vrms Output current limit VOUT= 0 V 2/ +25C 01 350 typical mA -55C to +150C 750 Standby current ISTDBYEN = VIN, +25C 01 1 typical A 5 V VIN 10 V -55C to +150C 2.4 Feedback (FB) input current IFBFB = 1
23、.18 V -55C to +150C 01 -1 1 A High level enable input voltage VIH5 V VIN 10 V +25C 01 1.7 V Low level enable input voltage VIL5 V VIN 10 V +25C 01 0.9 V +150C 0.75 typical See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,
24、-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/10607 REV PAGE 6 TABLE I. Electrical performance characteristics Continued. 1/ Test Symbol ConditionsTemperature, TA Device type Limits Unit Min Max Power supply ripple rejection PSRR f = 1 kHz, COUT= 10 F 2/ +25
25、C 01 60 typical dB Input current IINEN = 0 V -55C to +150C 01 -1 1 A EN = VIN-1 1 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperat
26、ure range and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ Minimum INPUT operating voltage is 5 V. Maximum INPUT voltage 10 V, minimum output current 10 A, maximum output current 100
27、mA. 3/ Line regulation (%) = ( VOUT) / ( VIN) x 100. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/10607 REV PAGE 7 Case X FIGURE 1. Case outline. Provided by IH
28、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/10607 REV PAGE 8 Case X Dimensions Symbol Inch Millimeters Min Max Min Max A - .057 - 1.45 A1 .000 .006 0.00 0.15 b .011 .019 0.3
29、0 0.50 c .003 .008 0.08 0.22 D .108 .120 2.75 3.05 E .057 .068 1.45 1.75 E1 .102 .118 2.60 3.00 e .037 BSC 0.95 BSC L .011 .022 0.30 0.55 L1 .009 BSC 0.25 BSC n 5 leads 5 leads NOTES: 1. Controlling dimensions are millimeter, inch dimensions are given for reference only. 2. Body dimensions do not in
30、clude mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 mm (0.006 inch) per end. 3. Falls within JEDEC MO-178 variation AA. FIGURE 1. Case outline Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTE
31、R, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/10607 REV PAGE 9 Device type 01 Case outline X Terminal number Terminal symbol I / O Description 1 INPUT I Input 2 GND - Ground 3 EN I Enable 4 FB I Feedback 5 OUTPUT O Output FIGURE 2. Terminal connections. Provided by IHSNot for Re
32、saleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/10607 REV PAGE 10 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test
33、 requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, lab
34、eling, and marking shall be in accordance with the manufacturers standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained her
35、ein is based on the salient characteristics of the device manufacturers data book. The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided. 6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply
36、herein is not to be construed as a guarantee of present or continued availability as a source of supply for the item. Vendor item drawing administrative control number 1/ 2/ 3/ Device manufacturer CAGE code Top side marking Vendor part number V62/10607-01XE 01295 PCFS TPS76901SDBVTEP 1/ The vendor i
37、tem drawing establishes an administrative control number for identifying the item on the engineering documentation. 2/ For the most current package and ordering information, see the package option addendum at the end of the manufacturers data sheet , or use website . 3/ Package drawings, standard pa
38、ckaging quantities, thermal data, symbolization, and printed circuit board (PCB) design guidelines are available at CAGE code Source of supply 01295 Texas Instruments, Inc. Semiconductor Group 8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
