1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Revise drawing, update sources. 7 August 2000 Monica Poelking B Supplier/address/CAGE change; reformat document 23 May 2002 Thomas M. Hess C Correct figure 1 - header thickness, supplier name, editorial changes throughout - RK 9 March 2006 Thomas M. Hess Pr
2、epared in accordance with ASME-14.100 Selected item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV C C C C C C C C C C C C C C C C C PAGES 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 PMIC N/A PREPARED BY Roger Kissel DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OH http:/www.dscc.dla.mil/programs/milsp
3、ec/docsearch.asp Original date of drawing CHECKED BY Alan Barone 7 August 1990 APPROVED BY David E. Moore TITLE SEMICONDUCTOR DEVICE, POWER SWITCHING REGULATOR ASSEMBLY SIZE A CODE IDENT. NO. 037Z3 DWG NO. 90024 REV C PAGE 1 OF 17 AMSC N/A 5961-E081 CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LO
4、GISTICS AGENCY DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 90024 REV C PAGE 2 1. SCOPE 1.1 Scope. This dr
5、awing describes the requirements for power switching regulator semiconductor assembly. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as follows: 90024 - 01 TXV | | | | | |_ Drawing Device type Quality level number (see 1.2.1) (see 1.2.1) 1.2.1 Device types. The device types shall i
6、dentify the polarity and voltage of the devices as follows: The TX and TXV suffix relates to the JANTX and JANTXV level requirements of MIL-PRF-19500. Device type Quality level Description Figure number 01 TX, TXV 15 A, 60 V, positive 1 (similar to TO-3) 02 TX, TXV 15 A, 80 V, positive 1 (similar to
7、 TO-3) 03 TX, TXV 15 A, 100 V, positive 1 (similar to TO-3) 04 TX, TXV 15 A, 60 V, negative 1 (similar to TO-3) 05 TX, TXV 15 A, 80 V, negative 1 (similar to TO-3) 06 TX, TXV 15 A, 100 V, negative 1 (similar to TO-3) 1.3 Maximum ratings. TC= +25C (unless otherwise noted). Type V 4-1 (input voltage)
8、V 1-2 (output voltage) V 3-4 (drive input reverse voltage) I 1 (1) (continuous output current) I 3 (drive current) RJCRCATJTSTG01 02 03 04 05 06 V 60 80 100 -60 -80 -100 V 60 80 100 -60 -80 -100 V 5 5 5 -5 -5 -5 A 15 15 15 -15 -15 -15 A -0.4 -0.4 -0.4 0.4 0.4 0.4 C/W 2 2 2 2 2 2 C/W 30 30 30 30 30 3
9、0 C -55 to +125 -55 to +125 -55 to +125 -55 to +125 -55 to +125 -55 to +125 C -65 to +150 -65 to +150 -65 to +150 -65 to +150 -65 to +150 -65 to +150 (1) Applies to TC= +25C, derate 1 percent in accordance with degree Celsius above TC= +25C. 1.4 Primary electrical characteristics. See table I, group
10、 A inspection, for the primary electrical characteristics. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 90024 REV C PAGE 3 Dimensions (see notes) Inches Millimeters
11、 Inches Millimeters LTR Min Max Min Max LTR Min Max Min Max A .875 22.23 H .395 .405 10.03 10.29 B .135 3.43 J .151 .161 3.84 4.09 C .250 .450 6.35 11.43 K .188 4.78 D .312 7.92 L .525 13.34 E .205 .225 5.21 5.72 M .708 .728 17.98 18.49 F .420 .440 10.67 11.18 N 1.177 1.197 29.90 30.40 G .145 .165 3
12、.68 4.19 P .038 .043 0.97 1.09 Notes: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Leads may be soldered to within .062 inches (1.57 mm) of base provided temperature-time exposure is 10 minutes Hermetic seal 1071 Fine leak Test condition H Gross leak Test co
13、ndition C Electrical tests See table II (omit deltas) Subgroup 3 Steady-state operational life 1027 340 hours minimum, circuit and conditions as specified on figure 3, TA= +25C Electrical tests See table II (omit deltas) Subgroup 4 De-cap internal visual (design verification) 2075 Visual criteria in
14、 accordance with qualified design Bond strength 2037 The sample shall be a minimum of three devices and shall include all wire sizes. Subgroup 5Thermal resistance 4081 RJCof the diode (2C/W max) Subgroup 6High-temperature life (non-operating) 1032 340 hours minimum, TA= +150C Electrical tests See ta
15、ble II (omit deltas) 1/ For sampling plan, see MIL-PRF-19500. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 90024 REV C PAGE 11 * TABLE IV. Group C inspection. Inspe
16、ction 1/ MIL-STD-750 Method Conditions Subgroup 1 Physical dimensions 2066 Dimensions as specified on figure 1 Subgroup 2 Thermal shock (glass strain) 1056 Test condition B Terminal strength 2036 Test condition A, weight = 3 pounds, time = 15 s Hermetic seal Fine leak 1071 Test condition H Gross lea
17、k Test condition C Moisture resistance 1021 Omit initial conditioning Electrical end-points See table II (omit deltas) Subgroup 3 Shock 2016 Non-operating, 1,500 Gs, 0.5 ms, 5 blows in each orientation (X1, Y1, Z1) Vibration variable frequency 2056 Constant acceleration 2006 1 minute in each orienta
18、tion, X1, Y1 at 10,000 G minimum Electrical tests See table II (omit deltas) Subgroup 4 Salt atmosphere (corrosion) 1041 Subgroup 5 Not applicable Subgroup 6 Steady-state operational life 1026 1,000 hours, circuit and conditions as specified on figure 3, TA= +25C Electrical tests See table II (omit
19、deltas) 1/ For sampling plan, see MIL-PRF-19500. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 90024 REV C PAGE 12 TABLE V. Group E inspection for initial design ver
20、ification. Inspection 1/ MIL-STD-750 Sample plan Method Conditions Subgroup 1 22 devices c = 0 Thermal shock (temperature cycling) 1051 No dwell time is required at +25C, test condition C, except T = -55C to +150C, (1,000 cycles including screening), textreme 10 minutes Hermetic seal 1071 Electrical
21、 tests See table II (omit deltas) Subgroup 2 22 devices c = 0 Steady-state dc blocking life 1027 1,000 hours, circuit and conditions as specified on figure 3, TA= +125C Electrical end-points See table II (omit deltas) Subgroup 3 Destructive physical analysis Visual criteria in accordance with design
22、 3 devices c = 0 Subgroups 4, 5, and 6 Not applicable Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 90024 REV C PAGE 13 NOTE: Test circuits and conditions for -04, -
23、05, and -06 are identical but of opposite polarity. FIGURE 2. High temperature reverse bias circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 90024 REV C PAGE 1
24、4 NOTE: No heat sink allowed. TAmust be controlled to prevent thermal runaway. FIGURE 3. Burn-in circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 90024 REV C P
25、AGE 15 NOTE: Test circuit and conditions for -04, -05, and -06 are identical but of opposite polarity VIN= -25 V, VOUT= -5 V. FIGURE 4. Switching speed circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS,
26、 OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 90024 REV C PAGE 16 NOTES: 1. Adjust TONto obtain specified IOUT. 2. Negative output test circuits and waveforms are identicalbut have opposite polarity. Component values Dash numbers R3L L H C F RL IOUT A-01, -04 2,000 150 100 1.0 5 -02, -05 2,700 150 100 1
27、.0 5 -03, -06 3,300 150 100 1.0 5 FIGURE 5. Reverse bias clamped inductive test circuit and conditions. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 90024 REV C PAG
28、E 17 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to
29、 ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the Military Services system commands. Packaging data retrieval is available from the managing Military Departments o
30、r Defense Agencys automated packaging files, 6. NOTES (This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.) 6.1 Intended use. Power switching regulator assemblies conforming to this drawing are intended for use when performance or military
31、 specifications do not exist and qualified military devices that will perform the required function are not available for the OEM application. This drawing is intended exclusively to prevent the proliferation of unnecessary duplicate specifications, drawings, and stock catalog listings. When a perfo
32、rmance or military specification exists and the product covered by this drawing has been qualified for listing on QML-19500, this drawing will be inactivated and will not be used for new design. The QML-19500 product shall be the preferred item for all applications. 6.2 Acquisition requirements. The
33、 acquisition requirements should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery of one copy of the conformance inspection data or certificate of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Requirements f
34、or packaging and packing. 6.3 Users of record. Coordination of this document for future revisions are coordinated only with the approved sources of supply and the users of record of this document. Requests to be added as a recorded user of this drawing should be in writing to: Defense Supply Center,
35、 Columbus, ATTN: DSCC-VAC, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-0510 or DSN 850-0510. 6.4 Approved sources of supply. Approved sources of supply are listed herein. Additional sources will be added as they become available. The vendors listed herein have agreed with
36、 this drawing and have submitted a certificate of compliance (see 3.5 herein) to Defense Supply Center, Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990 or emailed to Semiconductordscc.dla.mil. DSCC drawing PIN (1) Vendor similar designation or type number Vendor CAGE Vendor name and
37、 address 90024-01TX, TXV 90024-02TX, TXV 90024-03TX, TXV 90024-04TX, TXV 90024-05TX, TXV 90024-06TX, TXV PIC645 PIC646 PIC647 PIC655 PIC656 PIC657 43611 Microsemi 6 Lake Street Lawrence, MA 01841-3011 (1) Parts must be purchased to this DSCC PIN to assure that all performance requirements are met. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
