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    DLA DESC-DWG-88023 REV D-2010 DELAY LINES ACTIVE PROGRAMMABLE 4 BIT 24-PIN SURFACE MOUNT ECL INTERFACED.pdf

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    DLA DESC-DWG-88023 REV D-2010 DELAY LINES ACTIVE PROGRAMMABLE 4 BIT 24-PIN SURFACE MOUNT ECL INTERFACED.pdf

    1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Added suggested sources of supply. Changed quality assurance provisions, packaging information and notes. 16 Dec. 88 D. E. Morgan B Changed four dimensions on figure 1. Added paragraph 4.2.4. Editorial changes throughout. 13 Dec 90 Randy Larson C Added sold

    2、ering temperature profile to section 6. Deleted one vendor. Editorial changes throughout. 16 Mar 92 Tony Westphal D Incorporated boilerplate updates. 1 Jul 10 Michael A. Radecki Prepared in accordance with ASME Y14.100 Source Control drawingREV STATUS OF PAGES REV D D D D D D D D D D D PAGES 1 2 3 4

    3、 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Ken R. Beymer DESIGN ACTIVITY DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OH 45444-5000 Original date of drawing 14 January 1988 CHECKED BY David Corbett TITLE DELAY LINES, ACTIVE, PROGRAMMABLE 4 BIT, 24-PIN, SURFACE MOUNT, ECL INTERFACED APPROVED BY Randy Larson

    4、SIZE A CODE IDENT. NO. 14933 DWG NO. 88023 REV D PAGE 1 OF 11 AMSC N/A 5999-E222CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

    5、DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88023 REV D SHEET 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a family of active, programmable 4 bit, 24-pin surface mount, ECL interfaced, delay lines. 1.2 Part or Identifying Number (PIN). The

    6、PIN shall be as shown in the following example: 88023 -01Drawing number Dash number (see table I) 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this

    7、 specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 of this specification, whether or not they a

    8、re listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or co

    9、ntract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-DTL-19491 - Semiconductor Devices, Packaging of. MIL-PRF-83532 - Delay Lines, Active, General Specification for. DEPARTMENT OF DEFENSE STANDARD MIL-STD-202 - Electronic and Electrical Component Parts. (Copies of these documents are available online at

    10、 https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, t

    11、he issues of these documents are those cited in the solicitation or contract. AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM International) ASTM-B545 - Electrodeposited Coatings of Tin. ASTM-B339 - Standard Specification for Pig Tin. (Application for copies are available online at http:/www.astm.o

    12、rg or should be addressed to ASTM International PO Box C700, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959.) 2.4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of

    13、this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHI

    14、O SIZE A CODE IDENT NO. 14933 DWG NO. 88023 REV D SHEET 3 3. REQUIREMENTS 3.1 Case material. Material shall be molded or encapsulated epoxy and be in accordance with MIL-PRF-83532. 3.2 Interface and physical dimensions. See figure 1 and table I. 3.3 Terminal material. Material shall be copper-nickel

    15、 or alloy 42, tin plated in accordance with ASTM B545 (Type 1) or ASTM B339 (Type II). 3.4 Temperature coefficient of delay. Temperature coefficient of delay shall be 500 ppm/C. 3.5 Total delay time. See table I. 3.6 Delay tolerance. Delay tolerance shall be 1 ns or 5 percent, whichever is greater.

    16、3.7 Rise time. Rise time shall be 4 ns maximum. 3.8 Pulse width. Pulse width shall be 150 percent of maximum delay. 3.9 Supply voltage (VEE). -4.75 V dc to -5.25 V dc. 3.10 Logic 1 input current. 700 A maximum. 3.11 Logic 0 input current. .5 A minimum. 3.12 Logic 1, VOUT. -1.1 V minimum and -0.7 V m

    17、aximum. 3.13 Logic 0, VOUT. -1.95 V minimum and -1.6 V maximum. 3.14 Logic 1 input voltage. -1.1 V minimum. 3.15 Logic 0 input voltage. -1.5 V maximum. 3.16 Input pulse voltage. -0.75 V to -1.75 V. 3.17 Input pulse spacing. 3 times pulse width. 3.18 Inherent delay. 12 ns typical. 3.19 Thermal shock.

    18、 Method 107, test condition B-1, MIL-STD-202, 5 minutes at temperature extremes, and in accordance with MIL-PRF-83532. 3.20 Sealing. As specified in MIL-PRF-83532. 3.21 Terminal strength. Method 211, test condition C, MIL-STD-202, and in accordance with MIL-PRF-83532. 3.22 Vibration. Method 204, tes

    19、t condition B, MIL-STD-202, and in accordance with MIL-PRF-83532. 3.23 Shock. Method 213, test condition D, MIL-STD-202, and in accordance with MIL-PRF-83532. 3.24 Immersion. Method 104, test condition A, MIL-STD-202, and in accordance with MIL-PRF-83532. Provided by IHSNot for ResaleNo reproduction

    20、 or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88023 REV D SHEET 4 FIGURE 1. Interface and physical dimensions. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

    21、DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88023 REV D SHEET 5 Ltr Inches Mm Min Max Min Max A - .590 - 14.99 B - 1.290 - 32.77 C .040 .044 1.02 1.12 D .018 .022 0.46 0.56 E .100 TYP 2.54 TYP F .770 .790 19.56 20.07 G .870 .890 22.10 22.61 H .040 .060 1.02 1.5

    22、2 J - .300 - 7.62 K .008 .012 0.20 0.30 L .010 - 2.54 - M 1.090 1.110 27.69 28.19 N .820 .840 20.83 21.34 P .098 .102 2.49 2.59 Q .100 TYP 2.54 TYP R .048 .052 1.22 1.32 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Unless otherwise specified, t

    23、olerance is .010 (0.25 mm). 4. Standoffs are optional. 5. Coplanarity of terminal ends shall be within .002 inch (0.05 mm). FIGURE 1. Interface and physical dimensions - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS S

    24、UPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88023 REV D SHEET 6 TABLE I. PINs and delay times. DESC drawing PIN 88023 Incremental delay per step Total delay change -01 -02 -03 0.5 ns 0.3 ns 1.0 ns 0.5 ns 2.0 ns 0.5 ns 7.5 ns 15 ns 30 ns -04 -05 -06 3.0 ns 1.0 ns 4.0 ns 1.0 ns 5.0 n

    25、s 1.0 ns 45 ns 60 ns 75 ns -07 -08 -09 6.0 ns 1.0 ns 8.0 ns 1.0 ns 10 ns 1.5 ns 90 ns 120 ns 150 ns -10 -11 -12 12 ns 1.5 ns 15 ns 1.5 ns 20 ns 2.0 ns 180 ns 225 ns 300 ns -13 -14 -15 25 ns 2.5 ns 30 ns 3.0 ns 35 ns 3.5 ns 375 ns 450 ns 525 ns -16 -17 -18 40 ns 4.0 ns 45 ns 4.5 ns 50 ns 5.0 ns 600 n

    26、s 675 ns 750 ns -19 -20 -21 60 ns 6.0 ns 80 ns 8.0 ns 100 ns 10 ns 900 ns 1200 ns 1500 ns Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88023 REV D SHEET 7 3.25 Mois

    27、ture resistance. As specified in MIL-PRF-83532. 3.26 Solderability. As specified in MIL-PRF-83532. 3.27 Resistance to solvents. As specified in MIL-PRF-83532. 3.28 Operating temperature range. -55C to +125C. 3.29 Storage temperature range. -65C to +130C. 3.31 Truth table. See table II. 3.32 Recycled

    28、, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible, provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycl

    29、e costs. 3.33 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-83532 Qualified Product List for at least one part, or perform the group A and group C inspections specified herein on a sample of parts agreed upon by th

    30、e manufacturer and DSCC-VA. 3.34 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be an approved source of supply. 3.35 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content o

    31、f components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.36 Marking. Marking shall be in accordance with MIL-PRF-83532, except that the PIN shall be as specified in 1.2. 3.37 Workmanship. Workmanship shall be in accorda

    32、nce with MIL-PRF-83532. 4. VERIFICATION 4.1 Sampling and inspection. Unless otherwise specified, sampling and inspection procedures shall be performed in accordance with MIL-PRF-83532. 4.2 Conformance inspection. 4.2.1 Inspection of product for delivery. Inspection of product for delivery shall cons

    33、ist of the group A inspection for level A of MIL-PRF-83532. 4.2.2 Statement in lieu of inspection. The contracting activity, at its discretion, may accept a statement of compliance with group A requirements in lieu of the manufacturer performing group A inspection (see 6.2c). 4.2.3 Inspection of pac

    34、kaging. The sampling and inspection of the preservation, packing, and container marking shall be in accordance with the requirements for semiconductor devices in MIL-DTL-19491. 4.2.4 Certificate of compliance. Each manufacturer desiring to be listed as an approved source of supply (see 6.4), shall s

    35、ubmit a Certificate of Compliance to DSCC-VAT. The certificate shall state that the manufacturers product meets all the requirements of this drawing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE

    36、A CODE IDENT NO. 14933 DWG NO. 88023 REV D SHEET 8 TABLE II. Truth table. Enable Address (bit no.) Delay out 1 = High 0 = Low = Dont care T0= Reference or inherent delay of circuit T1to T15= Multiplier of incremental delay 4 3 2 1 0 0 0 0 0 0 0 0 0 0 1 0 0 1 0 T0 T1T20 0 0 0 0 1 1 0 1 0 0 0 1 0 1 T3

    37、 T4T50 0 0 0 1 1 0 0 1 1 1 1 0 0 0 T6T7T80 0 0 1 0 0 1 1 0 1 0 1 0 1 1 T9T10T110 0 0 1 1 0 0 1 1 0 1 1 1 1 0 T12T13T140 1 1 1 1 1 T150 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel

    38、 is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agenc

    39、y, or within the military services system commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a genera

    40、l or explanatory nature which may be helpful, but is not mandatory.) 6.1 Intended use. Devices conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM application. Devic

    41、es covered by this drawing replace similar devices covered by nonmilitary specifications or drawings. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88023 REV D SHEET

    42、 9 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery of one copy of the conformance inspection data or certificate of compliance that parts have passed conformance inspection with each shipment of parts by the manu

    43、facturer. c. Requirements for packaging and packing. 6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typi

    44、cal operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter

    45、, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.4 Soldering temperature profile. A recommended soldering temperature profile is shown on figure 2. FIGURE 2. Recommended soldering temperature profile. 6.5 Users of record. Coordination of this document for future

    46、revisions is coordinated only with the approved source(s) of supply and the users of record of this document. Requests to be added as a recorded user of this drawing may be achieved online at mailto:relaydla.mil or if in writing to: Defense Supply Center, Columbus, ATTN: DSCC/VAT, Post Office Box 39

    47、90, Columbus, OH 43218-3990 or by telephone (614) 692-4481 or DSN 850-4481. 6.6 Approved source(s) of supply. Approved source(s) of supply are listed herein. Additional sources will be added as they become available. Assistance in the use of this drawing may be obtained online at mailto:relaydla.mil

    48、, or by contacting Defense Supply Center, Columbus, ATTN: DSCC-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-4481 or DSN 850-4481. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88023 REV D SHEET 10 DSCC drawing PIN 88023- 1


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