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    BS IEC IEEE 62582-4-2012 Nuclear power plants Instrumentation and control important to safety Electrical equipment condition monitoring methods Oxidation induction techniques《核电站 对.pdf

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    BS IEC IEEE 62582-4-2012 Nuclear power plants Instrumentation and control important to safety Electrical equipment condition monitoring methods Oxidation induction techniques《核电站 对.pdf

    1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationNuclear power plants Instrumentation and control important to safety Electrical equipment condition monitoring methodsPart 4: Oxidation induction techniquesBS IEC/IEEE 62582-4:20

    2、11National forewordThis British Standard is the UK implementation of IEC/IEEE 62582-4:2011. The UK participation in its preparation was entrusted to Technical CommitteeNCE/8, Reactor instrumentation.A list of organizations represented on this committee can be obtained on request to its secretary.Thi

    3、s publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. BSI 2011ISBN 978 0 580 71960 8 ICS 27.120.20Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published un

    4、der the authority of the Standards Policy and Strategy Committee on 31 January 2012.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS IEC/IEEE 62582-4:2011IEC/IEEE 62582-4 Edition 1.0 2011-08 INTERNATIONAL STANDARD Nuclear power plants Instrumentation and control impor

    5、tant to safety Electrical equipment condition monitoring methods Part 4: Oxidation induction techniques Centrales nuclaires de puissance Instrumentation et contrle-commande importants pour la sret Mthodes de surveillance de ltat des matriels lectriques Partie 4: Techniques dinduction loxydation U IC

    6、S 27.120.20 ISBN 978-2-88912-666-8 INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE PRICE CODE CODE PRIX NORME INTERNATIONALE BS IEC/IEEE 62582-4:2011 2 62582-4 IEC/IEEE:2011 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope and object 8 2 Terms and definitions . 8 3

    7、 Abbreviations and acronyms . 8 4 General description 9 5 Applicability and reproducibility 9 6 Measurement procedure . 9 6.1 Stabilisation of the polymeric materials 9 6.2 Sampling . 10 6.2.1 General . 10 6.2.2 Sample requirements . 10 6.2.3 Precautions . 10 6.3 Sample preparation . 10 6.4 Instrume

    8、ntation . 11 6.5 Calibration . 11 6.6 OIT measurement method . 11 6.6.1 Measurement procedure 11 6.6.2 Temperature profile . 12 6.6.3 Gas flow 13 6.6.4 Determining the value of oxidation onset . 13 6.6.5 Reporting 14 6.7 OITP measurement method . 15 6.7.1 Measurement procedure 15 6.7.2 Temperature p

    9、rofile . 16 6.7.3 Gas flow 16 6.7.4 Determining the value of oxidation onset . 16 6.7.5 Reporting 16 Annex A (informative) Interpretation of thermograms . 18 Annex B (informative) Example of a measurement report from OITP measurements 23 Annex C (informative) Influence of set temperature on the OIT

    10、value . 25 Bibliography 26 Figure 1 OIT measurement Schematic of temperature and gas profile and corresponding heat flow 12 Figure 2 Schematic showing the types of baselines (flat, sloping, endothermic dip, melting endotherm) observed for OIT and OITP measurements 13 Figure 3 Schematic showing defin

    11、ition of onset value for OIT and OITP measurements 14 Figure 4 Schematic of the temperature for OITP measurements and the corresponding heat flow 15 Figure A.1 Example of an OIT plot with clear baseline and onset . 18 Figure A.2 Example of OIT plot with multiple onsets 19 Figure A.3 Example of OIT p

    12、lot where the baseline is difficult to define 20 BS IEC/IEEE 62582-4:201162582-4 IEC/IEEE:2011 3 Figure A.4 Example of OIT plot where heat flow is too low to use standard 0,1 Wg1threshold 20 Figure A.5 Example of an OITP plot with a well-defined baseline and onset . 21 Figure A.6 Example of an OITP

    13、plot for a semi-crystalline material showing a melting endotherm prior to the oxidation onset 22 Figure A.7 Example of an OITP plot showing an endothermic dip immediately prior to the oxidation onset . 22 Figure C.1 Example of the influence of set temperature on the OIT value 25 BS IEC/IEEE 62582-4:

    14、2011 4 62582-4 IEC/IEEE:2011 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ NUCLEAR POWER PLANTS INSTRUMENTATION AND CONTROL IMPORTANT TO SAFETY ELECTRICAL EQUIPMENT CONDITION MONITORING METHODS Part 4: Oxidation induction techniques FOREWORD 1) The International Electrotechnical Commission (IEC) is a

    15、worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to oth

    16、er activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the

    17、subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEEE Standards documents are developed within IEEE Societies and Standards Coordinating Committees of the IEEE Stand

    18、ards Association (IEEE-SA) Standards Board. IEEE develops its standards through a consensus development process, approved by the American National Standards Institute, which brings together volunteers representing varied viewpoints and interests to achieve the final product. Volunteers are not neces

    19、sarily members of IEEE and serve without compensation. While IEEE administers the process and establishes rules to promote fairness in the consensus development process, IEEE does not independently evaluate, test, or verify the accuracy of any of the information contained in its standards. Use of IE

    20、EE Standards documents is wholly voluntary. IEEE documents are made available for use subject to important notices and legal disclaimers (see http:/standards.ieee.org/IPR/disclaimers.html for more information). IEC collaborates closely with IEEE in accordance with conditions determined by agreement

    21、between the two organizations. This Dual Logo International Standard was jointly developed by the IEC and IEEE under the terms of that agreement. 2) The formal decisions of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since e

    22、ach technical committee has representation from all interested IEC National Committees. The formal decisions of IEEE on technical matters, once consensus within IEEE Societies and Standards Coordinating Committees has been reached, is determined by a balanced ballot of materially interested parties

    23、who indicate interest in reviewing the proposed standard. Final approval of the IEEE standards document is given by the IEEE Standards Association (IEEE-SA) Standards Board. 3) IEC/IEEE Publications have the form of recommendations for international use and are accepted by IEC National Committees/IE

    24、EE Societies in that sense. While all reasonable efforts are made to ensure that the technical content of IEC/IEEE Publications is accurate, IEC or IEEE cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international un

    25、iformity, IEC National Committees undertake to apply IEC Publications (including IEC/IEEE Publications) transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC/IEEE Publication and the corresponding national or regional publication sha

    26、ll be clearly indicated in the latter. 5) IEC and IEEE do not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC and IEEE are not responsible for any services carried out by indepen

    27、dent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or IEEE or their directors, employees, servants or agents including individual experts and members of technical committees and IEC National Committees, or

    28、volunteers of IEEE Societies and the Standards Coordinating Committees of the IEEE Standards Association (IEEE-SA) Standards Board, for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising

    29、out of the publication, use of, or reliance upon, this IEC/IEEE Publication or any other IEC or IEEE Publications. 8) Attention is drawn to the normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Atte

    30、ntion is drawn to the possibility that implementation of this IEC/IEEE Publication may require use of material covered by patent rights. By publication of this standard, no position is taken with respect to the existence or validity of any patent rights in connection therewith. IEC or IEEE shall not

    31、 be held responsible for identifying Essential Patent Claims for which a license may be required, for conducting inquiries into the legal validity or scope of Patent Claims or determining whether any licensing terms or conditions provided in BS IEC/IEEE 62582-4:201162582-4 IEC/IEEE:2011 5 connection

    32、 with submission of a Letter of Assurance, if any, or in any licensing agreements are reasonable or non-discriminatory. Users of this standard are expressly advised that determination of the validity of any patent rights, and the risk of infringement of such rights, is entirely their own responsibil

    33、ity. International Standard IEC/IEEE 62582-4 has been prepared by subcommittee 45A: Instrumentation and control of nuclear facilities, of IEC technical committee 45: Nuclear instrumentation, in cooperation with the Nuclear Power Engineering Committee of the Power this is used as the baseline. In som

    34、e materials, there is a linear change in heat flow before the onset of oxidation. This can also be used as a baseline and is referred to as a sloping baseline. Heatflow(Wg1)Time (OIT) or temperature (OITP) Flat Sloping Endothermic dip (OITP) Melting endotherm (OITP) IEC 1976/11 Figure 2 Schematic sh

    35、owing the types of baselines (flat, sloping, endothermic dip, melting endotherm) observed for OIT and OITP measurements 6.6.4.2 Definition of the threshold and onset time The threshold shall be defined at 0,1 Wg1relative to the baseline. The onset time is defined by the intersection of the test curv

    36、e with the threshold relative to the baseline, as shown in Figure 3. BS IEC/IEEE 62582-4:2011 14 62582-4 IEC/IEEE:2011 Heatflow(Wg1)Time (OIT) or temperature (OITP) Onset Baseline + threshold Baseline Definition of onset of OIT/OITP IEC 1977/11 Figure 3 Schematic showing definition of onset value fo

    37、r OIT and OITP measurements Examples of the types of OIT thermogram that are observed in practice are given in Annex A. 6.6.5 Reporting The measurement report shall include the following items. a) Identification of the equipment sampled. This shall include: details of the material being sampled, e.g

    38、. the generic polymer type, specific formulation numbers; where the sample was taken from, e.g. surface scraping, through thickness slice; for samples taken in plant, location within the plant. b) Pre-history of the equipment sampled. This shall include: time in service, or ageing time for laborator

    39、y aged samples; the environmental conditions to which it has been exposed, e.g. temperature, radiation. c) Sampling method, including sample preparation (6.3). d) Place and date of the measurements. e) Instrument used and software version used for analysis (6.4). f) Calibration procedure (6.5). g) T

    40、ype of sample pan used (6.3). h) Oxygen flow rate during test (6.6.3). i) Temperature profile, including ramp rates and hold times (6.6.2). NOTE If the instrument is capable of generating the information, the actual temperature profile should be included. BS IEC/IEEE 62582-4:201162582-4 IEC/IEEE:201

    41、1 15 j) Baseline type and the rationale for using that specific baseline (6.6.4.1). k) Onset type and the rationale for the selection of the onset in multiple onsets. l) Threshold value used and the rationale if a non-standard value is used (6.6.4.2). m) Number of samples measured (6.3). n) Mean val

    42、ue of OIT, and standard deviation, in minutes. o) Examples of the heat flow vs. time plot, particularly if the material does not show a flat baseline with single well-defined onset. 6.7 OITP measurement method 6.7.1 Measurement procedure The measurement procedure is illustrated in Figure 4. It inclu

    43、des the following steps: The sample is heated in the instrument in oxygen at 10 Cmin1 The oxidation exotherm is detected by a rapid increase in heat flow The temperature at which the sample starts oxidising is determined. This is the oxidation induction temperature. Time Temperature TemperatureHeatf

    44、lowBaseline Threshold 10 C min1Oxygen OITP value IEC 1978/11 IEC 1979/11 Figure 4 Schematic of the temperature for OITP measurements and the corresponding heat flow BS IEC/IEEE 62582-4:2011 16 62582-4 IEC/IEEE:2011 6.7.2 Temperature profile The temperature ramp rate shall be 10 Cmin1in oxygen from t

    45、he start temperature until the oxidation onset is observed. When carrying out consecutive measurements, the starting temperature shall be 50 C. 6.7.3 Gas flow The flow rate for oxygen during OITP measurements shall be 75 mlmin1 25 mlmin1. NOTE Oxidation induction measurements can be affected by the

    46、oxygen flow rate used during the tests. For low flow rates (50 mlmin1), this can result in increased induction temperatures in OITP tests. For the range of flow rates from 50 mlmin1 to 100 mlmin1, oxidation induction temperatures are not strongly dependent on the oxygen flow rate. 6.7.4 Determining

    47、the value of oxidation onset 6.7.4.1 Definition of the baseline The threshold for oxidation induction is measured relative to a baseline, as shown in Figure 2. There will usually be a period of constant heat flow prior to the onset of oxidation; this is used as the baseline. In some materials, there

    48、 is a linear change in heat flow before the onset of oxidation. This can also be used as a baseline and is referred to as a sloping baseline. 6.7.4.2 Definition of the threshold and onset temperature The threshold shall be defined at 0,5 Wg1relative to the baseline. The onset temperature is defined

    49、by the intersection of the test curve with the threshold relative to the baseline, as shown in Figure 3. NOTE Heat flows during OITP measurements are considerably higher than in OIT measurements. The selection of a higher threshold value than that used for OIT measurements enables a more consistent value to be obtained for the onset. Examples of the types of OITP thermogram that are observed in practice are g


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