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    BS IEC 62153-4-10-2015 Metallic communication cable test methods Electromagnetic compatibility (EMC) Transfer impedance and screening attenuation of feed-throughs and electromagnet.pdf

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    BS IEC 62153-4-10-2015 Metallic communication cable test methods Electromagnetic compatibility (EMC) Transfer impedance and screening attenuation of feed-throughs and electromagnet.pdf

    1、BSI Standards PublicationMetallic communication cable test methodsPart 4-10: Electromagnetic compatibility (EMC) Transfer impedance and screening attenuation of feed-throughs and electromagnetic gaskets Double coaxial test methodBS IEC 62153-4-10:2015National forewordThis British Standard is the UK

    2、implementation of IEC 62153-4-10:2015.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/46, Cables, wires and waveguides, radio frequency connectors and accessories for communication and signalling.A list of organizations represented on this committee can be obtained on

    3、request to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2015.Published by BSI Standards Limited 2015ISBN 978 0 580 84908 4ICS 33.100.01; 33.120.10Compliance w

    4、ith a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 30 November 2015.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS IEC 62153-4-10:2015IEC 6215

    5、3-4-10 Edition 2.0 2015-11 INTERNATIONAL STANDARD Metallic communication cable test methods Part 4-10: Electromagnetic compatibility (EMC) Transfer impedance and screening attenuation of feed-throughs and electromagnetic gaskets Double coaxial test method INTERNATIONAL ELECTROTECHNICAL COMMISSION IC

    6、S 33.100; 33.120.10 ISBN 978-2-8322-2993-4 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. colourinsideBS IEC 62153-4-10:2015 2 IEC 62153-4-10:2015 IEC 2015 CONTENTS FOREWORD . 4 1 Scope 6 2 N

    7、ormative references 6 3 Terms and definitions 6 4 Principle of the test method . 9 5 Procedure 12 5.1 Equipment 12 5.2 Dynamic range 12 5.3 Verification of the test set-up 12 5.4 Sample preparation . 12 6 Measurement . 12 6.1 General . 12 6.2 Screening attenuation . 12 6.3 Transfer impedance 12 7 Ex

    8、pression of results . 13 7.1 Transfer impedance 13 7.2 Screening attenuation . 13 7.3 Requirements . 13 Annex A (informative) Background for the measurement of the shielding effectiveness of feed-throughs and electromagnetic gaskets 14 A.1 General . 14 A.2 Theoretical model of the test procedure 15

    9、A.3 Performing measurements 16 A.3.1 Characteristic impedance uniformity of the test fixture . 16 A.3.2 Measuring EMI-gaskets by using a NWA . 16 A.3.3 Pictures and measurement results . 17 Annex B (informative) Reference device for verification measurement . 23 B.1 General . 23 B.2 Design of the re

    10、ference device 23 B.3 Verification measurement result 24 Annex C (informative) Impact of ground loops on low frequency measurements 25 C.1 General . 25 C.2 Analysis of the test set-up . 25 Bibliography 28 Figure 1 A two-port 7 Figure 2 Equivalent circuit of the test set-up and definition of ZT7 Figu

    11、re 3 Cross-section of a typical feed-through configuration . 10 Figure 4 Cross-section of the test fixture with a connector . 10 Figure 5 Cross-section of the test fixture with an electromagnetic gasket . 11 Figure A.1 Cross-section of a typical feed-through configuration 14 Figure A.2 Cross-section

    12、 of the test fixture with a connector 15 Figure A.3 Equivalent circuit of the test setup with the shunt admittance y of the feed-through . 15 BS IEC 62153-4-10:2015IEC 62153-4-10:2015 IEC 2015 3 Figure A.4 TDR step response at input-port of test fixture 16 Figure A.5 View of the test fixture connect

    13、ed to a network analyzer . 18 Figure A.6 Top view of the test fixture 18 Figure A.7 Detailed view of the contact area 18 Figure A.8 Detailed view of the captivation for the conductive O-ring test. 19 Figure A.9 Isolation of the network analyzer . 20 Figure A.10 Isolation of the test fixture when cha

    14、racterizing an ideal short (metal plate) 20 Figure A.11 Measured operational screening transmission when characterizing a typical conductive O-ring. 21 Figure A.12 Transfer impedance ZTof a typical conductive O-ring . 21 Figure A.13 Screening attenuation asof a typical conductive O-ring 22 Figure B.

    15、1 Reference device, e.g. resistors soldered onto a PCB . 23 Figure B.2 Typical verification measurement result 24 Figure C.1 Double coaxial test set-up 25 Figure C.2 Equivalent circuits of the double coaxial test set-up 26 Figure C.3 Results obtained with (green) and without ferrites on the test lea

    16、ds (blue) 27 BS IEC 62153-4-10:2015 4 IEC 62153-4-10:2015 IEC 2015 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ METALLIC COMMUNICATION CABLE TEST METHODS Part 4-10: Electromagnetic compatibility (EMC) Transfer impedance and screening attenuation of feed-throughs and electromagnetic gaskets Double coa

    17、xial test method FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning stand

    18、ardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparati

    19、on is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with

    20、the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjec

    21、ts since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical c

    22、ontent of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent pos

    23、sible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide confor

    24、mity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its direct

    25、ors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising

    26、out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is draw

    27、n to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62153-4-10 has been prepared by IEC technical committee 46: Cables, wires, waveguide

    28、s, R.F. connectors, R.F. and microwave passive components and accessories. This second edition cancels and replaces the first edition published in 2009. It constitutes a technical revision. The main technical changes with regard to the previous edition are as follows: addition of a new clause that d

    29、escribes a procedure for verification of the measurement set-up and further information regarding sample preparation; addition of a new Annex that describes how to improve measurement certainty in the very low frequency area. The text of this standard is based on the following documents: BS IEC 6215

    30、3-4-10:2015IEC 62153-4-10:2015 IEC 2015 5 FDIS Report on voting 46/563/FDIS 46/580/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part

    31、 2. A list of all parts of the IEC 62153 series, under the general title: Metallic communication cable test methods, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “htt

    32、p:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IMPORTANT The colour inside logo on the cover page of t

    33、his publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. BS IEC 62153-4-10:2015 6 IEC 62153-4-10:2015 IEC 2015 METALLIC COMMUNICATION CABLE TEST METHODS Part

    34、4-10: Electromagnetic compatibility (EMC) Transfer impedance and screening attenuation of feed-throughs and electromagnetic gaskets Double coaxial test method 1 Scope This part of IEC 62153 details a coaxial method suitable for determining the transfer impedance and/or screening attenuation of feed-

    35、throughs and electromagnetic gaskets. The shielded screening attenuation test set-up according to IEC 62153-4-4 (triaxial method) has been modified to take into account the particularities of feed-throughs and gaskets. A wide dynamic and frequency range can be applied to test even super screened fee

    36、d-throughs and gaskets with normal instrumentation from low frequencies up to the limit of defined transversal waves in the coaxial circuits at approximately 4 GHz. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable

    37、for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. Void. 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. 3.1 operati

    38、onal (Betriebs) transfer function in the forward direction B21H operational (Betriebs) scattering parameter 21Squotient of the reflected square root of power wave fed into the reference impedance of the output of the two-port and the unreflected square root of the power wave consumed at the input of

    39、 the two-port EXAMPLE (see Figure 1) BS IEC 62153-4-10:2015IEC 62153-4-10:2015 IEC 2015 7 ZAU1Z1I1E1Z2U2I2ZBE2Vi1Vr1Vi2Vr2Two-port IEC Key E1, E2network analyzer at input, output respectively Vi1, Vi2incident square root of complex power waves (see note) at input and output, respectively ZA, ZBrefer

    40、ence impedance at input and output respectively Vr1, Vr2reflected square root of complex power waves (see note) at input and output, respectively I1, I2current at input and output, respectively Z1, Z2impedance at input and output, respectively U1, U2voltage at input and output, respectively Figure 1

    41、 A two-port Note 1 to entry: Complex power is the product IU . Apparent power is the product IU , which is used in electrical power technique, where the angle between the voltage and current is of interest.I Is the complex conjugate of the current I . S21 or HB21 is the operational (Betriebs) transf

    42、er function in the forward direction defined as follows: B21BA120i1r2212i2HZZEUVVSV=See Annex C of IEC TR 62152:2009. 3.2 transfer impedance equivalent circuit of the measurement of a feed-through or gasket, shunt impedance ZTbetween the primary and secondary circuit EXAMPLE The transfer impedance o

    43、f an electrically short screen is defined as the quotient of the open circuit voltage 2U induced to the secondary circuit by the current 1I fed into the primary circuit or vice versa. See Figure 2. TZ of an electrically short screen is expressed in or decibels in relation to 1 . ZTZo, l Zo, l I1U2IE

    44、C Figure 2 Equivalent circuit of the test set-up and definition of ZT12TIUZ =(1) BS IEC 62153-4-10:2015 8 IEC 62153-4-10:2015 IEC 2015 +=1log20T10TZZ(2) 3.3 operational (Betriebs) attenuation the quotient of the unreflected square root of power wave fed into the reference impedance of the input of t

    45、he two-port and the square root of the power wave consumed by the load of the two-port expressed in dB and radians Note 1 to entry: See IEC TR 62152. 3.4 screening attenuation sa logarithmic ratio of the incident (unreflected) square root of power wave fed into the nominal impedance of the primary c

    46、ircuit of the test set-up and the periodic maximum values of the square root of power wave r2V, maxcoupled into the secondary circuit of the test set-up when its characteristic impedance oZ is normalized to 150 EXAMPLE ( )( )o10B21o10max21,10o10i1max r2,10s150log20EnvMin.150log20Env1log20150log20Env

    47、log20ZAZSZVVa+=+=+=(3) where sa is the screening attenuation expressed in dB; Env (B21A ) is the operational attenuation recorded as the envelope curve of the measured values in dB (See 7.1); Min.Env (B21A ) is the operational attenuation recorded as the minimum envelope curve of the measured values

    48、 in dB (See 7.1); 150 is the standardized impedance of the secondary (“outer” or disturbed) circuit. The screening attenuation, expressed in dB of an electrically short device is: T10s50log20Za (4) where sa is the screening attenuation expressed in ; TZ is the transfer impedance of the device under

    49、test. Note 1 to entry: Formula (4) may be deduced from Formulas (3) and (5) as follows, assuming an electrically short device: T10s2150log20ZZao= . If we assume thato3150 Z , then T10s32150log20Za= and approximate 32 3 then T10s50log20Za and Formula (4) is valid. In the measurement, both primary and secondary circuits are low impedance. This leads to a 6 dB lower B21A tha


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