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    BS IEC 60748-2-12-2001 Semiconductor devices - Integrated circuits - Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)《半导体器件 集成电路 数字集成电.pdf

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    BS IEC 60748-2-12-2001 Semiconductor devices - Integrated circuits - Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)《半导体器件 集成电路 数字集成电.pdf

    1、BRITISH STANDARD BS IEC 60748-2-12: 2001 QC 790121:2001 Semiconductor devices Integrated circuits Part 2-12: Digital integrated circuits Blank detail specification for programmable logic devices (PLDs) ICS 31.200 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS IEC 60748-2-12

    2、:2001 This British Standard, having been prepared under the direction of the Electrotechnical Sector Committee, was published under the authority of the Standards Committee and comes into effect on 15 June 2001 BSI 06-2001 ISBN 0 580 37535 8 National foreword This British Standard reproduces verbati

    3、m IEC 60748-2-12:2001 and implements it as the UK national standard. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary

    4、. From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-refe

    5、rences The British Standards which implement international publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A Bri

    6、tish Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present

    7、to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an insi

    8、de front cover, the IEC title page, pages 2 to 26, an inside back cover and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date Comments!“#$% 8 ?85 3112A12 ,-./0.-1-2.343.56-7089:715:;.3;=.3;=.

    9、38:6=;-B:5.3-B:5.3/;0;66FD5.3G?H,.I C56-7089:710;395J-75.3;15937-;7:-1.3-1D3-815;15937-;7:-1.3;66FD5 D0-7395J-75.3G?H,.I .-=7788=. %L6D8VB6. any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental orga

    10、nizations liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of the IEC on te

    11、chnical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested National Committees. 3) The documents produced have the form of recommendations for international use and are published

    12、 in the form of standards, technical specifications, technical reports or guides and they are accepted by the National Committees in that sense. 4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards transparently to the maximum exten

    13、t possible in their national and regional standards. Any divergence between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter. 5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equi

    14、pment declared to be in conformity with one of its standards. 6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights. International Stan

    15、dard IEC 60748-2-12 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical committee 47: Semiconductor devices. This standard is a blank detail specification for programmable logic devices (PLDs). The text of this standard is based on the following documents: FDIS Report on vot

    16、ing 47A/594/FDIS 47A/605/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 3. The QC number that appears on the front cover of this

    17、publication is the specification number in the IEC Quality Assessment System for Electronic Components (IECQ). Page4 BSIEC60748212:2001 BSI 06-2001 The committee has decided that the contents of this publication will remain unchanged until 2010. At this date, the publication will be reconfirmed; wit

    18、hdrawn; replaced by a revised edition, or amended. Page5 BSIEC60748212:2001 BSI 06-2001 SEMICONDUCTOR DEVICES INTEGRATED CIRCUITS Part 2-12: Digital integrated circuits Blank detail specification for programmable logic devices (PLDs) INTRODUCTION The IEC Quality Assessment System for Electronic Comp

    19、onents is operated in accordance with the statutes of the IEC and under the authority of the IEC. The object of this system is to define quality assessment procedures in such a manner that electronic components released by one participating country as conforming with the requirements of an applicabl

    20、e specification are equally acceptable in all other participating countries without the need for further testing. This blank detail specification is one of a series of blank detail specifications for semiconductor devices and shall be used with the following IEC publications: IEC 60747-10/QC 700000:

    21、1991, Semiconductor devices Part 10: Generic specification for discrete devices and integrated circuits IEC 60748-2:1997, Semiconductor devices Integrated circuits Part 2: Digital integrated circuits IEC 60748-11/QC 790100:1990, Semiconductor devices Integrated circuits Part 11: Sectional specificat

    22、ion for semiconductor integrated circuits excluding hybrid circuits Required information Numbers shown in brackets on this and the following page correspond to the following items of required information, which should be entered in the spaces provided on page 15 of this blank detail specification. I

    23、dentification of the detail specification 1 The name of the National Standards Organization under whose authority the detail specification is issued. 2 The IECQ number of the detail specification. 3 The numbers and issue numbers of the generic and sectional specifications. 4 The national number of t

    24、he detail specification, date of issue and any further information, if required by the national system. Identification of the component 5 Main function and type number. 6 Information on typical construction (materials, the main technology) and the package. If applicable, variants of products shall b

    25、e given here together with the variant characteristics. Page6 BSIEC60748212:2001 BSI 06-2001 The detail specification shall give a brief description including the following: technology (NMOS, fusible link, EPROM, EEPROM, RAM, etc.); structure (word bits); the type of output circuit (for example, thr

    26、ee-state); major functions. 7 Outline drawing, terminal identification, marking, and/or reference to the relevant document for outlines. 8 Assessment levels according to 2.6 of the generic specification. 9 Reference data on the most important properties to permit comparison between component types.

    27、Throughout this standard, texts given in square brackets are intended for guidance to the specification writer and shall not be included in the detail specification. Throughout this standard, when a characteristic or rating applies, “x“ denotes that a value shall be inserted in the detailed specific

    28、ation. If there is family specification, the number and title of this specification shall be given here, and whatever characteristics are quoted in this family specification should be omitted in clause 6. If there is not a family specification, “none“ should be stated here. Page7 BSIEC60748212:2001

    29、BSI 06-2001 Name (address) of responsible NAI 1 (and possibly of body from which the specification is available). Number of IECQ detail specification, 2 plus issue number and/or date. QC 790121 ELECTRONIC COMPONENTS OF 3 ASSESSED QUALITY IN ACCORDANCE WITH: Generic specification : IEC 60747-10/QC 70

    30、0000 Sectional specification : IEC 60748-11/QC 790100 and national reference if different. National number of detail specification. 4 This box need not be used if national number repeats IECQ number. BLANK DETAIL SPECIFICATION FOR PROGRAMMABLE LOGIC DEVICES (PLDs) 5 Type number(s) of the relevant de

    31、vice(s). Ordering information: see 1.2 of this standard. Short description 6 Application: Function: Typical construction: for example, monolithic, MOS, etc Encapsulation: cavity or non-cavity. Comparison table of characteristics of variants of the device. CAUTION: Electrostatic discharge sensitive d

    32、evices. Categories of assessed quality 8 From 2.6 of the generic specification. Mechanical description 7 Outline references: Standard package references should be given, IEC number (mandatory if available) and/or national number. Outline drawing: May be transferred to, or given with more details in,

    33、 clause 8 of this standard. Terminal identification: Drawing showing pin assignments, including graphical symbols. Marking: Letters and figures, or colour code. The detail specification shall prescribe the information to be marked on the device, if any. See 2.5 of the generic specification and/or 1.

    34、1 of this standard. Reference data 9 Reference data on the most important properties to permit comparison between types. Information about manufacturers who have components qualified to this detail specification is available in the current qualified products list. Page8 BSIEC60748212:2001 BSI 06-200

    35、1 1 Marking and ordering information 1.1 Marking Any particular information other than that given in box 7 and/or 2.5 of the generic specification shall be given here. 1.2 Ordering information The following minimum information is necessary to order a specific device, unless otherwise specified: prec

    36、ise type reference (and nominal voltage value, if required); IECQ reference of the detail specification with issue number and/or date when relevant; categories as defined in clause 9 of the sectional specification and, if required, screening sequence as defined in clause 8 of the sectional specifica

    37、tion; packaging for delivery; any other particulars. 2 Application related description The following information shall be given: nominal supply voltage; nominal current consumption; nominal stand-by current consumption (if applicable); operating modes; electrical compatibility (if applicable); it sh

    38、all be stated whether the integrated circuit is electrically compatible with other particular integrated circuit or families of integrated circuits, or whether special interfaces are required; overall block diagram; summary of the programming/erasing conditions (see also clause 7 of this standard).

    39、3 Specification of the function 3.1 Block diagram The block diagram shall be sufficiently detailed to enable the individual functional units within the integrated circuit to be identified with their main input and output paths and the identification of their external connections (chip enable, addres

    40、s decode, etc). The graphical symbol for the function shall be given. This may be obtained from a cata- logue of standard graphical symbols or designed according to the rules of IEC 60617-12 or IEC 60617-13. Page9 BSIEC60748212:2001 BSI 06-2001 3.2 Identification and function of terminals All termin

    41、als shall be identified on the block diagram (supply terminals, address, data and control terminals). The terminal functions shall be indicated in a table as follows. Function of terminal Terminal number Terminal symbol Terminal designation Function Input/output Identification Type of output circuit

    42、 3.3 Functional description The function performed by the circuit shall be specified, including the following information: 1) Functional blocks The functions of each functional block shall be stated. The description of each block shall include the following: basic function and relation to other func

    43、tional blocks, for example: internal logic; matrix size; number of usable gates and terminals; output control function: a) combinational elements; b) sequential elements; c) feedback; d) output enable; e) polarity; f) direct preset/reset to flip-flop; clock input; security function; electronics sign

    44、ature function; diagnostics function; relation to external terminals; relation to other functional blocks; for other functions, for example, the power-down function, see the applicable part of IEC 60748 for family-related characteristics. Where appropriate, function table and/or mode table may be indicated. 2) Operation related description Operating mode (for example, set-up method, preference, default state, etc.). Page10 BSIEC60748212:2001


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