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    BS EN 60317-2-2012 Specifications for particular types of winding wires Solderable polyurethane enamelled round copper wire class 130 with a bonding layer《绕组线特殊类型规格 130级带粘合层的可焊聚氨酯漆.pdf

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    BS EN 60317-2-2012 Specifications for particular types of winding wires Solderable polyurethane enamelled round copper wire class 130 with a bonding layer《绕组线特殊类型规格 130级带粘合层的可焊聚氨酯漆.pdf

    1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationSpecifications for particular types of winding wiresPart 2: Solderable polyurethane enamelled round copper wire, class 130, with a bonding layerBS EN 60317-2:2012National forewor

    2、dThis British Standard is the UK implementation of EN 60317-2:2012. It is identical to IEC 60317-2:2012. It supersedes BS EN 60317-2:1996,which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee GEL/55, Winding wires.A list of organizations represented on this

    3、committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2012.Published by BSI Standards Limited 2012.ISBN 978 0 580 75472 2 ICS

    4、29.060.10Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 November 2012.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 603

    5、17-2:2012EUROPEAN STANDARD EN 60317-2 NORME EUROPENNE EUROPISCHE NORM October 2012 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2

    6、012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60317-2:2012 E ICS 29.060.10 Supersedes EN 60317-2:1994 + A1:1998 + A2:2000English version Specifications for particular types of winding wires - Part 2: Solderable polyurethane

    7、enamelled round copper wire, class 130, with a bonding layer (IEC 60317-2:2012) Spcifications pour types particuliers de fils de bobinage - Partie 2: Fil de section circulaire en cuivre maill avec polyurthane brasable, classe 130, avec une couche adhrente (CEI 60317-2:2012) Technische Lieferbedingun

    8、gen fr bestimmte Typen von Wickeldrhten - Teil 2: Runddrhte aus Kupfer, verzinnbar, lackisoliert mit Polyurethan und darber mit Backlack, Klasse 130 (IEC 60317-2:2012) This European Standard was approved by CENELEC on 2012-08-16. CENELEC members are bound to comply with the CEN/CENELEC Internal Regu

    9、lations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC

    10、member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official ver

    11、sions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, t

    12、he Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 60317-2:2012EN 60317-2:2012 Foreword The text of document 55/1325/FDIS, future edition 4 of IEC 60317-2, prepared by IEC/TC 55 “Winding wires“ was submitted to the

    13、IEC-CENELEC parallel vote and approved by CENELEC as EN 60317-2:2012. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2013-05-16 latest date by which the national standar

    14、ds conflicting with the document have to be withdrawn (dow) 2015-08-16 This document supersedes EN 60317-2:1994 + A1:1998 + A2:2000. EN 60317-2:2012 includes the following significant technical changes with respect to EN 60317-2:1994 + A1:1998 + A2:2000: - addition of requirements for appearance, ne

    15、w Subclause 3.3; - addition of pin hole test requirements, Clause 23: Pin hole test. This standard is to be read in conjunction with EN 60317-0-1:2008. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not b

    16、e held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60317-2:2012 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for th

    17、e standards indicated: IEC 60264 Series NOTE Harmonised as EN 60264 Series (not modified). IEC 60317 Series NOTE Harmonised as EN 60317 Series (not modified). IEC 60851 Series NOTE Harmonised as EN 60851 Series (not modified). BS EN 60317-2:2012EN 60317-2:2012 Annex ZA (normative) Normative referenc

    18、es to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the lates

    19、t edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60317-0-1 2008 Specifications for particular types of windi

    20、ng wires - Part 0-1: General requirements - Enamelled round copper wire EN 60317-0-1 2008 BS EN 60317-2:201260317-2 IEC:2012 CONTENTS INTRODUCTION . 5 1 Scope . . 6 2 Normative references . 6 3 Terms, definitions, general notes and appearance . 6 3.1 Terms and definitions . 6 3.2 General notes . 6 3

    21、.2.1 Methods of test . 6 3.2.2 Winding wire . 6 3.3 Appearance 7 4 Dimensions . . 7 5 Electrical resistance . 7 6 Elongation . . 7 7 Springiness . . 7 8 Flexibility and adherence 7 9 Heat shock . 7 10 Cut-through . . 7 11 Resistance to abrasion (nominal conductor diameters from 0,250 mm up to and in

    22、cluding 2,000 mm) . 7 12 Resistance to solvents . . 8 13 Breakdown voltage 8 14 Continuity of insulation . 8 15 Temperature index 8 16 Resistance to refrigerant 8 17 Solderability . 8 17.1 Nominal conductor diameters up to and including 0,050 mm 8 17.2 Nominal conductor diameters over 0,050 mm up to

    23、 and including 0,100 mm 9 17.3 Nominal conductor diameter over 0,100 mm . 9 18 Heat or solvent bonding 9 18.1 Heat bonding 9 18.1.1 Heat bonding strength of a helical coil . 9 18.1.2 Bond strength of a twisted coil . 10 18.2 Solvent bonding 10 19 Dielectric dissipation factor 10 20 Resistance to tra

    24、nsformer oil . 11 21 Loss of mass 11 23 Pin hole test . 11 30 Packaging . . 11 Bibliography . 12 Table 1 Resistance to abrasion . 8 Table 2 Loads 10 BS EN 60317-2:201260317-2 IEC:2012 5 INTRODUCTION This part of IEC 60317 is one of a series which deals with insulated wires used for windings in elect

    25、rical equipment. The series has three groups describing: 1) Winding wires Test methods (IEC 60851); 2) Specifications for particular types of winding wires (IEC 60317); 3) Packaging of winding wires (IEC 60264). BS EN 60317-2:2012 6 60317-2 IEC:2012 SPECIFICATIONS FOR PARTICULAR TYPES OF WINDING WIR

    26、ES Part 2: Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer 1 Scope This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 130 with a dual coating. The underlying coating is based on polyurethane resin, which m

    27、ay be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additi

    28、ves to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is: Grade 1B: 0,020 mm up to and including 2,000 mm; Grade 2B: 0,020 mm up to and including 2,000 mm. The nominal conductor diameters are specified in Clause 4 of IEC

    29、60317-0-1:2008. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (inc

    30、luding any amendments) applies. IEC 60317-0-1:2008, Specifications for particular types of winding wires Part 0-1: General requirements Enamelled round copper wire 3 Terms, definitions, general notes and appearance 3.1 Terms and definitions For the purposes of this document, the terms and definition

    31、s given in 3.1 of IEC 60317-0-1:2008 apply. 3.2 General notes 3.2.1 Methods of test Subclause 3.2 of IEC 60317-0-1:2008 applies. In case of inconsistencies between IEC 60317-0-1 and this standard, IEC 60317-2 shall prevail. 3.2.2 Winding wire Class 130 is a thermal class that requires a minimum temp

    32、erature index of 130 and a heat shock temperature of at least 155 C. BS EN 60317-2:201260317-2 IEC:2012 7 The temperature in degrees Celsius corresponding to the temperature index is not necessarily that at which it is recommended that the wire be operated and this will depend on many factors, inclu

    33、ding the type of equipment involved. 3.3 Appearance Subclause 3.3 of IEC 60317-0-1:2008 applies. 4 Dimensions Clause 4 of IEC 60317-0-1:2008 applies. 5 Electrical resistance Clause 5 of IEC 60317-0-1:2008 applies. 6 Elongation Clause 6 of IEC 60317-0-1:2008 applies. 7 Springiness Clause 7 of IEC 603

    34、17-0-1:2008 applies. 8 Flexibility and adherence Clause 8 of IEC 60317-0-1:2008 applies. The constant K used for the calculation of the number of revolutions for the peel test shall be 150 mm. 9 Heat shock Clause 9 of IEC 60317-0-1:2008 applies. The minimum heat shock temperature shall be 155 C. 10

    35、Cut-through No failure shall occur within 2 min at 170 C. 11 Resistance to abrasion (nominal conductor diameters from 0,250 mm up to and including 2,000 mm) The wire shall meet the requirements given in Table 1. For intermediate nominal conductor diameters, the value of the next largest nominal cond

    36、uctor diameter applies. BS EN 60317-2:2012 8 60317-2 IEC:2012 Table 1 Resistance to abrasion Nominal conductor diameter mm Grade 1 Grade 2 Minimum average force to failure N Minimum force to failure of each measurement N Minimum average force to failure N Minimum force to failure of each measurement

    37、 N 0,250 0,280 0,315 0,355 0,400 0,450 0,500 0,560 0,630 0,710 0,800 0,900 1,000 1,120 1,250 1,400 1,600 1,800 2,000 2,30 2,50 2,70 2,90 3,15 3,40 3,65 3,90 4,20 4,50 4,80 5,20 5,60 6,00 6,50 7,00 7,50 8,00 8,60 1,95 2,10 2,30 2,50 2,70 2,90 3,10 3,30 3,55 3,80 4,10 4,40 4,75 5,15 5,55 5,95 6,35 6,8

    38、0 7,30 4,10 4,40 4,75 5,10 5,45 5,80 6,20 6,65 7,10 7,60 8,10 8,70 9,30 10,0 10,7 11,4 12,2 13,1 14,0 3,50 3,70 4,00 4,30 4,60 4,90 5,25 5,60 6,00 6,45 6,90 7,40 7,90 8,50 9,10 9,70 10,4 11,1 11,9 12 Resistance to solvents Test inappropriate. 13 Breakdown voltage Clause 13 of IEC 60317-0-1:2008 appl

    39、ies. The elevated temperature shall be 130 C. 14 Continuity of insulation Clause 14 of IEC 60317-0-1:2008 applies. 15 Temperature index Clause 15 of IEC 60317-0-1:2008 applies. The minimum temperature index shall be 130. 16 Resistance to refrigerant Test inappropriate. 17 Solderability 17.1 Nominal

    40、conductor diameters up to and including 0,050 mm The temperature of the solder bath shall be (375 5) C. The maximum immersion time shall be 2 s. BS EN 60317-2:201260317-2 IEC:2012 9 The surface of the tinned wire shall be smooth and free from holes and enamel residues. 17.2 Nominal conductor diamete

    41、rs over 0,050 mm up to and including 0,100 mm The temperature of the solder bath shall be (375 5) C. The maximum immersion time shall be 2 s. The surface of the tinned wire shall be smooth and free from holes and enamel residues. 17.3 Nominal conductor diameter over 0,100 mm The temperature of the s

    42、older bath shall be (375 5) C. The maximum immersion (in seconds) shall be the following multiple of the nominal conductor diameter (in millimetres) with a minimum of 2 s. Grade 1B Grade 2B 12 s/mm 16 s/mm The surface of the tinned wire shall be smooth and free from holes and enamel residues. 18 Hea

    43、t or solvent bonding 18.1 Heat bonding 18.1.1 Heat bonding strength of a helical coil 18.1.1.1 At room temperature The specimens shall be prepared according to the test method, and the temperature of the oven for bonding shall be fixed as agreed between purchaser and supplier for the different types

    44、 of bonding enamels. The suggested temperature for polyamide bonding enamel is (200 2) C and the suggested temperature for polyvinyl butyral bonding enamel is (170 2) C. Results: when testing the specimens according to the test method, under the action of load specified in Table 2, no turns (other t

    45、han possibly the first and the last) shall be separated. For nominal conductor diameters up to and including 0,050 mm, the test method and requirements are based upon agreement between purchaser and supplier. 18.1.1.2 At elevated temperature The specimens shall be prepared and shall be conditioned a

    46、s described in the test method. The elevated temperature shall be fixed as agreed between purchaser and supplier for the different types of bonding enamels. The suggested temperature for polyamide bonding enamel is (155 2) C and the suggested temperature for polyvinyl butyral bonding enamel is (90 2

    47、) C. Results: when testing the specimens according to the test method, under the action of load specified in Table 2, no turns (other than possibly the first and the last) shall be separated. For nominal conductor diameters up to and including 0,050 mm, the test method and requirements are based upo

    48、n agreement between purchaser and supplier. BS EN 60317-2:2012 10 60317-2 IEC:2012 Table 2 Loads Nominal conductor diameter mm Room temperature Elevated temperature Over Up to and including Load N Load N 0,050 0,071 0,100 0,160 0,200 0,315 0,400 0,500 0,630 0,710 0,800 0,900 1,000 1,120 1,250 1,400

    49、1,600 1,800 0,050 0,071 0,100 0,160 0,200 0,315 0,400 0,500 0,630 0,710 0,800 0,900 1,000 1,120 1,250 1,400 1,600 1,800 2,000 * 0,05 0,08 0,12 0,25 0,35 0,70 1,10 1,60 2,20 2,80 3,40 4,20 5,00 5,80 6,50 8,50 10,00 12,00 * 0,04 0,06 0,08 0,19 0,25 0,55 0,80 1,20 1,70 2,10 2,60 3,20 3,80 4,40 4,90 6,40 7,90 7,90 18.1.2 Bond strength of a twisted coil 18.1.2.1 At room temperature A test specimen of diameter 0,315 mm shall be prepared according to the test method. The time shall


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