1、BRITISH STANDARD BS EN 60191-6-1:2001 IEC 60191-6-1:2001 Mechanical standardization of semiconductor devices Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals The European Standard EN 60191-6-1:2
2、001 has the status of a British Standard ICS 31.080.01; 01.100.25 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS EN 60191-6-1:2001 This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published und
3、er the authority of the Standards Policy and Strategy Committee on 29 March 2002 BSI 29 March 2002 ISBN 0 580 39236 8 National foreword This British Standard is the official English language version of EN 60191-6-1:2001. It is identical with IEC 60191-6-1:2001. The UK participation in its preparatio
4、n was entrusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/4, Mechanical standardization, which has the responsibility to: A list of organizations represented on this subcommittee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have t
5、he number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references The British Standards which implement inter
6、national or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to incl
7、ude all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/Europ
8、ean committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pag
9、es 2 to 8, an inside back cover and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 60191-6-1 NORME EUROPENNE EUROPISCHE NORM December 2001 CENELEC European Com
10、mittee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2001 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELE
11、C members. Ref. No. EN 60191-6-1:2001 E ICS 31.080.01 English version Mechanical standardization of semiconductor devices Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals (IEC 60191-6-1:2001)
12、Normalisation mcanique des dispositifs semi-conducteurs Partie 6-1: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs pour montage en surface - Guide de conception pour les botiers broches en forme dailes de mouette (CEI 60191-6-1:2001) Mechanische Normung vo
13、n Halbleiterbauelementen Teil 6-1: Allgemeine Regeln fr die Erstellung von Gehusezeichnungen von SMD-Halbleitergehusen - Konstruktionsleitfaden fr Gehuse mit Gullwing-Anschlssen (IEC 60191-6-1:2001) This European Standard was approved by CENELEC on 2001-12-01. CENELEC members are bound to comply wit
14、h the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretari
15、at or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the o
16、fficial versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.NE 061-19-6:12001 -
17、2 - Foreword The text of document 47D/459/FDIS, future edition 1 of IEC 60191-6-1, prepared by SC 47D, Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-1 on 2001-12-01. T
18、he following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2002-09-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2004-12-01 Annexes des
19、ignated “normative“ are part of the body of the standard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60191-6-1:2001 was approved by CENELEC as a European Standard without any modification. _ 1002:161910
20、6NE 2002hcraM92ISB 2 Page2 EN6019161:2001 BSI29March2002 2 601-19-61 EI:C0021(E) MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals 1 Scope This
21、 part of IEC 60191 covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads; e.g., QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4 1) . This publication is intended to establish common rules on terminal shapes irrespective
22、of package types. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 6019
23、1-6:1990, Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages 3 Definitions For the purpose of this part of IEC 60191, the definitions of IEC 60191-6 apply as well as the following definiti
24、on: 3.1 gull-wing lead compliant lead bent down from the body of the package with a foot at the end pointing away from the package 1)IEC 60191-4:1999, Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device
25、packages 1002:1619106NE 2002hcraM92ISB 3 Page3 EN6019161:2001 BSI29March2002061-19-61 IEC:20(10)E 3 4 References and drawingsTerminal cross-section 1) 1 Seating plane, with which a package is in contact 1) The dimensions of the terminal section apply to the ranges of 0,1 mm and 0,25 mm from the end
26、of a terminal. Figure 1 Gull-wing lead terminal b b1 c1 c A1A 2 Lp L1 A3 1 IEC 2161/01 1002:1619106NE 2002hcraM92ISB 4 Page4 EN6019161:2001 BSI29March2002 4 601-19-61 EI:C0021(E) 5 Outline dimensions The gull-wing lead design guides are shown in the tables below. The nominal value should be respecte
27、d as the common value when developing packages with gull-wing leads thereby preventing proliferation of terminal shapes in the same package family. The range of values should be applied in usage on individual standards. The values are re-specified in the package design guide to reflect the specific
28、requirement for each package type. 6 Package height and stand-off height Table 1 below shows the relationship between the package height and the stand-off height. Table 1 Package height and stand-off height Dimensions in millimetres Package height A2 nom. (Range) Stand-off height A1 nom. (Range) 1,0
29、 (0,951,05) 0,1 (0,000,15) 1,4 (1,351,55) 0,1 (0,000,15) Low stand-off 0,1 (0,000,25) 2,0 (1,802,20) High stand-off 0,4 (0,250,50) Low stand-off 0,1 (0,000,25) 2,7 (2,502,90) High stand-off 0,4 (0,250,50) Low stand-off 0,1 (0,000,25) 3,4 (3,203,60) High stand-off 0,4 (0,250,50) Low stand-off 0,1 (0,
30、000,25) 3,8 (3,604,00) High stand-off 0,4 (0,250,50) The package height and the stand-off height are defined regardless of the terminal pitch. 1002:1619106NE 2002hcraM92ISB 5 Page5 EN6019161:2001 BSI29March2002061-19-61 IEC:20(10)E 5 7 Terminal thickness and width Table 2 Terminal width b1 and b Dim
31、ensions in millimetres Terminalpitch Terminal width b1 nom. (Range) Terminal width b (Range) Note 1,27 0,40 (0,340,45) (0,340,50) 1,25 0,40 (0,340,45) (0,340,50) 1,0 0,40 (0,340,45) (0,340,50) 0,35 (0,290,41) (0,290,45) QFP only 0,8 0,30 (0,250,35) (0,250,40) 0,30 (0,220,36) (0,220,40) QFP only 0,65
32、 0,22 (0,170,27) (0,170,32) 0,5 0,20 (0,170,23) (0,170,27) 0,4 0,16 (0,130,19) (0,130,23) 0,3 0,12 (0,090,15) (0,090,18) Table 3 Terminal thickness c1 and c Dimensions in millimetres Terminalpitch Terminal thickness c1 nom. (Range) Terminal thickness c (Range) Note 1,27 0,25 (0,230,27) 0,20 (0,190,2
33、1) 0,15 (0,140,16) 0,125 (0,1150,135) 0,10 (0,090,11) (0,230,32) (0,190,25) (0,140,20) (0,1150,175) (0,090,15)1,251,00,80,650,50,40,3 0,15 (0,140,16) 0,125 (0,1150,135) 0,10 (0,090,11) (0,140,20) (0,1150,175) (0,090,15) e e 1002:1619106NE 2002hcraM92ISB 6 Page6 EN6019161:2001 BSI29March2002 6 601-19
34、-61 EI:C0021(E) 8 Terminal shape Table 4 Terminal shape Dimensions in millimetres Package height A2 nom. Standard height of soldered part Length of soldered part Lp nom. (Range) Angle of terminal flat portions nom. (Range) Terminal length L1 nom. Notes 1,0 0,60 (0,450,75) 1,0 1,4 0,60 (0,450,75) 1,0
35、 0,60 (0,450,75) 1,0 0,50 2,0 0,88 (0,731,03) 1,6 0,65 0,60 (0,450,75) 1,0 0,50 2,7 0,88 (0,731,03) 1,6 0,65 0,60 (0,450,75) 1,3 0,50 3,4 0,88 (0,731,03) 1,6 0,65 0,60 (0,450,75) 1,3 0,50 3,8 0,25 0,88 (0,731,03) 3 (08) 1,6 0,65 9 Tolerance of terminal center position and coplanarity Table 5 Toleran
36、ce of terminal center position and coplanarity Dimensions in millimetres Terminal pitch Tolerance of terminal centre position X Coplanarity y Note 1,27 0,25 1,25 0,35 1,0 0,20 0,20 QFP only 0,8 0,16 0,65 0,13 0,10 0,5 0,08 0,4 0,07 0,08 0,3 0,06 0,05 _ A3 e e e e e e e e e 1002:1619106NE 2002hcraM92
37、ISB 7 Page7 EN6019161:2001 BSI29March2002- 3 - EN 061-19-6:12001 Annex ZA (normative) Normative references to international publications with their corresponding European publications This European Standard incorporates by dated or undated reference, provisions from other publications. These normati
38、ve references are cited at the appropriate places in the text and the publications are listed hereafter. For dated references, subsequent amendments to or revisions of any of these publications apply to this European Standard only when incorporated in it by amendment or revision. For undated referen
39、ces the latest edition of the publication referred to applies (including amendments). NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60191-6 1990 Mechanical standardization of sem
40、iconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - 1002:1619106NE 2002hcraM92ISB 8 Page8 EN6019161:2001 BSI29March2002BS EN 60191-6-1:2001 IEC 60191-6-1:2001 BSI 389 Chiswick High Road London W4 4AL BSI British Standard
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