1、BRITISH STANDARD BS EN 123600:1997 Harmonized system of quality assessment for electronic components Sectional specification: Flex-rigid multilayer printed boards with through connections The European Standard EN 123600:1996 has the status of a British Standard ICS 31.180BS EN123600:1997 This Britis
2、h Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15May1997 BSI 08-1999 The following BSI references relate to the work on this standard: Committee reference EPL/52 Draft for co
3、mment 91/28661 DC ISBN 0 580 27427 6 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/52, Printed circuits, upon which the following bodies were represented: British Telecommunications plc Federation of the Electronics
4、 Industry GAMBICA BEAMA Ltd. National Supervising Inspectorate (BSI-PC) Printed Circuit Interconnection Federation Surface Mount and Related Technologies (SMART Group) Ltd. Amendments issued since publication Amd. No. Date CommentsBS EN123600:1997 BSI 08-1999 i Contents Page Committees responsible I
5、nside front cover National foreword ii Foreword 2 Text of EN 123600 3 List of references Inside back coverBS EN123600:1997 ii BSI 08-1999 National foreword This British Standard has been prepared by Technical Committee EPL/52, and is the English language version of EN123600:1996 Sectional specificat
6、ion: Flex-rigid multilayer printed boards with through connections, published by the European Committee for Electrotechnical Standardization (CENELEC). It supersedes BS9766:1983, which is obsolescent; BS9766:1983 remains valid for existing approvals, but may not be used for any new approvals. A Brit
7、ish Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Cross-references Publication referred to Corres
8、ponding British Standard EN 123000:1991 BS EN 123000:1992 Harmonized system of quality assessment for electronic components. Generic specification: Printed boards BS 2011 Environmental testing IEC 68-2-3:1969 Part 2.1Ca:1977 Test Ca. Damp heat, steady state IEC 68-2-20:1979 Part 2.1T:1981 Test T. So
9、ldering IEC 68-2-38:1974 Part 2.1Z/AD:1977 Tests Z/AD. Composite temperature/humidity cyclic test IEC 194:1988 BS 4727 Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1 Terms common to power, telecommunications and electronics Group 11:1991 Printed
10、 circuits BS 6221 Printed wiring boards IEC 326-2:1990 Part 2:1991 Methods of test IEC 326-3:1991 Part 3:1991 Guide for the design and use of printed wiring boards Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the EN title page, pages 2 to 44, an insi
11、de back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on theinside front cover.EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 123600 December 1996 Descriptors: Multilayer print
12、ed boards, with through connections, capability test, quality conformance inspection, test patterns Englishversion Sectional specification: Flex-rigid multilayer printed boards with through connections Spcification intermdiaire: Cartes imprimes multicouches flexorigides avec connexions transversales
13、 Rahmenspezifikation: Biegesteife Mehrlagen-Leiterplatten mit Durchverbindungen This European Standard was approved by CENELEC on 1992-02-14. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a
14、 national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A vers
15、ion in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, F
16、rance, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung
17、Central Secretariat: rue de Stassart 35, B-1050 Brussels 1996 Copyright reserved to CENELEC members Ref. No. EN 123600:1996 EEN123600:1996 BSI 08-1999 2 Foreword This European Standard was prepared by CLC/TC CECC/SC52, Printed boards (former WG23). It is based, wherever possible, on the Publications
18、 of the International Electrotechnical Commission, and in particular on IEC326-11, Printed boards, Part11: Specification for flex-rigid multilayer printed boards with through connections. The text of the draft based on document CECC(Secretariat)2823 was submitted to the formal vote; together with th
19、e voting report, circulated as document CECC(Secretariat)3022, it was approved as EN123600 on1992-02-14. The following dates were fixed: Contents Page Foreword 2 1 Introduction 3 1.1 Scope and object 3 1.2 Related documents 3 2 General 3 3 Test specimen 4 3.1 Capability Approval 4 3.2 Quality confor
20、mance inspection 4 4 Relevant specification 4 5 Characteristics of the printed board 4 6 Capability test programme 16 7 Quality conformance inspection 17 8 Test pattern Test boards 20 8.1 General 20 8.2 Application of test patterns and test boards 21 8.3 Structure of test boards 21 8.4 Multiple arra
21、ngements of the composite test pattern 21 8.4.1 Examples of multiple arrangements 22 Figure 1 Length of defect 20 Figure 2 22 Figure 3a Layer 1 24 Figure 3b Layer 2 25 Figure 3c Layer 3 26 Figure 3d Layer 4 27 Figure 3e Layer 5 28 Figure 3f Layer 6 29 Figure 3g 30 Figure 3h 31 Figure 4a L specimen (
22、Layer 3, 3a, 3b) 39 Figure 4b L specimen (Layer 4, 4a, 4b) 40 Figure 5 Examples of delamination 41 Figure 6a Methods of reinforcing lands 42 Figure 6b Examples relating to access holes 43 Figure 7 Examples of soldered holes 44 Table I Basic characteristics 5 Table II Additional characteristics 14 Ta
23、ble III 16 Table IV 18 Table V 21 Table VI 23 latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop)1997-07-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow)2003-05-0
24、1EN123600:1996 BSI 08-1999 3 1 Introduction IEC326-11 is the IEC Standard for flex-rigid multilayer printed boards with through connections. The following document comprises this IEC Standard and in accordance with the Generic Specification EN123000, the information additionally necessary for printe
25、d boards intended to be handled within the CENELEC system for electronic components of assessed quality. 1.1 Scope and object This document is a Sectional Specification (SS) relating to flex-rigid multilayer printed boards with through connections irrespective of their method of manufacture, when th
26、ey are ready for the mounting of the components. It defines the characteristics to be assessed and the test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection). 1.2 Related documents IEC 68, Basic environmental testing proced
27、ures. IEC 97, Grid system for printed circuits. IEC 194, Terms and definitions for printed circuits. IEC 249, Metal-clad base materials for printed circuits. IEC 326-1, Printed boards, instructions for the specification writer. IEC 326-2, Test methods for printed boards. IEC 326-3, Recommendations f
28、or the design and the use of printed boards. IEC 326-11, Specification for the design and use of flex-rigid multilayer printed boards with through-connections. 2 General This Sectional Specification (SS) applies to flex-rigid printed boards with through-connections and is intended as a basis for the
29、 preparation of a Capability Detail Specification (CapDS) applying to specific materials e.g.according to IEC249-2, and to be used for Capability Approval Procedures. It may be necessary to have a CapDS for each type of material. A CapDS may be prepared by an international or national body or by a m
30、anufacturer (seealso CECC00111/IV). Customer Detail Specification (CDS) for the custom built printed boards, according to clause 5 of EN123000. The CDS will normally be written by the customer and allocated a number within his own system. Further details are also given in EN123000 and CECC00114/III.
31、 Table I contains the basic characteristics that will normally be important for flex-rigid multilayer printed boards with through-connections and makes reference to the appropriate tests to verify these characteristics. Table II contains the additional characteristics that may be important for certa
32、in flex-rigid multilayer printed boards with through connections and/or certain applications and makes reference to the appropriate tests to verify these characteristics. Where necessary, the relevant specification may quote characteristics and tests from this Table II. Where additional details for
33、a test have to be specified in the relevant specification, this shall be indicated by “*” in the relevant column. These details shall then be specified in accordance with CECC00010(IEC326-2). Table III contains the capability test programme. A specified composite test pattern (CTP) is used as a capa
34、bility qualifying component. Table IV contains the information for the quality conformance inspection. The tables are not intended to prescribe a test sequence. The tests may be carried out in any sequence, unless otherwise specified.EN123600:1996 4 BSI 08-1999 3 Test specimen A test specimen, which
35、 may be specifically designed for this purpose (composite test pattern), or taken from production (production board), which is used for verifying capability in accordance with the relevant Generic Specification. A suitable composite test pattern is shown in Figure 3a, Figure 3b, Figure 3c, Figure 3e
36、, Figure 3f, Figure 3d, Figure 3g, Figure 3h, Figure 4a, and Figure 4b. 3.1 Capability Approval 3.1.1 Basic capability The test shall be carried out on the composite test pattern given in clause8. 3.1.2 Additional capability Clause 3.5.3 of EN123000 shall apply. For multiple arrangements; seealsocla
37、use8. 3.1.3 Maintenance of Capability Approval Clause 3.8 of EN123000 shall apply. 3.2 Quality conformance inspection Unless otherwise specified, production boards and/or specially designed test patterns may be used for carrying out tests for the lot-by-lot and the periodic inspection. Where specifi
38、cally designed test patterns shall be used they may be included in the panel. They may be based on the appropriate pattern of the composite test pattern; seeclause8. Consultation between manufacturer and customer will usually be necessary. 4 Relevant specification The term “relevant specification” m
39、eans a product specification for an actual printed board., i.e.a CDS as well as a CapDS applied to a specific material and technique, as applicable. The relevant specification shall contain all information necessary to define the printed board clearly and completely. The recommendations given in IEC
40、326-3 shall preferably be followed. Care should be taken to avoid unnecessary prescription. Permissible deviations should be stated where necessary, nominal values without tolerances or simple maxima or minima shall be given where sufficient. Where tolerances are necessary for certain areas or parts
41、 of the printed board only, they shall be applied and restricted to those areas or parts. If there are several possibilities of presentation of tolerance classes etc., the selections given in IEC326-3 shall preferably be applied. In cases of discrepancy between the CDS and other pertinent specificat
42、ions (e.g.BS, CS, or SS), the CDS shall prevail. 5 Characteristics of the printed board Basic characteristics, seeTable I Additional Characteristics, seeTable IIEN123600:1996 BSI 08-1999 5 Table I Basic characteristics (mandatory assessments) Characteristics Test No. IEC 326-2 Additional Tests Speci
43、men of Composite Test Pattern Requirements Remarks General Examination Visual Examination Conformity and Identification 1 a Complete printed board or composite test pattern Pattern, marking, identification, material and finishes shall comply with the relevant specification. There shall be no apparen
44、t defects. Appearance and Workmanship 1a Complete printed board or composite test pattern The boards shall appear to have been processed in a careful and workmanlike manner, in accordance with good current practice. Plated-through holes Complete printed board or composite test pattern Plated-through
45、 holes shall be clean and free from inclusions of any sort that could affect component insertion and solderability, Total area of the voids shall not exceed 10% of the total wall area. The largest dimension shall not exceed 25% of the hole circumference in the horizontal plane and 25% of the thickne
46、ss of the board in the vertical plane. Plated-through holes shall have no plating voids at the interface of the hole wall and the conductive pattern or internal layer ring. The interface shall be considered to extend into the hole below the surface of the board a distance of 1,5 times the total copp
47、er thickness on the surface or to be two times the inner layer thickness at the level of contact ring. 1c Resin smear at the edge of the clad copper and the continuous plated copper is permitted provided the smear does not interrupt electrical continuity. a see clause 2EN123600:1996 6 BSI 08-1999 Ta
48、ble I Basic characteristics (mandatory assessments) Characteristics Test No. IEC 326-2 Additional Tests Specimen of Composite Test Pattern Requirements Remarks 1a There shall be no circumferential cracks of the copper, or circumferential separation of the copper from the wall of the plated-through h
49、oles Holes with plating voids shall not exceed 5% of the total number of plated-through holes Board Edges Complete printed board or composite test pattern The edges of the board and internal cutouts shall be clean cut without tears or nicks Eyelets Complete printed board or composite test pattern Eyelets shall be firmly secured. Plated eyelets shall not have exposed bare metal. Eyelets shall not have cracked flanges. There shall be no damage to conductors or substrate around the eyelet. Bonding Conductor to Substrate 1a Com
