1、BRITISH STANDARD BS 5909:1980 ISO 4746:1977 Method for Scale adhesion test for oxygen-free copper ISO title: Oxygen-free copperScale adhesion test UDC 669.3.018.52:620.191.32:620.179.4BS5909:1980 This British Standard, having been prepared under the directionof the Non-ferrous Metals Standards Commi
2、ttee, waspublished underthe authorityof the Executive Boardand comes into effect on 30 April 1980 BSI 12-1999 The following BSI references relate to the work on this standard: Committee reference NFE/34 Draft for approval 79/72754 ISBN 0 580 11265 9 Cooperating organizations The Non-ferrous Metals S
3、tandards Committee, under whose direction this British Standard was prepared, consists of representatives from the following Government department and professional and industrial organizations: Aluminium Federation Association of Bronze and Brass Founders British Electrical and Allied Manufacturers
4、Association (BEAMA) British Lead Manufacturers Association British Non-ferrous Metals Federation* Copper Development Association* Electric Cable Makers Confederation* Inco Europe Limited* Institute of British Foundrymen Institution of Mechanical Engineers Institution of Mining and Metallurgy Institu
5、tion of Production Engineers Institution of Structural Engineers International Tin Research Institute Lead Development Association Light Metal Founders Association London Metal Exchange Magnesium Industry Council Ministry of Defence* Non-ferrous Metal Stockists* Royal Institute of British Architects
6、 Society of Motor Manufacturers and Traders Limited Zinc Development Association The organizations marked with an asterisk in the above list, together with the following, were directly represented on the committee entrusted with the preparation of this British Standard: Association of Supervisory an
7、d Executive Engineers BNF Metals Technology Centre Lloyds Register of Shipping London Transport Executive National Coal Board Post Office Telecommunication Engineering and Manufacturing Association (TEMA) Transmission and Distribution Association (BEAMA) Individual expert Amendments issued since pub
8、lication Amd. No. Date of issue CommentsBS5909:1980 BSI 12-1999 i Contents Page Cooperating organizations Inside front cover National foreword ii 0 Introduction 1 1 Scope and field of application 1 2 Principle 1 3 Test pieces 1 4 Preparation of test pieces 1 5 Procedure 1 6 Requirements 1BS5909:1980
9、 ii BSI 12-1999 National foreword This British Standard is identical with ISO 4746:1977 “Oxygen-free copper Scale adhesion test”, and has been approved by the Non-ferrous Metals Standards Committee for publication as a dual numbered British Standard. Terminology and conventions. The text of the Inte
10、rnational Standard has been approved as suitable for publication, without deviation, as a British Standard. Some terminology and certain conventions are not identical with those used in British Standards; attention is especially drawn to the following. Where the words “International Standard” appear
11、, referring to this standard, they should be read as “British Standard”. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer i
12、mmunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, page 1 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the i
13、nside front cover.BS5909:1980 BSI 12-1999 1 0 Introduction The scale adhesion test for copper provides a means of assessing the suitability of oxygen-free copper primarily for use in electronic devices, for applications involving glass-to-metal seals, or other uses relying on the formation and prese
14、nce of an adherent film of copper oxide. 1 Scope and field of application This International Standard specifies a procedure for the scale adhesion testing of oxygen-free high-conductivity copper. 2 Principle Preparation and heating in air of a test piece, followed by rapid cooling in water. Visual e
15、xamination of the cooled test piece for loss of the oxide film or blistering. 3 Test pieces The test pieces shall be either of wire not less than1 mm diameter and not more than 2 mm diameter, or of wrought flat strip of maximum cross-section 2 mm 12 mm. Results from larger wrought or cast test piece
16、s may be accepted if the degree of scale adhesion is satisfactory. 4 Preparation of test pieces Any surface oxidation shall be removed completely. There shall be no surface discontinuity. Inclusions, particularly of copper(I) oxide, shall also be absent. The surface of the test piece should be simil
17、ar to that produced by wet grinding with 400 grade silicon carbide. The test piece shall be degreased, cleaned by dipping in 10% (V/V) sulphuric acid in order to leave a bright clean surface, washed in cold tap water, rinsed in distilled water and dried after rinsing in alcohol or acetone. The test
18、piece shall not be touched by hand between the cleaning and subsequent heating. 5 Procedure Heat the test piece, prepared in accordance with clause4, in air at 850 to 875 C for 30 min and immerse it immediately in cold water. 6 Requirements The test piece, tested in accordance with clause5, shall be
19、 visually examined. The black oxide film shall remain substantially unbroken and firmly adherent to the copper. Slight loss of adherence at the edges of the test piece should be neglected. No blistering or loss of oxide film shall be apparent and the coloration shall be even.BS 5909:1980 ISO 4746:19
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