1、Designation: C 881/C 881M 02Standard Specification forEpoxy-Resin-Base Bonding Systems for Concrete1This standard is issued under the fixed designation C 881/C 881M; the number immediately following the designation indicates the yearof original adoption or, in the case of revision, the year of last
2、revision. A number in parentheses indicates the year of last reapproval.A superscript epsilon (e) indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the Department of Defense.1. Scope1.1 This specification covers two-component,
3、epoxy-resinbonding systems for application to portland-cement concrete,which are able to cure under humid conditions and bond todamp surfaces.1.2 The values stated in either inch-pound units or SI unitsare to be regarded separately as standard. Within the text, theSI units are shown in brackets. The
4、 values stated in eachsystem are not exact equivalents, therefore, each system shallbe used independently of the other. Combining values from thetwo systems may result in nonconformance with this specifi-cation.1.3 This standard does not purport to address all of thesafety concerns, if any, associat
5、ed with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use. For specific hazardsstatements, see Section 9.2. Referenced Documents2.1 ASTM Standards:C 882 Test Meth
6、od for Bond Strength of Epoxy-ResinSystems Used with Concrete by Slant Shear2C 884 Test Method for Thermal Compatibility BetweenConcrete and an Epoxy-Resin Overlay2D 570 Test Method for Water Absorption of Plastics3D 638 Test Method for Tensile Properties of Plastics3D 648 Test Method for Deflection
7、 Temperature of PlasticsUnder Flexural Load3D 695 Test Method for Compressive Properties of RigidPlastics3D 1259 Test Methods for Nonvolatile Content of ResinSolutions4D 1652 Test Method for Epoxy Content of Epoxy Resins5D 2393 Test Method for Viscosity of Epoxy Resins andRelated Compounds6D 2566 Te
8、st Method for Linear Shrinkage of Cured Ther-mosetting Casting Resins During Cure63. Terminology3.1 Definitions of Terms Specific to This Standard:3.1.1 binder, nthe cementitious part of a grout, mortar, orconcrete that binds the aggregate or filler into a cohesive mass.3.1.2 bonding system, nthe pr
9、oduct resulting from thecombination of all the components supplied for use as abonding material.3.1.3 component, na constituent that is intended to becombined with one or more other constituents to form abonding system.3.1.4 contact strength, nbond strength measured by slantshear after a specified c
10、ontact and cure time.3.1.5 contact time, nspecified time between when theepoxy system is applied and when the two segments arebonded together and still achieve a specified bond strengthafter a specified curing time and temperature.3.1.6 curing agent, na substance that causes the conver-sion of a flu
11、id resin system to a solid cured resin by means ofa chemical reaction.3.1.7 epoxy equivalent, nthe weight of resin containingone molecular weight of epoxy groups.3.1.8 epoxy resin, na resin that contains or did containepoxy groups principally responsible for its polymerization.3.1.9 filler, na finel
12、y divided solid, predominantly passingthe No. 200 75-m sieve, that is used to improve certainproperties of the bonding system or to reduce cost.3.1.10 formulator, nthe agency responsible for preparingthe separate components and for recommending the propor-tions to be used in preparing the final bond
13、ing system.3.1.11 lot or batch, nthat quantity of manufactured mate-rial which has been subjected to the same unit chemical orphysical processes intended to make the final product substan-tially uniform.3.1.12 manufacturer, na producer of a basic constituentpart of a component.3.1.13 reactive diluen
14、t, na relatively free flowing liquid1This specification is under the jurisdiction of ASTM Committee C09 onConcrete and Concrete Aggregates, and is the direct responsibility of SubcommitteeC09.25 on Organic Materials for Bonding.Current edition approved July 10, 2002. Published August 2002. Originall
15、ypublished as C 881 78. Last previous edition C 881 99.2Annual Book of ASTM Standards, Vol 04.02.3Annual Book of ASTM Standards, Vol 08.01.4Annual Book of ASTM Standards, Vol 06.01.5Annual Book of ASTM Standards, Vol 06.03.6Annual Book of ASTM Standards, Vol 08.02.1Copyright ASTM International, 100
16、Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.used to reduce the viscosity of the liquid resin or resin mixture,and which contains reactive groups that cause it to become anintegral part of the cured resin.3.1.14 working (pot) life, nthe time after mixing duringwhic
17、h a bonding system or mixture containing it retainssufficient workability for proper use.4. Classification4.1 This specification provides for the classification ofepoxy-resin bonding systems by type, grade, class, and color.4.2 TypesSeven types of systems that are distinguished bythe requirements of
18、 Table 1 are recognized:4.2.1 Type IFor use in non-load bearing application forbonding hardened concrete to hardened concrete and othermaterials, and as a binder in epoxy mortars or epoxy concretes.4.2.2 Type IIFor use in non-load bearing applications forbonding freshly mixed concrete to hardened co
19、ncrete.4.2.3 Type IIIFor use in bonding skid-resistant materialsto hardened concrete and as a binder in epoxy mortars or epoxyconcretes used on traffic bearing surfaces (or surfaces subjectto thermal or mechanical movements).4.2.4 Type IVFor use in load bearing applications forbonding hardened concr
20、ete to hardened concrete and otherTABLE 1 Physical Requirements of Bonding SystemsPropertyTypeI II III IV V VI VIIViscosity, P Pas:Grade 1, max 202.0 202.0 202.0 202.0 202.0 . .Grade 2, min 202.0 202.0 202.0 202.0 202.0 . .max 10010 10010 10010 10010 10010 . .Consistency, inmm:Grade 3, Types I,II, I
21、II, IV, V, VI,VII,max146.0146.0146.0146.0146.0146.0146.0Gel time, minutes,min30 30 30 30 30 30 30Bond strength, min,psi MPa:2 days(moistcure)10007.0 . . 10007.0 . 10007.0 .14 days (moistcure)150010.0 150010.0 150010.0 150010.0 150010.0 . 10007.0Absorption, 24 hmax, %1 1 1 1 1 . .Heat DeflectionTempe
22、rature, min,F C:7 days . . . 12050 12050 . .14 days . . . . . 12050 12050Thermalcompatibility. . passes test . . . .Linear coefficient ofshrinkage oncure,max0.005 0.005 . 0.005 0.005 . .Compressive YieldStrength, min,psiMPa:24 h . . . . . 200014.0 .36 h . . . . . . 10007.048 h . . . . . 600040.0 .72
23、 h . . . . . . 200014.07 days 800055.0 500035.0 . 10 00070.0 800055.0 . .CompressiveModulus, psiMPaMin 150 0001000 90 000600 . 200 0001400 150 0001000 . .Max . . 130 000896 . . . .Tensile Strength, 7days min, psiMPaA500035.0 200014.0 . 700050.0 600040.0 . .Elongation atBreak, %, min1 1 30 1 1 . .Con
24、tact strength,psiMPa min2 days . . . . . 10007.0 .14 days . . . . . . 10007.0ANot required for Viscosity Grade 3 Systems.C 881/C 881M2materials and as a binder for epoxy mortars and concretes.4.2.5 Type VFor use in load bearing applications forbonding freshly mixed concrete to hardened concrete.4.2.
25、6 Type VIFor bonding and sealing segmental precastelements with internal tendons and for span-by-span erectionwhen temporary post tensioning is applied.4.2.7 Type VIIFor use as a nonstress carrying sealer forsegmental precast elements when temporary post tensioning isnot applied as in span-by-span e
26、rection.NOTE 1 Epoxy resin systems will adhere to a wide variety ofmaterials, including wood, metals, masonry, and most plastics. Polyeth-ylene, TFE-fluorocarbon, cellophane, and greased or waxed surfaces areamong the few materials to which these systems will not adhere.4.3 GradesThree grades of sys
27、tems are defined accordingto their flow characteristics and are distinguished by theviscosity and consistency requirements of Table 1.4.3.1 Grade 1Low viscosity.4.3.2 Grade 2Medium viscosity.4.3.3 Grade 3Non-sagging consistency.4.4 ClassesClasses A, B, and C are defined for Types Ithrough V, and Cla
28、sses D, E, and F are defined for Types VIand VII, in accordance with the range of temperatures forwhich they are suitable (Note 2).4.4.1 Class AFor use below 40F 4.0C the lowestallowable temperature to be defined by the manufacturer of theproduct.4.4.2 Class BFor use between 40 and 60F 4.0 and15.0C.
29、4.4.3 Class CFor use above 60F 15.0C the highestallowable temperature to be defined by the manufacturer of theproduct.4.4.4 Class DFor use between 40 and 65F 4.0 and18.0C.4.4.5 Class EFor use between 60 and 80F 15.0 and30.0C.4.4.6 Class FFor use between 75 and 90F 25.0 and30.0C.NOTE 2The temperature
30、 in question is usually that of the surface ofthe hardened concrete to which the bonding system is to be applied. Thistemperature may be considerably different from that of the air. Whereunusual curing rates are desired it is possible to use a class of bondingagent at a temperature other than that f
31、or which it is normally intended.For example, a Class A system will cure rapidly at room temperature.4.5 ColorEpoxy resin systems are normally unpigmented,but they can be colored or darkened. If a specific color isdesired, it should be so stated by the purchaser.5. Ordering Information5.1 The purcha
32、ser shall specify the type, grade, class, andcolor of bonding system desired and the size of units in whichthe components shall be furnished. Special requirements re-garding filling of either the components or the final bondingsystem should be stated. The product furnished under thisspecification is
33、 intended to be resistant to moisture andtherefore should be suitable for either indoor or outdoorexposure.5.2 The purchaser may specify a minimum gel time of 5 minfor Types I and IV when automatic proportioning, mixing, anddispensing equipment are used.6. Materials and Manufacture6.1 The systems co
34、vered by this specification shall befurnished in two components for combining immediately priorto use in accordance with written instructions of the formulator.Component A shall contain an epoxy resin with or without areactive diluent. Component B shall contain one or morecuring agents, which on mix
35、ing with Component A shall causethe mixture to harden. A suitable inert filler may be uniformlyincorporated in one or both components. The filler shall beeither nonsettling or readily dispersible in any component inwhich it is incorporated. All systems shall cure under humidconditions, and bond to d
36、amp surfaces.7. Chemical Composition7.1 The epoxy resin constituent of Component A shall havean epoxy equivalent of 155 to 275.8. Physical Properties8.1 A mixture of Components A and B in the proportionsrecommended by the formulator shall conform to the propertiesprescribed in Table 1.9. Safety Haza
37、rds9.1 Caution: Epoxy resins contain irritants, especially tothe skin, eyes, and respiratory system. Persons handling thesematerials shall use appropriate protective clothing, includingrubber or plastic gloves. If an epoxy resin should contact theskin, it shall be removed immediately with a dry clot
38、h or papertowel, and the area of contact washed thoroughly with soap andwater. Solvents shall not be used, because they carry the irritantinto the skin. Cured epoxy resins are innocuous.10. Sampling10.1 Take a representative sample of each of the twocomponents from a well-blended lot prior to packag
39、ing or bywithdrawing samples from no fewer than 5 % of the containerscomprising the lot or shipment. Unless the samples of the samecomponent taken from containers show visual evidence ofvariability, they may be combined into a single compositesample. In place of the foregoing, packaged materials may
40、 besampled by a random selection of containers of each compo-nent from each lot, provided such a procedure is acceptable tothe purchaser.11. Test Methods11.1 ConsistencyTest Method to Determine The Consis-tency of an Epoxy Resin System.11.1.1 ScopeThis test provides a method for determiningthe consi
41、stency of Grade 3 epoxy resin systems.11.1.2 Significance and UseThis test method is used todetermine compliance with the requirements of the specifica-tion.11.1.3 Apparatus:11.1.3.1 Paper cupApproximately 3 oz. approximately0.100L unwaxed paper cup.11.1.3.2 Mixing bladeOrdinary wooden tongue depres
42、soror stick of similar size.11.1.3.3 Glass panel.C 881/C 881M311.1.4 ConditioningCondition the individual componentsand any equipment with which they will come in contact to thefollowing temperatures: Class A, 32 6 2F 0 6 1C; Class B,50 6 2F 10 6 1C; Class C, 73 6 2F 23 6 1C, Class D,65 6 2F 18 6 1C
43、; Class E, 80 6 2F 276 1C; ClassF, 90 6 2F 32 6 1C or to the temperature at which thematerial will be used (Note 2).11.1.5 ProcedurePrepare approximately 30 cm3of thebonding system. Weigh the necessary amounts of the compo-nents to an accuracy of 1 % into a single 3-oz approximately100-cm3 unwaxed p
44、aper cup. Mix immediately with a woodentongue depressor or stick of similar size. Note the time atwhich mixing begins. Mix for 3 min, taking care to scrape theside and bottom of the cup periodically. Immediately applyabout 2 cm3of the mixture to a glass panel. Form a semicy-lindrical bead of the bon
45、ding system by drawing the applicatorblade through the sample in a straight line with the panelhorizontal. Immediately raise the panel to a position inclined atno greater than 10 from vertical and with the bead horizontal.Maintain the panel and sample at their original temperatureuntil the bonding s
46、ystem has cured, as determined by aninability to indent it appreciably with a pencil point orfingernail. Determine the consistency by measuring the flow ofthe lower edge of the bead from its original position at threepoints along its length.11.1.6 ReportReport the average value to the nearest18in.1
47、mm.11.1.7 Precision and Bias:11.1.7.1 PrecisionThe precision of the procedure in thistest method for consistency is being determined.11.1.7.2 BiasThis test method has no bias since the valuesdetermined can only be defined in terms of this test method.11.2 Gel Time:11.2.1 Test Method to Determine the
48、 Gel Time of an EpoxyResin System.11.2.2 ScopeThis test method determines the time aftermixing when an epoxy resin system gels.11.2.3 Significance and UseThis test method is used todetermine compliance with the requirements of the specifica-tion.11.2.4 Apparatus:11.2.4.1 Paper cup8 oz. approximately
49、 250 cm3 un-waxed paper cup11.2.4.2 Mixing bladeOrdinary wooden tongue depressoror stick of similar size.11.2.5 ConditioningCondition the individual componentsand any equipment with which they will come in contact to thetemperatures set forth in 11.1, depending on the class of systemin question, or to the temperature at which the material
