1、MIL-C-71042 59 = 9999906 0507691 7 I INCH-POUNDS I MIL-C-71042 (AR) 14 Feburaxy 1992 MILITARY SPECIFICATION CIRCUIT CARD ASSEMBLY, LOGIC: 11784523 This specification is approved for use by the U.S. Army Armament, - Munitions and Chemical Command, and is available for use by all Departments and Agenc
2、ies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the requirements, examinations and tests for the Logic Circuit Card Assembly which is a component in the Electronic Control Unit (ECU). The ECU is part of the Target Holding Mechanism/Tank Gunnery (THM/TG). The Logic Cir
3、cuit Card Assembly provides the routing of correct signals within the ECU which controls the various operations of the THM/TG (See 6.1). 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. *he following specifications, standards, and handbooks form a par
4、t of this document to the extent specified herein, Unless-otherwise specified, the issues of these documents shall be those listed in the issue of the Department of Defense Index of Specifications and Standards . (DODISS) and supplement thereto, cited in the solicitation (See 6.2). SPECIFICATIONS MI
5、LITARY MIL-F-13926 - Fire Control Materiel, Manufacture and MIL-1-45607 - Inspection Equipment, Acquisition, Inspection, General Specification for Maintenance and Disposition of Beneficial comments (recomendatioris, additions, deletions) and any pertinent data which may be of use in improving this c
6、kcument should be addressed to: Commander, U.S. Amiy ARDEC, Am. SMCAR-BAGS, RcatinOy Arsenal, New Jersey M86-5000 by using the seif-addressed StandardUation Document improvement Proposai (DD Form 1426) appearing at the end of this document or by letter. AMSC NIA Fsc 5999 IBUTION STATEMENT A Approved
7、 for public release; distribution is unlimited. Licensed by Information Handling ServicesMIL-C-71042 57 777770b 0507672 9 MIL-G-71042 (AR) STANDARDS MIL I TARY MIL-STD-109 - Quality Assurance Terms and Definitions MIL-STD-810 - Environmental Test Methods and Engineering Guidelines (Unless otherwise
8、indicated, copies of federal and military specifications, standards, and handbooks are available from Standardization Documents Order Desk, Bldg. 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.1.2 Other Government documents, drawinqs and publications. The following other Government document
9、s, drawings, and publications form a part of this document to the extent specified herein. Unless otherwise specified, the issues are those cited in the solicitation. DRAWINGS (see 6.4) U.S. ARMY ARMAMENT RESEARCH, DEVELOPMENT AND ENGINEERING CENTER (ARDEC) 11784523 - Circuit Card Assembly, Logic 11
10、784525 - Schematic Diagram, Logic 11785556 - Soldering Requirements for Electrical and Electronic Assemblies (RETS) SPECIAL PACKAGING INSTRUCTIONS PS11784523 - Packaging of Logic Circuit Card (Copies of drawings, publications, and other Government documents required by contractors in connection with
11、 specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Order of precedence. In the event of conflict between the text of this document and the references cited herein the text of this document takes precedence. Nothing in thi
12、s document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Materials. Materials shall be in accordance with the applicable drawings and specifications. Licensed by Information Handling Services. MIL-C-7L042 59 = 9999906 0507693
13、O M MIL-C-71042 (AR) 3.2 Components and assemblies. The components and assemblies shall comply with all requirements specified on Drawing 11784523, all associated drawings, and with all requirements specified in applicable specifications and standards. Where applicable, the Logic Circuit Card Assemb
14、ly shall meet the requirements of MIL-F-13926 as follows: a. Dimensions and tolerances b. Inorganic protective surface finishings c. Part identification and marking d. Workmanship 3.3 Environmental service conditions. 3.3.1 Vibration. The Logic Circuit Card Assembly shall not suffer damage and shall
15、 meet the requirements of 3.4 and 3.6 after exposure to sinusoidal vibrations for 1 hour along the vertical axis within the frequency range of 10 to 40 hertz (Hz). The rate of change of frequency at each frequency range shall not exceed 1 Hz per second, Frequency Ranqe Amp1 i tude 10 to 15 hertz 0.0
16、6 inches double amplitude 15 to 25 hertz 0.04 inches double amplitude 25 to 40 hertz 0.02 inches double amplitude The frequency of vibration shall be swept logarithmically. The cycling time shall be 60 minutes. The sweep rate shall be 3.75 minutes + 10%. The 10-40-10 hertz sweep time is 2 minutes 30
17、 seconds + - 3.3.2 TemDerature. 3.3.2.1 Operating. The Logic Circuit Card Assembly shall meet the requirements of 3.4 and 3.6 when stabilized thermally at any temperature between -25 degrees F and + 125 degrees F. Assembly shall not suffer permanent damage when subjected to the constant temperature
18、extremes of -40 degrees F for a period of 4 hours and +160 degrees F for a period of 4 hours (after temperature stabilization), and shall meet the requirements of 3.4 and 3.6 when returned to room ambient. 3.3.2.2 Non-operating (storaqe). The Logic Circuit Card 3.4 Electrical. The electrical charact
19、eristics and continuity of the Logic Circuit Card Assembly shall be as specified on the Logic Schematic Diagram drawing 11784525. for the performance requirements of 3.6 and performance testing of 4.7.3. Refer to this schematic diagram 3.5 Circuit identification. The contact fingers (Pins) of the Ci
20、rcuit Board shall have adequate permanent labeling for proper identification of Pins in the circuitry. 0 3 Licensed by Information Handling ServicesMIL-C-71042 59 999990b 0507674 2 I MIL-C-71042 (AR) 3.6 Performance. 3.6.1 Functional description. The Logic Circuit Card Assembly provides the routing
21、of signals received by the Electronic Control Unit (ECU) of the Target Holding Mechanism/Tank Gunnery (THM/TG) to control the desired position of the Target. The Logic Circuit Card Assembly provides the necessary voltage to the Target Lifting Mechanism, and introduces delays which allow target to ra
22、ise and lower in accordance with the function switch setting of the ECU. 3.6.2 Supply voltaqe. The Logic Circuit Card Assembly shall operate when +12 Volt.Direct Current (Vdc) is connected to contact Pin Z, and power supply return Ground (GND) to contact Pin A. 36.3 Raise tarqet mode. With + 12 Vdc
23、applied at contact pin E the following voltages shall be present: Pin N +1.5 Vdc Max Pin M +0.75 Vdc Max With Pin P shorted to GND and contact Pin C open the following voltages shall be present: Pin N +12 2 0.1 vdc Pin M +12 2 0.1 Vdc 3.6.4 Lower tarqet mode. With + 12 vdc applied at contact pin K t
24、he following voltages shall be present: Pin N +1.5 Vdc Max Pin R +1.5 Vdc Max With Pin C shorted to GND and contact Pin P open the following voltages shall be present: Pin N Pin R +12 2 0.1 Vdc +12 k 0.1 Vdc 3.6.5 Lifting mechanism failure. with 12 Vdc applied at contact pin E, the following voltage
25、s shall be present after 11 t 2 seconds : Pin N +1.5 vdc Max Pin M +0.75 Vdc Max When +12 Vdc is applied at contact Pin K, and after 11 i 2 seconds the following voltages shall be present: Pin N +12 2 0.1 vdc Pin R +12 2 0.1 Vdc 4 Licensed by Information Handling Services. MIL-C-71042 59 m 9997906 0
26、507b95 4 m MIL-C-71042 (AR) 3.6.6 Bad hit sensor test. This requirement simulates short and open crystal conditions. with the circuit card in the condition of 3.5.2 and 3.5.3, and contact Pin V shorted to GND, the following voltages shall be present: Pin N +12 + 0.1 Vdc Pin R +i2 T - 0.1 Vdc 3.6.7 R
27、aisinq target mode with simulated bad crystal. With the circuit card in the initial conditions of 3.5.2 and 3.5.3. The following voltages shall be present: Pin N +12 + 0.1 Vdc Pin M +12 i 0.1 Vdc 3.6.8 Function switch test. with +12 Vdc applied to contact Pin Z, contact Pin V shall be open (floating
28、), contact Pin P shall be shorted to GND, and contact Pin C shall be open. 3.6.8.1 Function switch in position 1 (simulated). With the circuit card set as in 3.6.8, perform the following steps and obtain the required results: a. When +12 Vdc is applied at contact Pin E, Voltage at Pin B b. shall be
29、+1.0 mvdc Max When a pulse of +12 Vdc amplitude and 1.0 ms pulse width is applied at contact Pin X, the following voltages shall be present: Pin B +11.6 vdc Min Pin N +12 L 0.1 Vdc Pin M +i2 + 0.1 Vdc c. when a pulse of +12 vdc amplitude and 1.0 ms pulse width is applied at contact pin X, the pulse
30、at Pin Y shall be +12 Vdc amplitude with a duration of 39 25 ms. when a pulse of +12 Vdc amplitude and 1.0 ms pulse width is applied at contact pin X, the pulse at Pin U shall be +12 Vdc amplitude with a duration of 3.5 - + .5 ms, d. 3.6.8.2 Function switch in position 2 (simulated). With the circui
31、t card set as in 3.6.8, perform the following steps and obtain the required results: a. Short contact Pin S to GND, apply +12 Vdc at contact Pin E. When a pulse of +12 Vdc amplitude and 1.0 ms pulse width is applied at contact Pin X, the following voltages shall be present: +11.6 Vdc Min after 11 +
32、2 Secs Pin B Pin N +12 + 0.1 Vdc Pin R +12 T - 0.1 Vdc - 5 Licensed by Information Handling ServicesMIL-C-71042 59 9999906 0507696 6 I MIL-C-71042 (AR) b. Short contact Pin J to GND. pin X, the following voltages shall be present: Pin B +1.0 mvdc Max Pin N +12 2 0.1 vdc Pin R +12 2 0.1 vdc Pin M +12
33、 0.1 Vdc When +12 Vdc pulse is applied at 3.6.8.3 Function switch in position 3 (simulated). With the circuit card set as in 3.6.8, contact pin S open and contact Pin L shorted to GND, apply the +12 Vdc pulse at Pin X. the sequence of events at Pins R, N, M, B, X, C, and P, which shall be Observe an
34、d record in accordance with Figure 1. 3.7 Soldering. The circuit board shall be soldered per the requirements of 11785556. 3.8 First article. When specified in the contract or purchase order, sample shall be subjected to first article inspection in accordance with the technical provisions herein (Se
35、e 4.2). 4. QUALITY ASSURANCE PROVISIONS 4,l Responsibility for inspection. Unless otherwise specified in the contract or purchase order, the contractor is responsible for the performance of all inspection requirements (examinations and tests) as specified herein. Except as otherwise specified in the
36、 contract or purchase order, the contractor may use his own or any other facilities suitable for the performance of the inspection requirements specified herein, unless disapproved by the Government. The Government reserves the right to perform any of the inspections set forth in this specification
37、where such inspections are deemed necessary to ensure supplies and services conform to prescribed requirements. 6 Licensed by Information Handling Services. I I I I izv PIN X 8v MIL-C-71042 59 9999906 0507697 - MIL-C-71042 (AR) I I l l I I I I I I I I I I l I I 1 I I l I I I I l I I I I I I I I l I
38、I t 1 I I I I PIW R 1.N- I I r l I l l I I I l I 1 I I I I I m I I I I I I I I I J I 1 PIN c Bo f I l I I I I I I 1 1% I I I I I I I I I ml i l PIN n i,m- I I I I I I I I I I I I I I I I I I c I I I f) I I l I I I I l I I 1 I. I I I I 2rwc ; l I I I I I I I I I I Figure 1. Voltaqe Outputs per Paragr
39、aph 3.6.8.3 7 I Licensed by Information Handling ServicesMIL-C-7L042 59 9997906 O507698 T m MIL-C-71042 (AR) . 4.1.1 Responsibility for compliance. All items must ml-t all requirements of sections 3 and 5. specification shall become a part of the contractors overall inspection system or quality prog
40、ram. requirements in the specification shall not relieve the contractor of the responsibility of ensuring that all products or supplies submitted to the Government for acceptance comply with all requirements of the contract. Sampling inspection, as part of manufacturing operations, is an acceptable
41、practice to ascertain conformance to requirements, however, this does not authorize submission of known defective material, either indicated or actual, nor does it commit the Government to accept defective material. The inspections set forth in this The absence of any inspection 4.1.2 General provis
42、ions. The component and subassembly inspection requirements of MIL-F-13926 form a part of the quality assurance provisions of this specification. to MIL-STD-109 to define quality assurance terms used herein. Reference shall be made 4.2 Ciassification of inspections. The inspection requirements speci
43、fied herein are classified as follows: a. First article inspection (see 4.3). b. c. Quality conformance inspection (see 4.4). Special sampling inspection (see 4.5). ambient conditions: a. Temperature +60 deg to +90 deg F. b. Relative humidity 90% RH Max. c. Pressure 28 to 32 inches of Hg. 4.3 First
44、article inspection. 4.3.1 First article submission. The contractor shall submit a first article sample as designated by the contracting officer consisting of three (3) in accordance with 4.3.2. Logic Circuit Card Assemblies for inspection 4.3.2 Inspections to be performed. First article assemblies,
45、components and test specimens may be subjected by the Government to any or all of the examinations and tests specified in Table I (Functional test) and Table II (Special Sampling) herein and to any or all requirements of the applicable drawings. 8 Licensed by Information Handling ServicesMIL-C-71042
46、 (AR) 4.3.3 Rejection. If any assembly, component or test specimen fails to comply with any of the applicable requirements, the first article sample shall be rejected. The Government reserves the right to terminate its inspection upon any failure of any assembly, component or test specimen to comply
47、 with any of the stated requirements. 4.4 Quality conformance inspection. 4.4.1 Inspection lot formation. The term Itinspection lot1 is defined as a homogeneous collection of units of product from which a representative sample is drawn or which is inspected 100 percent to determine conformance with
48、applicable requirements. Units of product selected for inspection shall represent only the inspection lot from which they are drawn and shall not be construed to represent any prior or subsequent quantities presented for inspection. Homogeneity shall be considered to exist provided the inspection lo
49、t has been produced by one manufacturer, in one unchanged process, using the same materials and methods, in accordance with the same drawings, same drawing revisions, same specifications and same specification revisions. All material submitted for inspection in accordance with this specification shall comply with the homogeneity criteria specified herein, regardless of the type of inspection procedure which is being applied to determine conformance with requirements. 4.4.2 Examinations and tests. 4.4.2.1 Components, assemblies and subassemblies. a. The contractors quality program
