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    ANSI ATIS 0600020-2014 Test Requirements for Pb-Free Circuit Packs.pdf

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    ANSI ATIS 0600020-2014 Test Requirements for Pb-Free Circuit Packs.pdf

    1、 AMERICAN NATIONAL STANDARD FOR TELECOMMUNICATIONS ATIS-0600020.2014 Test Requirements for Pb-free Circuit Packs As a leading technology and solutions development organization, ATIS brings together the top global ICT companies to advance the industrys most-pressing business priorities. Through ATIS

    2、committees and forums, nearly 200 companies address cloud services, device solutions, emergency services, M2M communications, cyber security, ehealth, network evolution, quality of service, billing support, operations, and more. These priorities follow a fast-track development lifecycle from design

    3、and innovation through solutions that include standards, specifications, requirements, business use cases, software toolkits, and interoperability testing. ATIS is accredited by the American National Standards Institute (ANSI). ATIS is the North American Organizational Partner for the 3rd Generation

    4、 Partnership Project (3GPP), a founding Partner of oneM2M, a member and major U.S. contributor to the International Telecommunication Union (ITU) Radio and Telecommunications sectors, and a member of the Inter-American Telecommunication Commission (CITEL). For more information, visit. AMERICAN NATIO

    5、NAL STANDARD Approval of an American National Standard requires review by ANSI that the requirements for due process, consensus, and other criteria for approval have been met by the standards developer. Consensus is established when, in the judgment of the ANSI Board of Standards Review, substantial

    6、 agreement has been reached by directly and materially affected interests. Substantial agreement means much more than a simple majority, but not necessarily unanimity. Consensus requires that all views and objections be considered, and that a concerted effort be made towards their resolution. The us

    7、e of American National Standards is completely voluntary; their existence does not in any respect preclude anyone, whether he has approved the standards or not, from manufacturing, marketing, purchasing, or using products, processes, or procedures not conforming to the standards. The American Nation

    8、al Standards Institute does not develop standards and will in no circumstances give an interpretation of any American National Standard. Moreover, no person shall have the right or authority to issue an interpretation of an American National Standard in the name of the American National Standards In

    9、stitute. Requests for interpretations should be addressed to the secretariat or sponsor whose name appears on the title page of this standard. CAUTION NOTICE: This American National Standard may be revised or withdrawn at any time. The procedures of the American National Standards Institute require

    10、that action be taken periodically to reaffirm, revise, or withdraw this standard. Purchasers of American National Standards may receive current information on all standards by calling or writing the American National Standards Institute. Notice of Disclaimer for example, a Flip Chip BGA component wi

    11、th SnPb bumps and SnAgCu balls can be referred to as either RoHS5 or RoHS6. 3.1.2 Pb-free assemblies: Defined as an assembly which is built with Pb-free solder, Pb-free components, and Pb-free processes. 3.2 Acronyms, Abbreviations, if it is somewhere betweenthese, round to the nearest categoryPCB s

    12、ize Long axis does not increase by more than 4“PCB Laminate No categorical change (e.g. hi-temp FR-4 to polyimide, etc.)Component types e.g. BGA, QFN, large ceramic parts (1) Largest BGA dimensions do not increase by more than 10mm in x or y(2) BGA pitch no less than 1.0mm (unless tested previously

    13、on otherwise similar board)(3) BGA substrate and attachment form do not change (e.g. BT to ceramic, ball to column) (4) No newly added ceramic parts (caps, resistors, fuses) with a dimension 0.250“; no qty increase by more than 5 of such parts(5) No increase in QFN package size by more than 4mm2, no

    14、 decrease in pitch, or increase in die/package ratio for packages larger than 5mm x 5mmNumber of PCBs No increaseNOTES: 1) All of the exception conditions must be met to waive testing2) If a product meets the criteria above, but the previously tested product was tested to indoor conditions and the new product is for outdoor use, it must be tested to outdoor conditions


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