1、MIL-HDBK-ZLiF CHG NOTICE 2 7777770 OL770Lb L4T I NOT MEASUREMENT SENSITIVE 1 MIL-HDBK-217F _ 2 DECEMBER 1991 SUPERSEDING MIL-HDBK-217E, Notice 1 2 January 1990 MILITARY HANDBOOK RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT THIS HANDBOOK IS FOR GUIDANCE ONLY - DO NOT CITE THIS DOCUMENT AS A REQUIRE
2、MENT AMSC NIA DISTRIBUTION STATEMENT A: Approved for public release: distribution unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- MIL-HDBK-IJF CHG NOTICE 2 = 9999970 0177014 377 NOTICE OF CHANGE NOT MEASUREMENT THIS HANDBOOK IS FOR GUIDAN
3、CE ONLY - MIL-HDBK-217F DO NOT CITE THIS DOCUMENT AS A REQUIREMENT NOTICE 2 28 February 1995 MILITARY HANDBOOK RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT To all holders of MIL-HDBK-217F 1. The following pages of MIL-HDBK917F have been revised and supersede the pages listed. Provided by IHSNot fo
4、r ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-IJF CHG NOTICE 2 = 9999970 Ol1970I1.5 203 9 MIL-HDBK-217F NOTICE 2 2. Retain the pages of this notice and insert before the Table of Contents. 3. Holders of MIL-HDBK-217F will verify that page changes and additions
5、 indicated have been entered. The notice pages will be retained as a check sheet. The issuance, together with appended pages, is a separate publication. Each notice is to be retained by stocking points until the military handbook is revised or canceled. Custodians: Army - CR Navy - EC Air Force - 17
6、 Review Activities: Army - MI, AV, ER Navy - SH, AS, OS Air Force - 11, 13, 15, 19, 99 Army - AT, ME, GL Navy - CG, MC, YD, TD Air Force - 85 Preparing Activity: Air Force - 17 Project No. RELI-O074 AMSC NIA DISTRIBUTION STATEMENT A: Approved for public release; distribution unlimited. FSC RELI 2 Pr
7、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I - i t HIL-HDBK-ZI7F NOTICE I RE H 9999770 007b088 b NOTICE OF CHANGE NOT MEASUREMENT SENSITIVE MIL-HDBK-217F NOTICE 1 10 JULY 1992 MILITARY HANDBOOK RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT To all
8、 holders of MIL-HDBK-217F 1. The following pages of MIL-HDBK-217F have been revised and supersede the pages listed. New Page(s) vi 5-3 5-4 5-7 5-8 5-9 5-1 O 5-1 1 5-1 2 5-1 3 5-1 4 5-1 9 5-20 6-1 5 6-1 6 7- 1 7-2 12-3 12-4 A- 1 A-2 A-3 A-4 A-5 A-6 A-7 A-8 A-9 A-1 O A-11 A-12 A-13 A-14 A-15 A-16 AMSC
9、 N/A Date 2 December 1991 2 December 1991 2 December 1991 2 December 1991 2 December 1991 2 December 1991 2 December 1991 2 December 1991 2 December 1991 2 December 1991 2 December 1991 2 December 1991 2 December 1991 Superseded Page(s) vi i 5-3 5-4 5-7 5-8 5-9 5-1 O 5-1 1 5-1 2 5-1 3 5-1 4 5-1 9 5-
10、20 6-1 5 6-1 6 7- 1 7-2 12-3 12-4 A- 1 A-2 A-3 A-4 A-5 A-6 A-7 A-8 A-9 A-1 O A-1 1 A-12 A-13 A-14 A-15 A-l6 Date 2 December 199 1 2 December 1991 2 December 1991 2 December 1991 Reprinted without change 2 December 1991 Reprinted without change Reprinted without change 2 December 1991 2 December 1991
11、 Reprinted without change 2 December 1991 Reprinted without change 2 December 1991 Reprinted without change Reprinted without change 2 December 1991 2 December 1991 Reprinted without change Reprinted without change 2 December 1991 2 December 1991 Reprinted without change 2 December 1991 2 December 1
12、991 2 December 1991 2 December 1991 2 December 1991 Reprinted without change Reprinted without change 2 December 1991 2 December 1991 2 December 1991 Reprinted without change 2 December 1991 1: Approved for public release; distribution unlimited. Provided by IHSNot for ResaleNo reproduction or netwo
13、rking permitted without license from IHS-,-,- MIL-HDBK-2L7F NOTICE L RE 9399970 O076089 8 MIL-HDBK-217F NOTICE 1 2. Retain the pages of this notice and insert before the Table of Contents. 3. Holders of MIL-HDBK-217F will verify that page changes and additions indicated have been entered. The notice
14、 pages will be retained as a check sheet. The issuance, together with appended pages, is a separate publication. Each notice is to be retained by stocking points until the military handbook is revised or canceled. Custodians: Army - CR Navy - EC Air Force - 17 Review Activities: Army - MI, AV, ER Na
15、vy - SH, AS, OS Air Force - 11, 13, 14, 15, 18, 19,99 User Activities: Army - AT, ME, GL Navy - CG, MC, YD, TD Air Force - 85 Preparing Activity: Air Force - 17 Project No. RELI-O068 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-HIL-HDBK-217F CH6
16、 NOTICE 2 9999770 OL73OL7 086 m MIL-HDBK-217F DEPARTMENT OF DEFENSE WASHINGTON DC 20301 RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT 1. This standardization handbook was developed by the Department of Defense with the assistance of the military departments, federal agencies, and industry. 2. Every
17、 effort has been made to reflect the latest information on reliability prediction procedures. It is the intent to review this handbook periodically to ensure its completeness and currency. 3. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in im
18、proving this document should be addressed to: Rome Laboratory/ERSR, Attn: Seymour F. Morris, 525 Brooks Rd., Griffiss AFB, NY 13441-4505, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. II Provided by IHSNot
19、 for ResaleNo reproduction or networking permitted without license from IHS-,-,-NIL-HDBK-217F CHG NOTICE 2 9999970 OL93OLB TL2 MIL-HDBK-217F TABLE OF CONTENTS SECTION 1: SCOPE 1 . 1 Purpose . 1.2 Application . 1.3 Computerized Reliability Prediction . SECTION 2: REFERENCE DOCUMENTS . SECTION 3: INTR
20、ODUCTION 3.1 Reliability Engineering 3.2 The Role of Reliability Prediction 3.3 Limitations of Reliability Predictions 3.4 Part Stress Analysis Prediction SECTION 4: RELIABILITY ANALYSIS EVALUATION . SECTION 5: MICROCIRCUITS. INTRODUCTION . 5.1 Gate/Logic Arrays and Microprocessors 5.2 Memories . 5.
21、3 VHSlCNHSlC Like 5.4 GaAs MMlC and Digital Devices 5.5 Hybrids 5.6 SAW Devices . 5.7 Magnetic Bubble Memories . 5.8 X.T Table for All 5.9 C2 Table for All . 5.1 O XE, xL and X.Q Tables for All 5.1 1 TJ Determination. (All Except Hybrids) 5.1 2 TJ Determination, (For Hybrids) 5.13 Examples . SECTION
22、 6: DISCRETE SEMICONDUCTORS 6.0 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 6.1 1 6.1 2 6.1 3 6.1 4 6.15 Discrete Semiconductors. Introduction Diodes. Low Frequency Diodes. High Frequency (Microwave. RF) . Transistors. Low Frequency. Bipolar Transistors. Low Frequency. Si FET . Transistors, Unijunction
23、 . Transistors, Low Noise, High Frequency, Bipolar Transistors, High Power, High Frequency, Bipolar . Transistors, High Frequency, GaAs FET . Transistors, High Frequency, Si FET Thyristors and SCRs . Optoelectronics, Detectors, Isolators, Emitters . Optoelectronics, Alphanumeric Displays Optoelectro
24、nics, Laser Diode TJ Determination Example . 1-1 1-1 1-1 2-1 3-1 3-1 3-2 3-2 4-1 5-1 5-3 5-4 5-7 5-8 5-9 5-10 5-11 5-13 5-14 5-15 5-17 5-18 5-20 6-1 6-2 6-4 6-6 6-8 6-9 6-10 6-12 6-14 6-16 6-17 6-19 6-20 6-21 6-23 6-25 . 111 Provided by IHSNot for ResaleNo reproduction or networking permitted withou
25、t license from IHS-,-,-MIL-HDBK-217F CHG NOTICE 2 9999970 OL970L9 959 MIL-HDBK-217F NOTICE 2 TABLE OF CONTENTS SECTION 7: TUBES 7.1 All Types Except TWT and Magnetron 7.2 Traveling Wave . 7.3 Magnetron . SECTION 8: LASERS 8.0 Introduction . 8.1 Helium and Argon 8.2 Carbon Dioxide. Sealed . 8.3 Carbo
26、n Dioxide. Flowing . 8.4 Solid State. ND:YAG and Ruby Rod SECTION 9: RESISTORS 9.1 Resistors . SECTION 10: CAPACITORS 10.1 Capacitors . 10.2 Capacitors. Example SECTION 11 : INDUCTIVE DEVICES 11.1 Transformers . 11.2 Coils . 11.3 Determination of Hot Spot Temperature SECTION 12: ROTATING DEVICES 12.
27、1 Motors 12.2 Synchros and Resolvers 12.3 Elapsed Time Meters SECTION 13: RELAYS 13.1 Mechanical . 13.2 Solid State and Time Delay . SECTION 14: SWITCHES 14.1 Switches 14.2 Circuit Breakers . SECTION 15: CONNECTORS 15.1 Connectors. General 15.2 Connectors, Sockets . SECTION 16: INTERCONNECTION ASSEM
28、BLIES 16.1 Interconnection Assemblies with Plated Through Holes 16.2 Interconnection Assemblies, Surface Mount Technology . SECTION 17: CONNECTIONS 17.1 Connections SECTION 18: METERS 18.1 Meters. Panel . SECTION 19: QUARTZ CRYSTALS 19.1 Quartz Crystals 7-1 7-3 7-4 8-1 8-2 8-3 8-4 8-5 9-1 10-1 10-6
29、11-1 11-3 11-4 12-1 12-4 12-5 13-1 13-3 14-1 14-2 15-1 15-3 16-1 16-2 17-1 18-1 19-1 v Supersedes page iv of Revision F Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NIL-HDBK-2L7F CHG NOTICE 2 9999970 0177020 b70 m MIL-HDBK-217F NOTICE 2 TABLE OF C
30、ONTENTS SECTION 20: LAMPS 20.1 Lamps . SECTION 21 : ELECTRONIC FILTERS 21 . 1 Electronic Filters. Non-Tunable SECTION 22: FUSES 22.1 Fuses . SECTION 23: MISCELLANEOUS PARTS 23.1 Miscellaneous Parts APPENDIX A: PARTS COUNT RELIABILITY PREDICTION APPENDIX B: VHSICNHSIC-LIKE AND VLSl CMOS (DETAILED MOD
31、EL) APPENDIX C: BIBLIOGRAPHY . LIST OF TABLES Table 3-1 : Parts with Multi-Level Quality Specifications Table 3-2: Environmental Symbol and Description Table 4-1 : Reliability Analysis Checklist . Table 6-1 : Default Case Temperatures for All Environments (“C) Table 6-2: Approximate Thermal Resistan
32、ce for Semiconductor Devices in Various Package Sizes LIST OF FIGURES Figure 5-1 : Cross Sectional View of a Hybrid with a Single Multi-Layered Substrate Figure 8-1 : Examples of Active Optical Surfaces 20-1 21-1 22-1 23-1 A- 1 B-1 c-1 3-3 3-4 4-1 6-23 6-24 5-18 8-1 Supersedes page v of Revision F V
33、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-217F CHG NOTICE 2 = 7799770 O377022 443 MIL-HDBK-217F NOTICE 2 FOREWORD 1.0 THIS HANDBOOK IS FOR GUIDANCE ONLY. THIS HANDBOOK SHALL NOT BE CITED AS A REQUIREMENT. IF IT IS, THE CONTRACTOR DOES
34、 NOT HAVE TO COMPLY. MIL-HDBK-217F, Notice 2 provides the following changes based upon a recently completed study (see Ref. 37 listed in Appendix C): Revised resistor and capacitor models, including new models to address chip devices. Updated failure rate models for transformers, coils, motors, rela
35、ys, switches, circuit breakers, connectors, printed circuit boards (with and without surface mount technology) and connections. A new model to address surface mounted technology solder connections. 9 A revised Traveling Wave Tube model based upon data supplied by the Electronic Industries Associatio
36、n Microwave Tube Division. This further lowers the calculated failure rates beyond the earlier modifications made in the base document (MIL-HDBK-217F, 2 December 1991). Revised the Fast Recovery Power Rectifier base failure rate downward based on a reevaluation of Ref. 28. 2.0 MIL-HDBK-217F, Notice
37、1, (10 July 1992) was issued to correct minor typographical errors in the basic F Revision. 3 .O MIL-HDBK-217F, (base document), (2 December 1991) provided the following changes based upon recently completed studies (see Ref. 30 and 32 listed in Appendix C): 1. New failure rate prediction models are
38、 provided for the following nine major classes of microcircuits: Monolithic Bipolar Digital and Linear Gate/Logic Array Devices Monolithic MOS Digital and Linear Gate/Logic Array Devices Monolithic Bipolar and MOS Digital Microprocessor Devices (including Controllers) Monolithic Bipolar and MOS Memo
39、ry Devices Monolithic GaAs Digital Devices Monolithic GaAs MMlC Devices Hybrid Microcircuits Magnetic Bubble Memories Surface Acoustic Wave Devices The 2 December 1991 revision provided new prediction models for bipolar and MOS microcircuits with gate counts up to 60,000, linear microcircuits with u
40、p to 3000 transistors, bipolar and MOS digital microprocessor and co-processors up to 32 bits, memory devices with up to 1 million bits, GaAs monolithic microwave integrated circuits (“ICs) with up to 1,000 active elements, and GaAs digital ICs with up to 10,000 transistors. The C, factors have been
41、 extensively revised to reflect new technology devices with improved reliability, and the activation energies representing the temperature sensitivity of the dice (7) have been changed for MOS devices and for memories. The Supersedes page vi of Revision F, Notice 1 vi Provided by IHSNot for ResaleNo
42、 reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-217F CHG NOTICE 2 W 9999970 0397023 38T MIL-HDBK-217F NOTICE 2 FOREWORD C2 factor remains unchanged from the previous Handbook version, but includes pin grid arrays and surface mount packages using the same model as hermetic
43、, solder-sealed dual in-line packages. New values have been included for the quality factor (xa), the learning factor (xL), and the environmental factor (xE). The model for hybrid microcircuits has been revised to be simpler to use, to delete the temperature dependence of the seal and interconnect f
44、ailure rate contributions, and to provide a method of calculating chip junction temperatures. 2. A new model for Very High Speed Integrated Circuits (VHSICNHSIC Like) and Very Large Scale Integration (VLSI) devices (gate counts above 60,000). 3. The reformatting of the entire handbook to make it eas
45、ier to use. 4. A reduction in the number of environmental factors (XE) from 27 to 14. 5. A revised failure rate model for Network Resistors. 6. Revised models for TWTs and Klystrons based on data supplied by the Electronic Industries Association Microwave Tube Division. viii New Page Provided by IHS
46、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-217F CHG NOTICE 2 7777770 0197024 216 MIL-HDBK-217F NOTICE 2 1.1 Purpose - This handbook is for guidance only and shall not be cited as a requirement. If it is, the contractor does not have to comply (see Pag
47、e 1-2). T h e purpose of this handbook is to establish and maintain consistent and uniform methods for estimating the inherent reliability (Le., the reliability of a mature design) of military electronic equipment and systems. It provides a common basis for reliability predictions during acquisition
48、 programs for military electronic systems and equipment. It also establishes a common basis for comparing and evaluating reliability predictions of related or competitive designs. The handbook is intended to be used as a tool to increase the reliability of the equipment being designed. 1 .2 Applicat
49、ion - This handbook contains two methods of reliability prediction - “Part Stress Analysis“ in Sections 5 through 23 and “Parts Count“ in Appendix A. These methods vary in degree of information needed to apply them. The Part Stress Analysis Method requires a greater amount of detailed information and is applicable during the lat
