1、BRITISH STANDARD BS QC 760200: 1997 IEC 60748-22: 1997 Harmonized system of quality assessment for electronic components Semiconductor devices Integratedcircuits Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedure
2、s ICS 31.200BSQC760200:1997 This British Standard, having been prepared under the directionof the Electrotechnical Sector Board, was published underthe authority of the Standards Board and comesintoeffect on 15August1997 BSI 10-1999 ISBN 0 580 28005 5 National foreword This British Standard reproduc
3、es verbatim IEC60748-22:1997 and implements it as the UK national standard. It supersedes BSQC760200:1992 which is withdrawn. This standard is a harmonized specification within the IEC system of quality assessment for electronic components (IECQ). The UK participation in its preparation was entruste
4、d by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/1, Film and hybrid integrated circuits, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for cha
5、nge, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this subcommittee can be obtained on request to its secretary. The standard is to be used in conjunction with BSQC760000. The British
6、 Standard which implements the IECQ Rules of Procedure is BS9000 General Requirements for a system for electronic components of assessed quality Part 3:1996 Specification for the national implementation of the IECQ system. From 1 January1997, all IEC publications have the number60000 added to the ol
7、d number. For instance, IEC27-1 has been renumbered as IEC60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references The British Standards which implement international or European publications
8、 referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of
9、a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, theIECtitlepage, page ii,
10、 pages1 to46 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date CommentsBSQC760200:1997 BSI 10-1999 i Contents Page
11、National foreword Inside front cover Text of IEC 60748-22 1ii blankBSQC760200:1997 ii BSI 10-1999 Contents Page 1 Scope and object 1 2 General, preferred characteristics, ratings and severities for environmental tests 1 2.1 Normative references 1 2.2 Preferred ratings and characteristics 1 2.3 Infor
12、mation to be given in a detail specification 2 3 Capability approval procedures 3 3.1 Selection of capability qualifying circuits (CQCs) 3 3.2 Structural similarity 3 3.3 Capability approval 4 3.4 Resubmission of rejected lots (lot-by-lot inspection) 10 3.5 Manufacturing stages in a factory of an ap
13、proved manufacturer in a non-IEC member country 10 4 Test and measurement procedures 10 5 Tables for method B 11 Annex A (normative) Structural similarity rules for capability approval 17 Annex B (normative) Minimum contents of a manufacturers capability manual for thick film circuits 32 Annex C (no
14、rmative) Minimum contents of a manufacturers capability manual for thin film circuits 39 Table 1 Test schedule for capability approval for method A 5 Table 2 Assessment levels and acceptance criteria for capability approvalformethod A 7 Table 3 Assessment levels and acceptance criteria for quality c
15、onformanceinspection for method A 8 Table 4 Screening 10 Table 5 Test schedule for capability approval for method B 11 Table 6 Assessment levels and acceptance criteria for capability approvalformethod B 13 Table 7 Assessment levels and acceptance criteria for quality conformanceinspection for metho
16、d B 14 Table A.1 Classification of technology, materials and processes 20 Table A.2 Substrates 22 Table A.3 Film materials 22 Table A.4 Added non-encapsulated active chip components 23 Table A.5 Added encapsulated active component other than chips 24 Table A.6 Added passive components 24 Table A.7 P
17、ackaging 25 Table A.8 Mass and dimensions of package 25 Table A.9 Limits of association in relation with mass and dimensions 26 Table A.10 Combination of criteria for environmental, including mechanical, testing 26BSQC760200:1997 BSI 10-1999 1 1 Scope and object This sectional specification applies
18、to film integrated circuits and hybrid film integrated circuits manufactured as catalogue circuits or as custom-built circuits whose quality is assessed on the basis of capability approval. The object of this specification is to present preferred values for ratings and characteristics, to select fro
19、m the generic specification the appropriate tests and measuring methods, and to give general performance requirements to be used in detail specifications for film integrated circuits and hybrid film integrated circuits derived from this specification. The concept of preferred values is directly appl
20、icable to catalogue circuits but does not necessarily apply to custom built circuits. Test severities and requirements prescribed in detail specifications referring to this sectional specification are of equal or higher performance level, since lower performance levels are not permitted. Associated
21、with this specification are one or more blank detail specifications, each referenced by an IEC number. A blank detail specification which has been completed as specified in2.3 of this specification, forms a detail specification. Such detail specifications are used for the acceptance of a complete ci
22、rcuit, and the granting of capability approval for the boundaries of capability identified by the manufacturer in his capability manual and maintenance of capability approval in accordance with the IECQ system. NOTEFor test procedures two alternatives are available: Method A or method B; however, it
23、 is not permitted to change the methods between tests of method A, respectively B. In general, method A is more suitable for passive component based film integrated circuits, whereas method B is more applicable to semiconductor integrated circuit technology based film integrated circuits. 2 General,
24、 preferred characteristics, ratings and severities for environmental tests 2.1 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC60748. At the time of publication, the editions indicated were vali
25、d. All normative documents are subject to revision, and parties to agreements based on this part of IEC60748 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. Members of IEC and ISO maintain registers of currently valid Int
26、ernational Standards. IEC 60063:1963, Preferred number series for resistors and capacitors. IEC 60068-1:1988, Environmental testing Part 1: General and guidance. IEC 60440:1973, Method of measurement of non-linearity in resistors. IEC 60748-20:1988, Semiconductor devices Integrated circuits Part20:
27、Generic specification for film integrated circuits and hybrid film integrated circuits. IEC 60748-20-1:1994, Semiconductor devices Integrated circuits Part20: Generic specification for film integrated circuits and hybrid film integrated circuits Section1: Requirements for internal visual examination
28、. IEC 60748-21:1997, Semiconductor devices Integrated circuits Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedure. IEC 60748-22-1:1997, Semiconductor devices Integrated circuits Part 22-1: Blank detail specificati
29、on for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures. 2.2 Preferred rating and characteristics Preferred values of voltages and currents are given in IEC60747-1; for resistors and capacitors preferred values are given in IEC60063; for
30、 custom-built circuits, any values and tolerances may be chosen. The circuits covered by this standard are classified into climatic categories according to the general rules given in IEC60068-1.BSQC760200:1997 2 BSI 10-1999 The severities for the cold and dry heat tests are the lower and upper categ
31、ory temperatures respectively. Because of the construction of some circuits, these temperatures will occur between two of the preferred temperatures given in IEC60068-2. In this event, the nearest preferred temperature within the actual range of the circuit shall be chosen for this severity. 2.3 Inf
32、ormation to be given in a detail specification Detail specifications shall be derived from the relevant blank detail specifications. Detail specifications shall not specify severities inferior to those of the generic or sectional specification. When more severe requirements are included, they shall
33、be listed in the detail specification and indicated in the test schedules, for example by an asterisk. NOTEThe information given on dimensions, characteristics and ratings may, for convenience, be presented in tabular form. The following information shall be given in each detail specification and th
34、e values quoted shall preferably be selected from those given in the appropriate clause or subclause of this sectional specification. Each detail specification shall state all the tests and measurements required for lot-by-lot inspection and periodic testing. This shall, as a minimum, include the re
35、levant tests given in this specification with methods and severities. Environmental tests, measurements, severities, and end-point limits for periodic tests shall be included in the detail specifications for the capability qualifying circuits (CQCs). They shall be in accordance with the applicable p
36、arts of the generic specification and this specification. 2.3.1 Outline drawing and dimensions There shall be an illustration of the circuit as an aid to easy recognition and for comparison of the circuit with others. Dimensions and their associated tolerances, which affect interchangeability and mo
37、unting, shall be given in the detail specifications. All dimensions shall be stated in millimetres. Normally, numerical values shall be given for the length, width and height of the body, and the termination spacing or for cylindrical types, the body diameter, and the length and diameter of the term
38、inations. When necessary, for example when a detail specification covers more than one package, the dimensions and their associated tolerances shall be placed in a table below the drawing. When the configuration is other than described above, the detail specification shall state such dimensional inf
39、ormation so as to adequately describe the circuit. 2.3.2 Mounting The detail specification shall prescribe the method of mounting to be applied for normal use, and for the application of the vibration, and the bump or shock tests. The design of the circuit may be such that special mounting fixtures
40、are required in its use. In this case, the detail specification shall prescribe the mounting fixtures and they shall be used in the application of the vibration and bump or shock tests. 2.3.3 Severities for environmental tests The detail specification shall prescribe the appropriate method of testin
41、g and the appropriate severities selected from section4 of the generic specification. 2.3.4 Marking The detail specification shall prescribe the content of the marking on the circuit and on the primary package. Deviations from2.6 of the generic specification shall be specifically stated. 2.3.5 Order
42、ing information The detail specification shall prescribe that the following information is required when ordering circuits: a) circuit type (e.g. hybrid thick film integrated circuit); b) number and issue of the detail specification with style reference and assessment level (if appropriate); c) func
43、tion of the circuit (if appropriate); d) basic functional characteristics with tolerance (if appropriate). 2.3.6 Additional information (not for inspection purposes) The detail specification may include information which is not normally required to be verified by the inspection procedure, such as ci
44、rcuit diagrams, curves, drawings and notes needed for clarification.BSQC760200:1997 BSI 10-1999 3 3 Capability approval procedures See3.6 of the generic specification with the following details: 3.1 Selection of capability qualifying circuits (CQCs) 3.1.1 The CQCs for approval testing shall be taken
45、 from the following sources: a) special circuits designed to qualify the design rules, processes and products; and/or b) circuits intended for shipment to customers. Any or all of these CQCs in combination with process test vehicles shall be adequate to assess the complete design rules, material and
46、 manufacturing processes, including any subcontracted process. Terminations of film elements and added components used for assessment shall be individually accessible for electrical measurement without influence from other circuit elements. 3.1.2 The CQCs shall be used to carry out the tests prescri
47、bed for capability approval and for periodic testing, and hence to demonstrate to the NSI that for limiting design layouts: a) performance limits claimed for individual film element types are achieved; b) environmental limits claimed for structures intended for shipment are met; and c) the electrica
48、l function performances claimed in the capability manual and the detail specifications are met. 3.1.3 Circuits which have received qualification approval according to IEC60748-21 may be counted as CQCs (provided the requirements of3.1.1 have been met) for the purposes of capability approval, subject
49、 to NSI agreement on relevant structural similarity claims. 3.1.4 A manufacturer who has received capability approval is permitted to obtain a separate qualification approval for any individual circuit he makes, provided that all appropriate testing of IEC60748-21 has been completed successfully. 3.1.5 A manufacturer using customer circuits among those selected as CQCs may vary the types tested according to his production plan. In this case the CQCs need not necessarily assess all the claimed limits of his capabilit
