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    IEEE 62704-3-2017 Determining the peak spatial-average specific absorption rate (SAR) in the human body from wireless communications devices 30 MHz to 6 GHz C P.pdf

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    IEEE 62704-3-2017 Determining the peak spatial-average specific absorption rate (SAR) in the human body from wireless communications devices 30 MHz to 6 GHz C P.pdf

    1、 IEC/IEEE 62704-3 Edition 1.0 2017-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Determining the peak spatial-average specific absorption rate (SAR) in the human body from wireless communications devices, 30 MHz to 6 GHz Part 3: Specific requirements for using the finite difference time domain (FDT

    2、D) method for SAR calculations of mobile phones Dtermination du dbit dabsorption spcifique (DAS) maximal moyenn dans le corps humain, produit par les dispositifs de communication sans fil, 30 MHz 6 GHz Partie 3: Exigences spcifiques pour lutilisation de la mthode des diffrences finies dans le domain

    3、e temporel (FDTD) pour les calculs de DAS des tlphones mobiles IEC/IEEE62704-3:2017-10(en-fr) colourinsideTHIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2017 IEC, Geneva, Switzerland Copyright 2017 IEEE All rights reserved. Unless otherwise specified, no part of this publication may be reproduced

    4、 or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing being secured. Requests for permission to reproduce should be addressed to either IEC at the address below or IECs member National Committee in the country of the r

    5、equester or from IEEE. IEC Central Office Institute of Electrical and Electronics Engineers, Inc. 3, rue de Varemb 3 Park Avenue CH-1211 Geneva 20 New York, NY 10016-5997 Switzerland United States of America Tel.: +41 22 919 02 11 stds.iprieee.org Fax: +41 22 919 03 00 www.ieee.org infoiec.ch www.ie

    6、c.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About the IEEE IEEE is the worlds largest professional association dedicated to advan

    7、cing technological innovation and excellence for the benefit of humanity. IEEE and its members inspire a global community through its highly cited publications, conferences, technology standards, and professional and educational activities. About IEC/IEEE publications The technical content of IEC/IE

    8、EE publications is kept under constant review by the IEC and IEEE. Please make sure that you have the latest edition, a corrigendum or an amendment might have been published. IEC Catalogue - webstore.iec.ch/catalogue The stand-alone application for consulting the entire bibliographical information o

    9、n IEC International Standards, Technical Specifications, Technical Reports and other documents. Available for PC, Mac OS, Android Tablets and iPad. IEC publications search - www.iec.ch/searchpub The advanced search enables to find IEC publications by a variety of criteria (reference number, text, te

    10、chnical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published details all new publications released. Available online and also once a month by email. Elec

    11、tropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing 20 000 terms and definitions in English and French, with equivalent terms in 16 additional languages. Also known as the International Electrotechnical Vocabulary (IEV) online. IEC Gloss

    12、ary - std.iec.ch/glossary 65 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002. Some entries have been collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEC Customer Service Centre -

    13、webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. IEC/IEEE 62704-3 Edition 1.0 2017-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Determining the peak spatial-average specific absorption ra

    14、te (SAR) in the human body from wireless communications devices, 30 MHz to 6 GHz Part 3: Specific requirements for using the finite difference time domain (FDTD) method for SAR calculations of mobile phones Dtermination du dbit dabsorption spcifique (DAS) maximal moyenn dans le corps humain, produit

    15、 par les dispositifs de communication sans fil, 30 MHz 6 GHz Partie 3: Exigences spcifiques pour lutilisation de la mthode des diffrences finies dans le domaine temporel (FDTD) pour les calculs de DAS des tlphones mobiles INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNAT

    16、IONALE ICS 17.220.20 ISBN 978-2-8322-4772-3 Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. Registered trademark of the International Electrotechnical Commission Mar

    17、que dpose de la Commission Electrotechnique Internationale colourinside 2 IEC/IEEE 62704-3:2017 IEC/IEEE 2017 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Terms and definitions 9 4 Abbreviated terms . 9 5 Simulation procedure . 10 5.1 General . 10 5.2 General considera

    18、tions . 10 5.3 General mesh settings 10 5.4 Simulation parameters 10 5.5 DUT model 10 5.5.1 General . 10 5.5.2 Antenna . 12 5.5.3 RF source 12 5.5.4 PCB . 13 5.5.5 Screen . 13 5.5.6 Battery and other larger metallic components 14 5.5.7 Casing . 14 5.6 SAR calculation using phantom models. 14 5.6.1 G

    19、eneral . 14 5.6.2 Head phantom model . 15 5.6.3 Body phantom model . 18 5.6.4 Phantom mesh generation . 18 5.7 Recording of results 18 5.8 Peak spatial-average SAR calculation . 19 6 Benchmark models 19 6.1 General . 19 6.2 Generic metallic box phone for 835 MHz and 1 900 MHz . 19 6.3 GSM/UMTS mobil

    20、e phone . 21 6.4 Generic multi-band patch antenna mobile phone . 22 6.5 Neo Free Runner mobile phone 24 7 Computational uncertainty . 25 7.1 General considerations . 25 7.2 Uncertainty of the test setup with respect to simulation parameters 26 7.3 Uncertainty of the developed numerical model of the

    21、DUT 26 7.4 Validation of the developed numerical model of the DUT. 26 7.5 Uncertainty budget 26 8 Reporting simulation results 27 8.1 General considerations . 27 8.2 DUT 27 8.3 Simulated configurations . 27 8.4 Numerical simulation tool 28 8.5 Results of the benchmark models . 28 8.6 Uncertainties.

    22、28 8.7 SAR results . 28 IEC/IEEE 62704-3:2017 3 IEC/IEEE 2017 Annex A (informative) Additional results for the generic mobile phone with integrated multiband antenna 29 Annex B (informative) Additional results for the Neo Free Runner mobile phone 31 Bibliography 35 Figure 1 An example of a multi-ban

    23、d antenna consisting of two metallic elements for the GSM and UMTS frequency bands . 12 Figure 2 An example of a source gap position that is inserted in replacement of a real-life feeding spring pin. 13 Figure 3 An example of a microstrip feed line. 13 Figure 4 Orientation of the mobile phone model

    24、prior to positioning against the head or the body phantom . 15 Figure 5 Orientation of the SAM phantom prior to positioning against the DUT shown in Figure 4 16 Figure 6 Suggested steps for the cheek position of the DUT against the SAM phantom . 16 Figure 7 Tilt position of the DUT against the SAM p

    25、hantom 17 Figure 8 Example of the full model space that includes the DUT and the SAM phantom for the numerical simulations for the right cheek position 17 Figure 9 Example of the model space for the DUT/body phantom calculation setup 18 Figure 10 The SAM head phantom and the generic metallic box pho

    26、ne . 19 Figure 11 Physical dimensions of the generic metallic box phone . 20 Figure 12 Generic GSM/UMTS mobile phone . 21 Figure 13 Generic mobile phone with integrated multiband patch antenna 23 Figure 14 CAD model of the Neo Free Runner mobile phone . 24 Figure A.1 Real part of the input impedance

    27、 of the antenna obtained with three different commercially available software products 29 Figure A.2 Imaginary part of the input impedance of the antenna obtained with three different commercially available software products 30 Figure B.1 Basic version of the Neo Free Runner CAD model . 31 Figure B.

    28、2 Intermediate version of the Neo Free Runner CAD model 31 Figure B.3 Full version of the Neo Free Runner CAD model 32 Figure B.4 Interlaboratory comparison results of the free space reflection coefficient for the basic CAD model . 32 Figure B.5 Interlaboratory comparison results of the free space r

    29、eflection coefficient for the intermediate CAD model 33 Figure B.6 Interlaboratory comparison results of the free space reflection coefficient for the full CAD model . 33 Table 1 Dielectric parameters of the materials of the generic phone. 20 Table 2 Peak spatial-average SAR for 1 g and 10 g of the

    30、benchmark . 21 Table 3 Dielectric properties of the materials of the generic GSM/UMTS mobile phone . 22 Table 4 Peak 1 g and 10 g SAR results of the GSM/UMTS mobile phone . 22 Table 5 Limits of the output parameters for the generic multi-band mobile phone . 23 Table 6 Peak 1 g and 10 g SAR results o

    31、f the GSM/UMTS mobile phone . 24 Table 7 Dielectric properties of the materials of the Neo Free Runner mobile phone 25 4 IEC/IEEE 62704-3:2017 IEC/IEEE 2017 Table 8 Peak 1 g and 10 g SAR results of the Neo Free Runner mobile phone 25 Table 9 Overall uncertainty budget . 27 Table B.1 Frequency limits

    32、 of the 6 dB reflection coefficient for the three different versions of the Neo Free Runner mobile phone . 34 IEC/IEEE 62704-3:2017 5 IEC/IEEE 2017 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ DETERMINING THE PEAK SPATIAL-AVERAGE SPECIFIC ABSORPTION RATE (SAR) IN THE HUMAN BODY FROM WIRELESS COMMUNIC

    33、ATIONS DEVICES, 30 MHz TO 6 GHz Part 3: Specific requirements for using the finite difference time domain (FDTD) method for SAR calculations of mobile phones FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electr

    34、otechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifica

    35、tions, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. Internationa

    36、l, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEEE Standards documents are developed within IEEE Societies and Standards Coordinating Committees of the IEEE Standards Association (IEEE-SA) Standards Board. IEEE develops its standards t

    37、hrough a consensus development process, approved by the American National Standards Institute, which brings together volunteers representing varied viewpoints and interests to achieve the final product. Volunteers are not necessarily members of IEEE and serve without compensation. While IEEE adminis

    38、ters the process and establishes rules to promote fairness in the consensus development process, IEEE does not independently evaluate, test, or verify the accuracy of any of the information contained in its standards. Use of IEEE Standards documents is wholly voluntary. IEEE documents are made avail

    39、able for use subject to important notices and legal disclaimers (see http:/standards.ieee.org/IPR/disclaimers.html for more information). IEC collaborates closely with IEEE in accordance with conditions determined by agreement between the two organizations. This Dual Logo International Standard was

    40、jointly developed by the IEC and IEEE under the terms of that agreement. 2) The formal decisions of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC Nation

    41、al Committees. The formal decisions of IEEE on technical matters, once consensus within IEEE Societies and Standards Coordinating Committees has been reached, is determined by a balanced ballot of materially interested parties who indicate interest in reviewing the proposed standard. Final approval

    42、of the IEEE standards document is given by the IEEE Standards Association (IEEE-SA) Standards Board. 3) IEC/IEEE Publications have the form of recommendations for international use and are accepted by IEC National Committees/IEEE Societies in that sense. While all reasonable efforts are made to ensu

    43、re that the technical content of IEC/IEEE Publications is accurate, IEC or IEEE cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications (in

    44、cluding IEC/IEEE Publications) transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC/IEEE Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC and IEEE do not provide any

    45、 attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC and IEEE are not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the

    46、latest edition of this publication. 7) No liability shall attach to IEC or IEEE or their directors, employees, servants or agents including individual experts and members of technical committees and IEC National Committees, or volunteers of IEEE Societies and the Standards Coordinating Committees of

    47、 the IEEE Standards Association (IEEE-SA) Standards Board, for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC/IEEE Publicati

    48、on or any other IEC or IEEE Publications. 8) Attention is drawn to the normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 6 IEC/IEEE 62704-3:2017 IEC/IEEE 2017 9) Attention is drawn to the possibility t

    49、hat implementation of this IEC/IEEE Publication may require use of material covered by patent rights. By publication of this standard, no position is taken with respect to the existence or validity of any patent rights in connection therewith. IEC or IEEE shall not be held responsible for identifying Essential Patent Claims for which a license may be required, for conducting inquiries into the legal validity or scope of Patent Claims


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