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    IEEE 62582-4-2011 Nuclear power plants C Instrumentation and control important to safety C Electrical equipment condition monitoring methods C Part 4 Oxidation .pdf

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    IEEE 62582-4-2011 Nuclear power plants C Instrumentation and control important to safety C Electrical equipment condition monitoring methods C Part 4 Oxidation .pdf

    1、 IEC/IEEE 62582-4 Edition 1.0 2011-08 INTERNATIONAL STANDARD Nuclear power plants Instrumentation and control important to safety Electrical equipment condition monitoring methods Part 4: Oxidation induction techniques Centrales nuclaires de puissance Instrumentation et contrle-commande importants p

    2、our la sret Mthodes de surveillance de ltat des matriels lectriques Partie 4: Techniques dinduction loxydation IEC/IEEE 62582-4:2011NORME INTERNATIONALE THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2011 IEC, Geneva, Switzerland Copyright 2011 IEEE All rights reserved. Unless otherwise specified

    3、, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing being secured. Requests for permission to reproduce should be addressed to either IEC at the address below or IECs me

    4、mber National Committee in the country of the requester or from IEEE. IEC Central Office Institute of Electrical and Electronics Engineers, Inc. 3, rue de Varemb 3 Park Avenue CH-1211 Geneva 20 New York, NY 10016-5597 Switzerland United States of America Email: inmailiec.ch Email: stds.iprieee.org W

    5、eb: www.iec.ch Web: www.ieee.org About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About the IEEE IEEE is the worlds largest professional as

    6、sociation dedicated to advancing technological innovation and excellence for the benefit of humanity. IEEE and its members inspire a global community through its highly cited publications, conferences, technology standards, and professional and educational activities. About IEC/IEEE publications The

    7、 technical content of IEC/IEEE publications is kept under constant review by the IEC and IEEE. Please make sure that you have the latest edition; corrigenda or amendments might have been published. g131 IEC catalogue of publications: www.iec.ch/searchpub The IEC online catalogue enables you to searc

    8、h by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, withdrawn and replaced publications. g131 IEEE products and services : www.ieee.org/go/shop IEEE publishes nearly a third of the worlds technical literature in electrical engineering, co

    9、mputer science, and electronics. Browse the latest publications including standards, draft standards, standards collections, and much more. g131 IEC Just Published: www.iec.ch/online_news/justpub Stay up to date on all new IEC publications. Just Published details all new publications released. Avail

    10、able online and also by monthly email. g131 Electropedia: www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions in English and French, with equivalent terms in additional languages. Also known as the Internation

    11、al Electrotechnical Vocabulary online. g131 Customer Service Centre: www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service Centre FAQ or contact us: Email: csciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 0

    12、3 00 . IEC/IEEE 62582-4 Edition 1.0 2011-08 INTERNATIONAL STANDARD Nuclear power plants Instrumentation and control important to safety Electrical equipment condition monitoring methods Part 4: Oxidation induction techniques Centrales nuclaires de puissance Instrumentation et contrle-commande import

    13、ants pour la sret Mthodes de surveillance de ltat des matriels lectriques Partie 4: Techniques dinduction loxydation U ICS 27.120.20 ISBN 978-2-88912-666-8 INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE PRICE CODE CODE PRIX NORME INTERNATIONALE 2 62582-4 g148 IE

    14、C/IEEE:2011 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope and object 8 2 Terms and definitions . 8 3 Abbreviations and acronyms . 8 4 General description 9 5 Applicability and reproducibility 9 6 Measurement procedure . 9 6.1 Stabilisation of the polymeric materials 9 6.2 Sampling . 10 6.2.1 Genera

    15、l . 10 6.2.2 Sample requirements . 10 6.2.3 Precautions . 10 6.3 Sample preparation . 10 6.4 Instrumentation . 11 6.5 Calibration . 11 6.6 OIT measurement method . 11 6.6.1 Measurement procedure 11 6.6.2 Temperature profile . 12 6.6.3 Gas flow 13 6.6.4 Determining the value of oxidation onset . 13 6

    16、.6.5 Reporting 14 6.7 OITP measurement method . 15 6.7.1 Measurement procedure 15 6.7.2 Temperature profile . 16 6.7.3 Gas flow 16 6.7.4 Determining the value of oxidation onset . 16 6.7.5 Reporting 16 Annex A (informative) Interpretation of thermograms . 18 Annex B (informative) Example of a measur

    17、ement report from OITP measurements 23 Annex C (informative) Influence of set temperature on the OIT value . 25 Bibliography 26 Figure 1 OIT measurement Schematic of temperature and gas profile and corresponding heat flow 12 Figure 2 Schematic showing the types of baselines (flat, sloping, endotherm

    18、ic dip, melting endotherm) observed for OIT and OITP measurements 13 Figure 3 Schematic showing definition of onset value for OIT and OITP measurements 14 Figure 4 Schematic of the temperature for OITP measurements and the corresponding heat flow 15 Figure A.1 Example of an OIT plot with clear basel

    19、ine and onset . 18 Figure A.2 Example of OIT plot with multiple onsets 19 Figure A.3 Example of OIT plot where the baseline is difficult to define 20 62582-4 g148 IEC/IEEE:2011 3 Figure A.4 Example of OIT plot where heat flow is too low to use standard 0,1 Wg1threshold 20 Figure A.5 Example of an OI

    20、TP plot with a well-defined baseline and onset . 21 Figure A.6 Example of an OITP plot for a semi-crystalline material showing a melting endotherm prior to the oxidation onset 22 Figure A.7 Example of an OITP plot showing an endothermic dip immediately prior to the oxidation onset . 22 Figure C.1 Ex

    21、ample of the influence of set temperature on the OIT value 25 4 62582-4 g148 IEC/IEEE:2011 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ NUCLEAR POWER PLANTS INSTRUMENTATION AND CONTROL IMPORTANT TO SAFETY ELECTRICAL EQUIPMENT CONDITION MONITORING METHODS Part 4: Oxidation induction techniques FOREWOR

    22、D 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electr

    23、ical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to techn

    24、ical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEEE Standards documents are developed within IEEE Soc

    25、ieties and Standards Coordinating Committees of the IEEE Standards Association (IEEE-SA) Standards Board. IEEE develops its standards through a consensus development process, approved by the American National Standards Institute, which brings together volunteers representing varied viewpoints and in

    26、terests to achieve the final product. Volunteers are not necessarily members of IEEE and serve without compensation. While IEEE administers the process and establishes rules to promote fairness in the consensus development process, IEEE does not independently evaluate, test, or verify the accuracy o

    27、f any of the information contained in its standards. Use of IEEE Standards documents is wholly voluntary. IEEE documents are made available for use subject to important notices and legal disclaimers (see http:/standards.ieee.org/IPR/disclaimers.html for more information). IEC collaborates closely wi

    28、th IEEE in accordance with conditions determined by agreement between the two organizations. This Dual Logo International Standard was jointly developed by the IEC and IEEE under the terms of that agreement. 2) The formal decisions of IEC on technical matters express, as nearly as possible, an inter

    29、national consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. The formal decisions of IEEE on technical matters, once consensus within IEEE Societies and Standards Coordinating Committees has been reached, is det

    30、ermined by a balanced ballot of materially interested parties who indicate interest in reviewing the proposed standard. Final approval of the IEEE standards document is given by the IEEE Standards Association (IEEE-SA) Standards Board. 3) IEC/IEEE Publications have the form of recommendations for in

    31、ternational use and are accepted by IEC National Committees/IEEE Societies in that sense. While all reasonable efforts are made to ensure that the technical content of IEC/IEEE Publications is accurate, IEC or IEEE cannot be held responsible for the way in which they are used or for any misinterpret

    32、ation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications (including IEC/IEEE Publications) transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC/IEEE Publicat

    33、ion and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC and IEEE do not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC and IE

    34、EE are not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or IEEE or their directors, employees, servants or agents including individual experts and me

    35、mbers of technical committees and IEC National Committees, or volunteers of IEEE Societies and the Standards Coordinating Committees of the IEEE Standards Association (IEEE-SA) Standards Board, for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indir

    36、ect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC/IEEE Publication or any other IEC or IEEE Publications. 8) Attention is drawn to the normative references cited in this publication. Use of the referenced publications is indispen

    37、sable for the correct application of this publication. 9) Attention is drawn to the possibility that implementation of this IEC/IEEE Publication may require use of material covered by patent rights. By publication of this standard, no position is taken with respect to the existence or validity of an

    38、y patent rights in connection therewith. IEC or IEEE shall not be held responsible for identifying Essential Patent Claims for which a license may be required, for conducting inquiries into the legal validity or scope of Patent Claims or determining whether any licensing terms or conditions provided

    39、 in 62582-4 g148 IEC/IEEE:2011 5 connection with submission of a Letter of Assurance, if any, or in any licensing agreements are reasonable or non-discriminatory. Users of this standard are expressly advised that determination of the validity of any patent rights, and the risk of infringement of suc

    40、h rights, is entirely their own responsibility. International Standard IEC/IEEE 62582-4 has been prepared by subcommittee 45A: Instrumentation and control of nuclear facilities, of IEC technical committee 45: Nuclear instrumentation, in cooperation with the Nuclear Power Engineering Committee of the

    41、 Power this is used as the baseline. In some materials, there is a linear change in heat flow before the onset of oxidation. This can also be used as a baseline and is referred to as a sloping baseline. Heatflow(W g117g1) Time (OIT) or temperature (OITP) Flat Sloping Endothermic dip (OITP) Melting e

    42、ndotherm (OITP) IEC 1976/11 Figure 2 Schematic showing the types of baselines (flat, sloping, endothermic dip, melting endotherm) observed for OIT and OITP measurements 6.6.4.2 Definition of the threshold and onset time The threshold shall be defined at 0,1 Wg1relative to the baseline. The onset tim

    43、e is defined by the intersection of the test curve with the threshold relative to the baseline, as shown in Figure 3. 14 62582-4 g148 IEC/IEEE:2011 Heatflow(W g117g1) Time (OIT) or temperature (OITP) Onset Baseline + threshold Baseline Definition of onset of OIT/OITP IEC 1977/11 Figure 3 Schematic s

    44、howing definition of onset value for OIT and OITP measurements Examples of the types of OIT thermogram that are observed in practice are given in Annex A. 6.6.5 Reporting The measurement report shall include the following items. a) Identification of the equipment sampled. This shall include: g120 de

    45、tails of the material being sampled, e.g. the generic polymer type, specific formulation numbers; g120 where the sample was taken from, e.g. surface scraping, through thickness slice; g120 for samples taken in plant, location within the plant. b) Pre-history of the equipment sampled. This shall incl

    46、ude: g120 time in service, or ageing time for laboratory aged samples; g120 the environmental conditions to which it has been exposed, e.g. temperature, radiation. c) Sampling method, including sample preparation (6.3). d) Place and date of the measurements. e) Instrument used and software version u

    47、sed for analysis (6.4). f) Calibration procedure (6.5). g) Type of sample pan used (6.3). h) Oxygen flow rate during test (6.6.3). i) Temperature profile, including ramp rates and hold times (6.6.2). NOTE If the instrument is capable of generating the information, the actual temperature profile shou

    48、ld be included. 62582-4 g148 IEC/IEEE:2011 15 j) Baseline type and the rationale for using that specific baseline (6.6.4.1). k) Onset type and the rationale for the selection of the onset in multiple onsets. l) Threshold value used and the rationale if a non-standard value is used (6.6.4.2). m) Numb

    49、er of samples measured (6.3). n) Mean value of OIT, and standard deviation, in minutes. o) Examples of the heat flow vs. time plot, particularly if the material does not show a flat baseline with single well-defined onset. 6.7 OITP measurement method 6.7.1 Measurement procedure The measurement procedure is illustrated in Figure 4. It includes the following steps: g120 The sample is heated in the instrument in oxygen at 10 Cmin1g120 The oxidation


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