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    EN IEC 60749-13-2018 Semiconductor devices - Mechanical and climatic test methods - Part 13 Salt atmosphere.pdf

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    EN IEC 60749-13-2018 Semiconductor devices - Mechanical and climatic test methods - Part 13 Salt atmosphere.pdf

    1、Semiconductor devices Mechanical and climatic test methodsPart 13: Salt atmosphereBS EN IEC 60749-13:2018BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN IEC 60749-13 April 2018 ICS 31.080.01 Supersedes EN 60749-13:

    2、2002 English Version Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (IEC 60749-13:2018) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques - Partie 13: Atmosphre saline (IEC 60749-13:2018) Halbleiterbauelemente - Mechanische und klimatisch

    3、e Prfverfahren - Teil 13: Salzatmosphre (IEC 60749-13:2018) This European Standard was approved by CENELEC on 2018-03-22. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard w

    4、ithout any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any

    5、 other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia,

    6、Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, T

    7、urkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels 2018 CENELEC All rights of exploitation in any f

    8、orm and by any means reserved worldwide for CENELEC Members. Ref. No. EN IEC 60749-13:2018 E National forewordThis British Standard is the UK implementation of EN IEC 60749-13:2018. It is identical to IEC 60749-13:2018. It supersedes BS EN 60749-13:2002, which is withdrawn.The UK participation in it

    9、s preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct a

    10、pplication. The British Standards Institution 2018 Published by BSI Standards Limited 2018ISBN 978 0 580 97606 3ICS 31.080.01Compliance with a British Standard cannot confer immunity from legal obligations. This British Standard was published under the authority of the Standards Policy and Strategy

    11、Committee on 30 April 2018.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN IEC 60749-13:2018EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN IEC 60749-13 April 2018 ICS 31.080.01 Supersedes EN 60749-13:2002 English Version Semiconductor devices - Mechanical

    12、and climatic test methods - Part 13: Salt atmosphere (IEC 60749-13:2018) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques - Partie 13: Atmosphre saline (IEC 60749-13:2018) Halbleiterbauelemente - Mechanische und klimatische Prfverfahren - Teil 13: Salzatmosphre (IEC 60749-13:20

    13、18) This European Standard was approved by CENELEC on 2018-03-22. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographi

    14、cal references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibi

    15、lity of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, F

    16、ormer Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Ele

    17、ctrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Memb

    18、ers. Ref. No. EN IEC 60749-13:2018 E BS EN IEC 60749-13:2018EN IEC 60749-13:2018 (E) 2 European foreword The text of document 47/2446/FDIS, future edition 2 of IEC 60749-13, prepared by IEC/TC 47 “Semiconductor devices“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN IEC

    19、 60749-13:2018. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2018-12-22 latest date by which the national standards conflicting with the document have to be withdrawn

    20、(dow) 2021-03-22 This document supersedes EN 60749-13:2002. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the In

    21、ternational Standard IEC 60749-13:2018 was approved by CENELEC as a European Standard without any modification. BS EN IEC 60749-13:2018EN IEC 60749-13:2018 (E) 2 European foreword The text of document 47/2446/FDIS, future edition 2 of IEC 60749-13, prepared by IEC/TC 47 “Semiconductor devices“ was s

    22、ubmitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN IEC 60749-13:2018. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2018-12-22 latest date by which

    23、 the national standards conflicting with the document have to be withdrawn (dow) 2021-03-22 This document supersedes EN 60749-13:2002. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for ident

    24、ifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 60749-13:2018 was approved by CENELEC as a European Standard without any modification. EN IEC 60749-13:2018 (E) 3 Annex ZA (normative) Normative references to international publications with their cor

    25、responding European publications The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document

    26、(including any amendments) applies. NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.

    27、eu. Publication Year Title EN/HD Year IEC 60749-14 - Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) EN 60749-14 - BS EN IEC 60749-13:2018 2 IEC 60749-13:2018 IEC 2018 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Terms

    28、 and definitions 5 4 Test apparatus 5 5 Procedure 6 5.1 Conditioning and maintenance of test chamber . 6 5.2 Initial preconditioning of leads . 6 5.3 Mounting of test specimens . 6 5.4 Chamber operation . 10 5.5 Length of test 10 5.6 Examination 11 5.7 Failure criteria . 11 5.7.1 Finished product 11

    29、 5.7.2 Package elements . 12 6 Summary . 12 Bibliography 14 Figure 1 Dual-in-line packages with leads attached to, or exiting from package sides (such as side-brazed packages and ceramic dual-in-line packages) 7 Figure 2 Packages with leads attached to, or exiting from the opposite side of the lid 9

    30、 Figure 3 Packages with leads attached to, or exiting from package sides, parallel to lids (such as flatpacks) . 9 Figure 4 Leadless and leaded chip carriers 10 Figure 5 Corrosion area charts . 13 Table 1 Minimum duration of exposure . 11 BS EN IEC 60749-13:2018 2 IEC 60749-13:2018 IEC 2018 CONTENTS

    31、 FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Terms and definitions 5 4 Test apparatus 5 5 Procedure 6 5.1 Conditioning and maintenance of test chamber . 6 5.2 Initial preconditioning of leads . 6 5.3 Mounting of test specimens . 6 5.4 Chamber operation . 10 5.5 Length of test 10 5.6 Examinatio

    32、n 11 5.7 Failure criteria . 11 5.7.1 Finished product 11 5.7.2 Package elements . 12 6 Summary . 12 Bibliography 14 Figure 1 Dual-in-line packages with leads attached to, or exiting from package sides (such as side-brazed packages and ceramic dual-in-line packages) 7 Figure 2 Packages with leads att

    33、ached to, or exiting from the opposite side of the lid 9 Figure 3 Packages with leads attached to, or exiting from package sides, parallel to lids (such as flatpacks) . 9 Figure 4 Leadless and leaded chip carriers 10 Figure 5 Corrosion area charts . 13 Table 1 Minimum duration of exposure . 11 IEC 6

    34、0749-13:2018 IEC 2018 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 13: Salt atmosphere FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechn

    35、ical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

    36、 Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, gov

    37、ernmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions

    38、 or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for internatio

    39、nal use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order t

    40、o promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly

    41、 indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodi

    42、es. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property

    43、 damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this

    44、 publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or

    45、all such patent rights. International Standard IEC 60749-13 has been prepared by IEC technical committee 47: Semiconductor devices. This second edition cancels and replaces the first edition published in 2002. This edition constitutes a technical revision. This edition includes the following signifi

    46、cant technical changes with respect to the previous edition: a) alignment with MIL-STD-883J Method 1009.8, Salt Atmosphere (Corrosion), including information on conditioning and maintenance of the test chamber and mounting of test specimens (including explanatory figures). BS EN IEC 60749-13:2018 4

    47、IEC 60749-13:2018 IEC 2018 The text of this International Standard is based on the following documents: FDIS Report on voting 47/2446/FDIS 47/2455/RVD Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. Thi

    48、s document has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 60749 series, published under the general title Semiconductor devices Mechanical and climatic test methods, can be found on the IEC website. The committee has decided that the contents of th

    49、is document will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amended. BS EN IEC 60749-13:2018 4 IEC 60749-13:2018 IEC 2018 The text of this International Standard is based on the following documents: FDIS Report on voting 47/2446/FDIS 47/2455/RVD Full information on the


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