1、 Reference number ISO 15745-5:2007(E) ISO 2007INTERNATIONAL STANDARD ISO 15745-5 First edition 2007-02-01 Industrial automation systems and integration Open systems application integration framework Part 5: Reference description for HDLC-based control systems Systmes dautomatisation industrielle et
2、intgration Cadres dintgration dapplication pour les systmes ouverts Partie 5: Description de rfrence pour les systmes de contrle fonds sur HDLC ISO 15745-5:2007(E) PDF disclaimer This PDF file may contain embedded typefaces. In accordance with Adobes licensing policy, this file may be printed or vie
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7、ghtiso.org Web www.iso.org Published in Switzerland ii ISO 2007 All rights reservedISO 15745-5:2007(E) ISO 2007 All rights reserved iiiContents Page Foreword .iv Introductionv 1 Scope.1 2 Normative references.1 3 Terms and definitions.1 4 Abbreviated terms2 5 Technology specific elements and rules 2
8、 5.1 Integration models and IAS interfaces2 5.2 Profile templates.2 5.3 Technology specific profiles3 6 Device and communication network profiles for HDLC-based control systems .3 6.1 General3 6.2 CC-Link4 Annex A (normative) CC-Link profile templates 16 Annex B (informative) UML terminology and not
9、ation 87 Bibliography.88 ISO 15745-5:2007(E) iv ISO 2007 All rights reservedForeword ISO (the International Organization for Standardization) is a worldwide federation of national standards bodies (ISO member bodies). The work of preparing International Standards is normally carried out through ISO
10、technical committees. Each member body interested in a subject for which a technical committee has been established has the right to be represented on that committee. International organizations, governmental and non-governmental, in liaison with ISO, also take part in the work. ISO collaborates clo
11、sely with the International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization. International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 2. The main task of technical committees is to prepare International Standards. Dra
12、ft International Standards adopted by the technical committees are circulated to the member bodies for voting. Publication as an International Standard requires approval by at least 75 % of the member bodies casting a vote. Attention is drawn to the possibility that some of the elements of this docu
13、ment may be the subject of patent rights. ISO shall not be held responsible for identifying any or all such patent rights. ISO 15745-5 was prepared by Technical Committee ISO/TC 184, Industrial automation systems and integration, Subcommittee SC 5, Architecture, communications and integration framew
14、orks. Part 1: Generic reference description Part 2: Reference description for ISO 11898-based control systems Part 3: Reference description for IEC 61158-based control systems Part 4: Reference description for Ethernet-based control systems Part 5: Reference description for HDLC-based control system
15、s ISO 15745 consists of the following parts under the title Industrial automation systems and integration Open systems application integration framework ISO 15745-5:2007(E) ISO 2007 All rights reserved vIntroduction The application integration framework (AIF) described in ISO 15745 defines elements
16、and rules that facilitate: the systematic organization and representation of the application integration requirements using integration models; the development of interface specifications in the form of application interoperability profiles (AIPs) that enable both the selection of suitable resources
17、 and the documentation of the “as built“ application. ISO 15745-1 defines the generic elements and rules for describing integration models and AIPs, together with their component profiles - process profiles, information exchange profiles, and resource profiles. The context of ISO 15745 and a structu
18、ral overview of the constituents of an AIP are given in Figure 1 of ISO 15745-1:2003. This part of ISO 15745 extends the generic AIF described in ISO 15745-1 by defining the technology specific elements and rules for describing both communication network profiles and the communication related aspect
19、s of device profiles specific to HDLC 1)-based control systems (CC-Link 2). CC-Link is based on HDLC technology. In particular, this part of ISO 15745 describes technology specific profile templates for the device profile and the communication network profile. Within an AIP, a device profile instanc
20、e or a communication network profile instance is part of the resource profile defined in ISO 15745-1. The device profile and the communication network profile XML instance files are included in a resource profile XML instance using the ProfileHandle_DataType as specified in ISO 15745-1:2003, 7.2.5.
21、AIFs specified using the elements and rules of ISO 15745-1 can be easily integrated with the component profiles defined using the elements and rules specified in this part of ISO 15745. 1)HDLC is used in this document as a synonym for ISO/IEC 13239.2)CC-Link is the trade name of the CC-Link Partner
22、Association (CLPA). This information is given for the convenience of users of ISO 15745 and does not constitute an endorsement by ISO of the trade name holder or any of its products. Compliance to this part of ISO 15745 does not require use of the trade name CC-Link. Use of the trade name CC-Link re
23、quires permission of the CLPA.INTERNATIONAL STANDARD ISO 15745-5:2007(E) ISO 2007 All rights reserved 1Industrial automation systems and integration Open systems application integration framework Part 5: Reference description for HDLC-based control systems 1 Scope This part of ISO 15745 defines the
24、technology specific elements and rules for describing both communication network profiles and the communication related aspects of device profiles specific to HDLC-based control systems. NOTE Generic elements and rules for describing integration models and application interoperability profiles, toge
25、ther with their component profiles (process profiles, information exchange profiles, and resource profiles) are specified in ISO 15745-1. This part of ISO 15745 is to be used in conjunction with ISO 15745-1 to describe an application integration framework. 2 Normative references The following refere
26、nced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. ISO 15745-1:2003, Industrial automation systems and integration Open
27、systems application integration framework Part 1: Generic reference description ISO/IEC 13239, Information technology Telecommunications and information exchange between systems High-level data link control (HDLC) procedures REC-xml-20040204, Extensible Markup Language (XML) 1.0 Third Edition W3C Re
28、commendation 04 February 2004 REC-xmlschema-1-20010502, XML Schema Part 1: Structures W3C Recommendation 02 May 2001 REC-xmlschema-2-20010502, XML Schema Part 2: Datatypes W3C Recommendation 02 May 2001 UML V1.4, OMG - Unified Modeling Language Specification (Version 1.4, September 2001) 3 Terms and
29、 definitions NOTE The UML terminology and notation used in this part of ISO 15745 is described in Annex A of ISO 15745-1:2003 and Annex B of this part of ISO 15745. For the purposes of this document, the terms and definitions given in ISO 15745-1 apply. ISO 15745-5:2007(E) 2 ISO 2007 All rights rese
30、rved4 Abbreviated terms AIF Application Integration Framework AIP Application Interoperability Profile ASCII American Standard Code for Information Interchange CSP CC-Link System Profile (see BAP-05028) HDLC High-level Data Link Control (see ISO/IEC 13239) IAS Industrial Automation Systems I/O Input
31、 and Output LT CC-Link/LT OSI Open System Interconnection RWr Remote register for read RWw Remote register for write RX Remote input RY Remote output SEMI Semiconductor Equipment and Materials International (in this context refer to SEMI standard, SEMI E54.12-0701) UML Unified Modeling Language (see
32、 UML V1.4) XML eXtensible Markup Language (see REC-xml-20040204) 5 Technology specific elements and rules 5.1 Integration models and IAS interfaces The AIP developer shall develop the integration model using the rules described in ISO 15745-1, and shall ensure that the HDLC-based device and communic
33、ation network profiles (whether representing the interface requirements or those derived from existing devices/communication networks) include the necessary IAS interfaces. The IAS interfaces included in the profile shall be identified in the header section (see ISO 15745- 1:2003, 7.2.2). NOTE IAS i
34、nterfaces are described in ISO 15745-1:2003, Annex B. 5.2 Profile templates 5.2.1 General The HDLC-based technology specific profile templates are derived from the generic profile templates specified in ISO 15745-1:2003, clause 7. ISO 15745-5:2007(E) ISO 2007 All rights reserved 35.2.2 Contents and
35、syntax ISO 15745 specifies profile templates that are XML schemas (REC-xmlschema-1-20010502 and REC- xmlschema-2-20010502) and use a common general structure. The device and communication network profiles based on these templates typically contain: information needed to identify the connected device
36、, a description of device data that can be accessed via the network, a description of the communication capabilities supported by the device, additional vendor-specific information. However, CC-Link technology uses specific legacy ASCII syntax. Hence, for backward compatibility, template definitions
37、 (see Annex A) include the following: communication network and device profile templates, as defined in ISO 15745-1, ISO 15745 template to encapsulate files with legacy ASCII syntax (“wrapper“). 5.2.3 Header The profile template header defined in ISO 15745-1:2003, 7.2.2, is used for HDLC-based techn
38、ology specific profile templates. Each technology uses one or more names to identify the technology or its particular component(s) (see Table 1). The selected name shall be stored in the ProfileTechnology attribute in the header section. Table 1 ProfileTechnology names ProfileTechnology name Technol
39、ogy CC-Link CC-Link CSP CC-Link 5.3 Technology specific profiles The technology specific communication network profile structure and communication related aspects of device profile structure based on HDLC technology are described in clause 6. The technology included is CC-Link (see 6.2). The related
40、 profile template definitions are specified in Annex A. 6 Device and communication network profiles for HDLC-based control systems 6.1 General The CC-Link technology specific device and communication network profiles are described in 6.2. ISO 15745-5:2007(E) 4 ISO 2007 All rights reserved6.2 CC-Link
41、 6.2.1 Device profile 6.2.1.1 General Figure 1 shows the class structure of the CC-Link device profile. DeviceProfile ApplicationProcess DeviceFunction DeviceManager DeviceIdentity 1 0* 1* 1Figure 1 CC-Link device profile class diagram The DeviceProfile class of any version of CC-Link except version
42、 LT may include the ApplicationProcess class. The DeviceProfile class of CC-Link version LT shall not include the ApplicationProcess class. The available formats for CC-Link device profiles are described in A.2. The XML schema representing the CC-Link device profiles template is defined in A.2.1.3.
43、The file name of this XML schema shall be “CC-Link_DeviceProfile.xsd”. The XML schema representing the encapsulation of a CC-Link CSP into the ISO 15745 device profile template is defined in A.2.2.2. The file name of this XML schema shall be “CSP_DeviceProfile_wrapper.xsd”. The legacy CSP ASCII synt
44、ax itself is described in A.4. 6.2.1.2 Device identity Figure 2 shows the class structure of the DeviceIdentity class. DeviceIdentity StationType CcLinkVer VendID VendName 1 1 1 1 DevVer 1 RemDevType 01 DevModel 1 StationNumber 01Figure 2 CC-Link DeviceIdentity class diagram The DeviceIdentity class
45、 shall consist of the child classes shown in Figure 2 and specified in Table 2. Child classes of DeviceIdentity class apply to profile, type, and instance. ISO 15745-5:2007(E) ISO 2007 All rights reserved 5Table 2 Child classes of DeviceIdentity class Class Description CcLinkVer CC-Link version used
46、 by the device VendName vendor name VendID vendor code DevModel model name DevVer version number StationNumber Identifier of the device StationType type code for slave station RemDevType type code for remote device station 6.2.1.3 Device manager 6.2.1.3.1 General Figure 3 shows the structure of the
47、DeviceManager class. DeviceManager BmpFile NumOccupiedStations ExtendedCycleConf 01 01 1 MasterFlg UpDownLoadF ErrReg 01 01 01 Mode 1 IOType TotalIO 01 01 LEDList 01 LED 1* SEMISupport 01Figure 3 CC-Link DeviceManager class diagram The DeviceManager class consists of the child classes shown in Figur
48、e 3 and Table 3. ISO 15745-5:2007(E) 6 ISO 2007 All rights reservedTable 3 Child classes of DeviceManager class Class Version 1.00 / 1.10 Version 1.11 Version 2.00 Version LT NumOccupiedStations Mandatory Mandatory Mandatory Mandatory ExtendedCycleConf Not applicable Not applicable Optional Not appl
49、icable BmpFile Mandatory Mandatory Mandatory Not applicable ErrReg Optional Optional Optional Not applicable UpDownLoadF Mandatory Mandatory Mandatory Not applicable MasterFlg Optional Optional Optional Not applicable Mode Mandatory Mandatory Mandatory Mandatory TotalIO Optional Optional Optional Optional IOType Optional Optional Optional Optional SEMISupport Not applicable Optional Optional Not applicable LEDList Optional Optional Optional Optional NOTE The four righ
