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    IEEE 1497-2004 en Delay and power calculation standards Part 3 Standard Delay Format (SDF) for the electronic design process (Replaces IEEE 1497-2001 IEEE Compu.pdf

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    IEEE 1497-2004 en Delay and power calculation standards Part 3 Standard Delay Format (SDF) for the electronic design process (Replaces IEEE 1497-2001 IEEE Compu.pdf

    1、 INTERNATIONAL STANDARD IEC61523-3First edition2004-09IEEE 1497 Delay and power calculation standards Part 3: Standard Delay Format (SDF) for the electronic design process Reference number IEC 61523-3(E):2004 IEEE Std. 1497(E):2001 Publication numbering As from 1 January 1997 all IEC publications ar

    2、e issued with a designation in the 60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1. Consolidated editions The IEC is now publishing consolidated versions of its publications. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the base pu

    3、blication incorporating amendment 1 and the base publication incorporating amendments 1 and 2. Further information on IEC publications The technical content of IEC publications is kept under constant review by the IEC, thus ensuring that the content reflects current technology. Information relating

    4、to this publication, including its validity, is available in the IEC Catalogue of publications (see below) in addition to new editions, amendments and corrigenda. Information on the subjects under consideration and work in progress undertaken by the technical committee which has prepared this public

    5、ation, as well as the list of publications issued, is also available from the following: IEC Web Site (www.iec.ch) Catalogue of IEC publications The on-line catalogue on the IEC web site (www.iec.ch/searchpub) enables you to search by a variety of criteria including text searches, technical committe

    6、es and date of publication. On-line information is also available on recently issued publications, withdrawn and replaced publications, as well as corrigenda. IEC Just Published This summary of recently issued publications (www.iec.ch/online_news/ justpub) is also available by email. Please contact

    7、the Customer Service Centre (see below) for further information. Customer Service Centre If you have any questions regarding this publication or need further assistance, please contact the Customer Service Centre: Email: custserviec.ch Tel: +41 22 919 02 11 Fax: +41 22 919 03 00 Delay and power calc

    8、ulation standards Part 3: Standard Delay Format (SDF) for the electronic design process INTERNATIONAL STANDARD IEC61523-3First edition2004-09IEEE 1497Commission Electrotechnique InternationaleInternational Electrotechnical Commission IEEE 2004 Copyright - all rights reserved IEEE is a registered tra

    9、demark in the U.S. Patent any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the Internation

    10、al Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each t

    11、echnical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC P

    12、ublications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their

    13、national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared

    14、to be in conformity with an IEC Publication. 6) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC/IEEE 61523-3 has be

    15、en processed through IEC technical committee 93: Design automation. The text of this standard is based on the following documents: IEEE Std FDIS Report on voting 1497 (2001) 93/191/FDIS 93/196/RVD Full information on the voting for the approval of this standard can be found in the report on voting i

    16、ndicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives. The committee has decided that the contents of this publication will remain unchanged until 2006. IEC 61523 consists of the following parts, under the general title Delay and power calculation s

    17、tandards: IEC 61523-1, Part 1: Integrated circuit delay and power calculation systems Published by IEC under licence from IEEE. 2004 IEEE. All rights reserved. IEC 61523-3:2004(E)IEEE 1497-2001(E) 3 IEC 61523-2, Part 2: Pre-layout delay calculation specification of CMOS ASIC libraries IEC/IEEE 61523

    18、-3, Part 3: Standard Delay Format (SDF) for the electronic process Published by IEC under licence from IEEE. 2004 IEEE. All rights reserved. IEC 61523-3:2004(E)IEEE 1497-2001(E) 4 IEC/IEEE Dual Logo International Standards This Dual Logo International Standard is the result of an agreement between t

    19、he IEC and the Institute of Electrical and Electronics Engineers, Inc. (IEEE). The original IEEE Standard was submitted to the IEC for consideration under the agreement, and the resulting IEC/IEEE Dual Logo International Standard has been published in accordance with the ISO/IEC Directives. IEEE Sta

    20、ndards documents are developed within the IEEE Societies and the Standards Coordinating Committees of the IEEE Standards Association (IEEE-SA) Standards Board. The IEEE develops its standards through a consensus development process, approved by the American National Standards Institute, which brings

    21、 together volunteers representing varied viewpoints and interests to achieve the final product. Volunteers are not necessarily members of the Institute and serve without compensation. While the IEEE administers the process and establishes rules to promote fairness in the consensus development proces

    22、s, the IEEE does not independently evaluate, test, or verify the accuracy of any of the information contained in its standards. Use of an IEC/IEEE Dual Logo International Standard is wholly voluntary. The IEC and IEEE disclaim liability for any personal injury, property or other damage, of any natur

    23、e whatsoever, whether special, indirect, consequential, or compensatory, directly or indirectly resulting from the publication, use of, or reliance upon this, or any other IEC or IEEE Standard document. The IEC and IEEE do not warrant or represent the accuracy or content of the material contained he

    24、rein, and expressly disclaim any express or implied warranty, including any implied warranty of merchantability or fitness for a specific purpose, or that the use of the material contained herein is free from patent infringement. IEC/IEEE Dual Logo International Standards documents are supplied “AS

    25、IS”. The existence of an IEC/IEEE Dual Logo International Standard does not imply that there are no other ways to produce, test, measure, purchase, market, or provide other goods and services related to the scope of the IEC/IEEE Dual Logo International Standard. Furthermore, the viewpoint expressed

    26、at the time a standard is approved and issued is subject to change brought about through developments in the state of the art and comments received from users of the standard. Every IEEE Standard is subjected to review at least every five years for revision or reaffirmation. When a document is more

    27、than five years old and has not been reaffirmed, it is reasonable to conclude that its contents, although still of some value, do not wholly reflect the present state of the art. Users are cautioned to check to determine that they have the latest edition of any IEEE Standard. In publishing and makin

    28、g this document available, the IEC and IEEE are not suggesting or rendering professional or other services for, or on behalf of, any person or entity. Neither the IEC nor IEEE is undertaking to perform any duty owed by any other person or entity to another. Any person utilizing this, and any other I

    29、EC/IEEE Dual Logo International Standards or IEEE Standards document, should rely upon the advice of a competent professional in determining the exercise of reasonable care in any given circumstances. Interpretations Occasionally questions may arise regarding the meaning of portions of standards as

    30、they relate to specific applications. When the need for interpretations is brought to the attention of IEEE, the Institute will initiate action to prepare appropriate responses. Since IEEE Standards represent a consensus of concerned interests, it is important to ensure that any interpretation has a

    31、lso received the concurrence of a balance of interests. For this reason, IEEE and the members of its societies and Standards Coordinating Committees are not able to provide an instant response to interpretation requests except in those cases where the matter has previously received formal considerat

    32、ion. Comments for revision of IEC/IEEE Dual Logo International Standards are welcome from any interested party, regardless of membership affiliation with the IEC or IEEE. Suggestions for changes in documents should be in the form of a proposed change of text, together with appropriate supporting com

    33、ments. Comments on standards and requests for interpretations should be addressed to: Secretary, IEEE-SA Standards Board, 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 08855-1331, USA and/or General Secretary, IEC, 3, rue de Varemb, PO Box 131, 1211 Geneva 20, Switzerland. Authorization to photocopy

    34、portions of any individual standard for internal or personal use is granted by the Institute of Electrical and Electronics Engineers, Inc., provided that the appropriate fee is paid to Copyright Clearance Center. To arrange for payment of licensing fee, please contact Copyright Clearance Center, Cus

    35、tomer Service, 222 Rosewood Drive, Danvers, MA 01923 USA; +1 978 750 8400. Permission to photocopy portions of any individual standard for educational classroom use can also be obtained through the Copyright Clearance Center. NOTE Attention is called to the possibility that implementation of this st

    36、andard may require use of subject matter covered by patent rights. By publication of this standard, no position is taken with respect to the existence or validity of any patent rights in connection therewith. The IEEE shall not be responsible for identifying patents for which a license may be requir

    37、ed by an IEEE standard or for conducting inquiries into the legal validity or scope of those patents that are brought to its attention. Published by IEC under licence from IEEE. 2004 IEEE. All rights reserved. IEC 61523-3:2004(E)IEEE 1497-2001(E) 5 IEEE Standard for Standard Delay Format (SDF) for t

    38、he ElectronicDesign ProcessSponsorDesign Automation Standards Committeeof theIEEE Computer SocietyApproved 5 December 2001IEEE-SA Standards BoardAbstract:The Standard Delay Format (SDF) is defined in this standard. SDF is a textual file formatfor representing the delay and timing information of elec

    39、tronic systems. While both human andmachine readable, in its most common usage it will be machine written and machine read in supportof timing analysis and verification tools, and of other tools requiring delay and timing information.The primary audience for this standard is the implementors of tool

    40、s supporting the format, butanyone with a need to understand the formats contents will find it useful.Keywords:computer, computer languages, delay, delay backannotation, digital systems, electron-ic systems, hardware, hardware design, SDF, timing, timing analysis, timing backannotation, timingverifi

    41、cationPublished by IEC under licence from IEEE. 2004 IEEE. All rights reserved. IEC 61523-3:2004(E)IEEE 1497-2001(E) 6 Copyright 2001 IEEE. All rights reserved.iiiThe Standard Delay Format (SDF) was designed to serve as a simple textual medium for communicatingtiming information and constraints betw

    42、een EDA tools. The original version was designed by Rajit C. Chan-dra in 1990 while at Cadence Design Systems, and was intended as a means of communicating macrocelland interconnect delays from Gate Ensemble to Verilog-XL, Veritime and other stand-alone tools requiringtiming data.Because it was orig

    43、inally targeted for annotation to tools using the Verilog language, many SDF constructsare analogous to those in Verilog specify blocks. Those already familiar with the Verilog specify block willnd many of the SDF constructs familiar, such as SETUP and PATHPULSE. SDF also includes constructsfor anno

    44、tating interconnect delays, and can be used for forward annotation by specifying path delay con-straints from timing analysis to oorplanners, and synthesis and layout tools.SDF was rst introduced into the EDA marketplace in 1991 where it won quick acceptance. Cadence placedSDF in the public domain i

    45、n 1992 when it turned control over to Open Verilog International (OVI), and OVIdelivered the rst SDF standard, version 2.0, in June, 1993 (SDF version 1.0 was used by Cadence). OVI hassince introduced version 2.1 in February, 1994, and version 3.0 in May, 1995. VHDL (IEEE 1076) also takesadvantage o

    46、f SDF through the VITAL standard.In 1996 the OVI Board of Directors began an effort to establish SDF as an IEEE standard. With the approvalof the IEEE Design Automation Standards Committee (DASC), the OVI Logic Modeling Technical Sub-committee became the IEEE SDF Study Group. With the approval of th

    47、e Project Authorization Request(PAR) by the IEEE Standards Board on February 10, 1997, this group became the IEEE SDF WorkingGroup.This IEEE SDF standard builds upon OVI SDF version 3.0, and will be known as version 4.0. The changesfrom OVI 3.0 to IEEE 4.0 are small (LABEL construct added, NETDELAY

    48、construct restored), but thechange from OVI standard to IEEE standard is signicant, and so this is recognized by a new versionnumber.ObjectiveThe starting point for the IEEE P1497 SDF Working Group was the OVI LRM version 3.0 SDF standard,with the goal of soliciting further enhancements and improvin

    49、g the quality and rigor of the LRM. Since SDFis already in widespread use, no modications that would invalidate current usage were considered.AcknowledgmentsThis standard is based on work originally developed by Cadence Design Systems, Inc. (in SDF 1.0) andOpen Verilog International (in SDF 2.0, 2.1 and 3.0). The IEEE is grateful to Cadence Design Systems andOpen Verilog International for permission to use their materials as the basis for this standard.Published by IEC under licence from IEEE. 2004 IEEE


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