1、 IEEE Standard for Boundary-Scan-Based Stimulus of Interconnections to Passive and/or Active Components Sponsored by the Test Technology Committee IEEE 3 Park Avenue New York, NY 10016-5997 USA 9 August 2012 IEEE Computer Society IEEE Std 1149.8.1-2012IEEE Std 1149.8.1-2012 IEEE Standard for Boundar
2、y-Scan-Based Stimulus of Interconnections to Passive and/or Active Components Sponsor Test Technology Committee of the IEEE Computer Society Approved 8 June 2012 IEEE-SA Standards Board Abstract: Extensions to IEEE Std 1149.1 that define the boundary-scan structures and methods required to facilitat
3、e boundary-scan-based stimulus of interconnections to passive and/or active components are specified. Such networks are not adequately addressed by existing standards, including those networks that are ac-coupled or differential. The selective ac stimulus generation enabled by this standard, when co
4、mbined with non-contact signal sensing, will allow testing of the connections between devices adhering to this standard and circuit elements such as series components, sockets, connectors, and integrated circuits (ICs) that do not implement IEEE Std 1149.1. This standard also specifies Boundary-Scan
5、 Description Language (BSDL) extensions to IEEE Std 1149.1 required to describe and support the new structures and methods. Keywords: boundary scan, Boundary-Scan Description Language, BSDL, IC, IEEE 1149.8.1, integrated circuit, loaded board testing, manufacturing defects The Institute of Electrica
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20、 time this IEEE standard was completed, the Boundary-Scan Selective Toggle Working Group had the following membership: Jeffrey Burgess, Chair Stephen Sunter, Vice Chair Kenneth P. Parker, Editor Scott Bowden Steve Butkovich Floyd Conner Adam Cron Dave Dubberke Ted Eaton Heiko Ehrenberg James J. Grea
21、lish Roman Groedl Robert Kelly Tom Langford Adam W. Ley Sophocles Metsis Skip Meyers Thai-Minh Nguyen David Paul Dirk Reese Anthony Suto The following members of the individual balloting committee voted on this standard. Balloters may have voted for approval, disapproval, or abstention. Hugh Barrass
22、 Jeffrey Burgess Juan Carreon Keith Chow Adam Cron Muhammad Dhodhi Heiko Ehrenberg Chris Gorringe Randall C. Groves P. Harrod Werner Hoelzl Rohit Kapur Adam W. Ley Greg Luri Jeffrey Moore Michael S. Newman Charles Ngethe Jim OReilly Kenneth P. Parker Gordon Robinson Bartien Sayogo Gil Shultz Kapil S
23、ood Joseph Stanco Walter Struppler Stephen Sunter David Thompson Srinivasa Vemuru John Vergis Oren Yuen Copyright 2012 IEEE. All rights reserved. viWhen the IEEE-SA Standards Board approved this standard on 8 June 2012, it had the following membership: Richard H. Hulett, Chair John Kulick, Vice Chai
24、r Robert M. Grow, Past Chair Satish Aggarwal Masayuki Ariyoshi Peter Balma William Bartley Ted Burse Clint Chaplin Wael Diab Jean-Philippe Faure Alexander Gelman Paul Houz Jim Hughes Young Kyun Kim Joseph L. Koepfinger* David J. Law Thomas Lee Hung Ling Oleg Logvinov Ted Olsen Gary Robinson Jon Walt
25、er Rosdahl Mike Seavey Yatin Trivedi Phil Winston Yu Yuan *Member Emeritus Also included are the following nonvoting IEEE-SA Standards Board liaisons: Richard DeBlasio, DOE Representative Michael Janezic, NIST Representative Julie Alessi IEEE Standards Program Manager, Document Development Kathryn B
26、ennett IEEE Standards Program Manager, Technical Program Development Copyright 2012 IEEE. All rights reserved. viiIntroduction This introduction is not part of IEEE Std 1149.8.1-2012, IEEE Standard for Boundary-Scan-Based Stimulus of Interconnections to Passive and/or Active Components. This standar
27、d defines specific modifications and capabilities that can be added to integrated circuit devices that also conform to IEEE Std 1149.1.aThis allows them to support tests on other devices, which may be active or passive, to determine if there are manufacturing defects (shorts or opens) in the interco
28、nnections between them. Notice to Readers: Users of this document will notice many links that allow the reader to jump from one location to another. For example, a text reference to 6.3.4 will be linked to the subclause itself. In order to return to the previous view, we suggest adding a page naviga
29、tion tool. This tool may be installed in the readers toolbar at the top of the document by selecting ToolsCustomize ToolbarsPage Navigation Toolbar, and checking Previous View and Next View, or by selecting ViewToolbarsPage navigation. Also helpful in navigating the document are the bookmarks and th
30、umbnails. aInformation on references can be found in Clause 2. Copyright 2012 IEEE. All rights reserved. viiiCopyright 2012 IEEE. All rights reserved. ixContents 1. Overview 1 1.1 Scope . 1 1.2 Purpose 1 1.3 Context 2 1.4 Organization of the standard 3 2. Normative references 3 3. Definitions 4 4. T
31、echnology. 6 4.1 Evolution of printed circuit assembly technology . 6 4.2 Shifts in board testing challenges 6 4.3 Signal pin types . 7 4.4 Defects targeted by the standard 12 4.5 Selective toggle theory of operation 15 5. Instructions . 21 5.1 IEEE Std 1149.1 instructions. 21 5.2 Additional instruc
32、tions added by this standard 22 5.3 TOGGLE_SETUP instruction . 22 5.4 SELECTIVE_TOGGLE instruction 23 6. Pin implementation specifications 25 6.1 Pin classification 25 6.2 Implementation of normal pins 26 6.3 Implementation of ST-pins 28 6.4 Toggle behavior for ST-pins 47 7. Toggle_Control register
33、49 7.1 Rules 50 7.2 Permissions 50 7.3 Recommendations . 50 7.4 Description 51 8. Conformance and documentation requirements . 54 8.1 Conformance . 54 8.2 Documentation. 55 8.3 BSDL package for Selective Toggle description (STD_1149_8_1_2012) 56 8.4 BSDL extension structure 58 8.5 BSDL attribute def
34、initions. 59 8.6 Example BSDL 63 Annex A (informative) Unpowered testing for open connections on printed circuit assemblies . 73 Annex B (informative) Boundary register cells that support ST-pins and IEEE 1149.6 ac-pins 80 Annex C (informative) Bibliography 82 IEEE Standard for Boundary-Scan-Based S
35、timulus of Interconnections to Passive and/or Active Components IMPORTANT NOTICE: IEEE Standards documents are not intended to ensure safety, health, or environmental protection, or ensure against interference with or from other devices or networks. Implementers of IEEE Standards documents are respo
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37、mers appear in all publications containing this document and may be found under the heading “Important Notice” or “Important Notices and Disclaimers Concerning IEEE Documents.” They can also be obtained on request from IEEE or viewed at http:/standards.ieee.org/IPR/disclaimers.html. 1. Overview 1.1
38、Scope This standard specifies extensions to IEEE Std 1149.1 that define the boundary-scan structures and methods required to facilitate boundary-scan-based stimulus of interconnections to passive and/or active components.1Such networks are not adequately addressed by existing standards, including th
39、ose networks that are ac-coupled or differential. The selective ac stimulus generation enabled by this standard, when combined with non-contact signal sensing, will allow testing of the connections between devices adhering to this standard and circuit elements such as series components, sockets, con
40、nectors, and integrated circuits (ICs) that do not implement IEEE Std 1149.1. This standard also specifies Boundary-Scan Description Language (BSDL) extensions to IEEE Std 1149.1 required to describe and support the new structures and methods. 1.2 Purpose The purpose of this standard is to codify te
41、stability circuitry added to an IC incremental to the testability provisions specified by IEEE Std 1149.1. This will enable selective ac stimulus generation that, when 1Information on references can be found in Clause 2. Copyright 2012 IEEE. All rights reserved. 1IEEE Std 1149.8.1-2012 IEEE Standard
42、 for Boundary-Scan-Based Stimulus of Interconnections to Passive and/or Active Components combined with non-contact signal sensing, allows testing signal paths between devices adhering to this standard and passive and/or active components. 1.3 Context Figure 1 shows a printed circuit assembly (PCA)
43、containing many types of devices. Of these, some could be compliant with IEEE Std 1149.1 for the support of testing activities. These devices contain boundary-scan testability circuitry that allows them to participate in manufacturing tests that detect and diagnose faults such as open solder joints,
44、 shorts, and missing devices. The additional testability elements added by this standard to these same ICs allow this interconnect testing, to be extended, to include interconnections between these ICs and passive or active components that do not support IEEE Std 1149.1, when these testability eleme
45、nts are operated in conjunction with auxiliary sensing technologies. Source: IEEE Std 1149.6-2003Figure 1 A printed circuit assembly containing a variety of components interconnected by printed wiringsome ICs contain IEEE 1149.1 features that support boundary-scan interconnect testing This standard
46、is built on top of IEEE Std 1149.1 using the same test access port (TAP) and boundary-scan architecture. It adds new instructions that cause drivers to emit ac waveforms that are compatible with auxiliary sensing technologies. There are two audiences addressed by this document. The first is made up
47、of IC device designers (device designers) and the second is a more general class of IC device users (device users). Device designers will use this standard while creating new devices that adhere to the rules of this standard. Device users will make use of those features. Device users include board a
48、nd system designers, design-for-test consultants, and test engineers. In many cases, it is expected that there will be communication and negotiation between the two groups, as the device users will lobby for investments in the silicon made by device designers who will balance these requests against
49、various factors (schedule, cost) and trade those off for enhanced testability and defect coverage. Copyright 2012 IEEE. All rights reserved. 2IEEE Std 1149.8.1-2012 IEEE Standard for Boundary-Scan-Based Stimulus of Interconnections to Passive and/or Active Components 1.4 Organization of the standard Clause 1 provides an overview and context for this standard. Clause 2 provides references necessary to understand this standard. Clause 3 defines terminology and acronyms used in this standard. Clause 4 is a tutorial that outlines the technologies addressed and
