1、 IEC 62751-2 Edition 1.0 2014-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems Part 2: Modular multilevel converters Pertes de puissance dans les valves convertisseur de source de tension (VSC) des sy
2、stmes en courant continu haute tension (CCHT) Partie 2: Convertisseurs multiniveaux modulaires IEC 62751-2:2014-08(en-fr) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2014 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be
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20、NAL STANDARD NORME INTERNATIONALE Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems Part 2: Modular multilevel converters Pertes de puissance dans les valves convertisseur de source de tension (VSC) des systmes en courant continu haute tension (CCH
21、T) Partie 2: Convertisseurs multiniveaux modulaires INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE XA ICS 29.200; 29.240 PRICE CODE CODE PRIX ISBN 978-2-8322-1836-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commissi
22、on Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 IEC 62751-2:2014 IEC 2014 CONTENTS FOREWORD . 5 1 Scope 7 2 Normat
23、ive references 7 3 Terms, definitions, symbols and abbreviated terms 7 3.1 Terms and definitions 8 3.2 Symbols and abbreviated terms 9 3.2.1 Valve and simulation data 9 3.2.2 Semiconductor device characteristics 10 3.2.3 Other component characteristics 10 3.2.4 Operating parameters 10 3.2.5 Loss par
24、ameters 11 4 General conditions. 11 4.1 General . 11 4.2 Principles for loss determination . 12 4.3 Categories of valve losses 12 4.4 Loss calculation method 13 4.5 Input parameters . 13 4.5.1 General . 13 4.5.2 Input data for numerical simulations 13 4.5.3 Input data coming from numerical simulatio
25、ns . 14 4.5.4 Converter station data . 14 4.5.5 Operating conditions 15 5 Conduction losses . 15 5.1 General . 15 5.2 IGBT conduction losses 16 5.3 Diode conduction losses . 17 5.4 Other conduction losses 18 6 DC voltage-dependent losses 19 7 Losses in d.c. capacitors of the valve 19 8 Switching los
26、ses 20 8.1 General . 20 8.2 IGBT switching losses . 20 8.3 Diode switching losses 21 9 Other losses 21 9.1 Snubber circuit losses . 21 9.2 Valve electronics power consumption 22 9.2.1 General . 22 9.2.2 Power supply from off-state voltage across each IGBT 23 9.2.3 Power supply from the d.c. capacito
27、r . 23 10 Total valve losses per HVDC substation 24 Annex A (informative) Description of power loss mechanisms in MMC valves 26 A.1 Introduction to MMC Converter topology . 26 A.2 Valve voltage and current stresses . 29 A.2.1 Simplified analysis with voltage and current in phase . 29 A.2.2 Generalis
28、ed analysis with voltage and current out of phase . 30 IEC 62751-2:2014 IEC 2014 3 A.2.3 Effects of third harmonic injection 31 A.3 Conduction losses in MMC building blocks 32 A.3.1 Description of conduction paths . 32 A.3.2 Conduction losses in semiconductors 38 A.3.3 MMC building block d.c. capaci
29、tor losses . 42 A.3.4 Other conduction losses 42 A.4 Switching losses . 42 A.4.1 Description of state changes 42 A.4.2 Analysis of state changes during cycle 44 A.4.3 Worked example of switching losses 44 A.5 Other losses . 47 A.5.1 Snubber losses 47 A.5.2 DC voltage-dependent losses 47 A.5.3 Valve
30、electronics power consumption 50 A.6 Application to other variants of valve. 52 A.6.1 General . 52 A.6.2 Two-level full-bridge MMC building block . 52 A.6.3 Multi-level MMC building blocks . 53 Bibliography 55 Figure 1 Two basic versions of MMC building block designs 15 Figure 2 Conduction paths in
31、MMC building blocks 16 Figure A.1 Phase unit of the modular multi-level converter (MMC) in basic half- bridge, two-level arrangement, with submodules . 27 Figure A.2 Phase unit of the cascaded two-level converter (CTL) in half-bridge form . 28 Figure A.3 Basic operation of the MMC converters . 29 Fi
32、gure A.4 MMC converters showing composition of valve current . 30 Figure A.5 Phasor diagram showing a.c. system voltage, converter a.c. voltage and converter a.c. current 31 Figure A.6 Effect of 3 rdharmonic injection on converter voltage and current . 32 Figure A.7 Two functionally equivalent varia
33、nts of a “half-bridge”, two-level MMC building block 33 Figure A.8 Conducting states in “half-bridge”, two-level MMC building block 34 Figure A.9 Typical patterns of conduction for inverter operation (left) and rectifier operation (right) 35 Figure A.10 Example of converter with only one MMC buildin
34、g block per valve to illustrate switching behaviour 36 Figure A.11 Inverter operation example of switching events . 36 Figure A.12 Rectifier operation example of switching events 37 Figure A.13 Valve current and mean rectified valve current 39 Figure A.14 IGBT and diode switching energy as a functio
35、n of collector current . 43 Figure A.15 Valve voltage, current and switching behaviour for a hypothetical MMC valve consisting of 5 submodules 45 Figure A.16 Power supply from IGBT terminals 50 Figure A.17 Power supply from IGBT terminals in cell 51 Figure A.18 Power supply from d.c. capacitor in su
36、bmodule . 52 Figure A.19 One “full-bridge”, two-level MMC building block 52 4 IEC 62751-2:2014 IEC 2014 Figure A.20 Four possible variants of three-level MMC building block 54 Table 1 Contributions to valve losses in different operating modes 25 Table A.1 Hard switching events 42 Table A.2 Soft swit
37、ching events . 44 Table A.3 Summary of switching events from Figure A.15 46 IEC 62751-2:2014 IEC 2014 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ POWER LOSSES IN VOLTAGE SOURCED CONVERTER (VSC) VALVES FOR HIGH-VOLTAGE DIRECT CURRENT (HVDC) SYSTEMS Part 2: Modular multilevel converters FOREWORD 1)
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48、me of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62751-2 has been prepared by subcommittee 22F: Power electronics for electrical transmission and distribution sy
49、stems, of IEC technical committee 22: Power electronic systems and equipment. The text of this standard is based on the following documents: CDV Report on voting 22F/303/CDV 22F/322A/RVC Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
