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    IEC 62047-13-2012 Semiconductor devices - Micro-electromechanical devices - Part 13 Bend- and shear-type test methods of measuring adhesive strength for MEMS st.pdf

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    IEC 62047-13-2012 Semiconductor devices - Micro-electromechanical devices - Part 13 Bend- and shear-type test methods of measuring adhesive strength for MEMS st.pdf

    1、 IEC 62047-13 Edition 1.0 2012-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 13:

    2、 Mthodes dessais de types courbure et cisaillement de mesure de la rsistance dadhrence pour les structures MEMS IEC 62047-13:2012 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2012 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reprod

    3、uced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtain

    4、ing additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce so

    5、it et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de la CEI ou du Comit national de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur cette publication,

    6、 utilisez les coordonnes ci-aprs ou contactez le Comit national de la CEI de votre pays de rsidence. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC)

    7、is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition

    8、, a corrigenda or an amendment might have been published. Useful links: IEC publications search - www.iec.ch/searchpub The advanced search enables you to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, replaced and

    9、 withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published details all new publications released. Available on-line and also once a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of

    10、 electronic and electrical terms containing more than 30 000 terms and definitions in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical Vocabulary (IEV) on-line. Customer Service Centre - webstore.iec.ch/csc If you wish to give us you

    11、r feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. A propos de la CEI La Commission Electrotechnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des Normes internationales pour tout ce qui a trait llect

    12、ricit, llectronique et aux technologies apparentes. A propos des publications CEI Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Liens utiles: Recherche de publicati

    13、ons CEI - www.iec.ch/searchpub La recherche avance vous permet de trouver des publications CEI en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Elle donne aussi des informations sur les projets et les publications remplaces ou retires. Just Published CEI - webstore.iec.ch/jus

    14、tpublished Restez inform sur les nouvelles publications de la CEI. Just Published dtaille les nouvelles publications parues. Disponible en ligne et aussi une fois par mois par email. Electropedia - www.electropedia.org Le premier dictionnaire en ligne au monde de termes lectroniques et lectriques. I

    15、l contient plus de 30 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International (VEI) en ligne. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur c

    16、ette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 62047-13 Edition 1.0 2012-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structure

    17、s Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 13: Mthodes dessais de types courbure et cisaillement de mesure de la rsistance dadhrence pour les structures MEMS INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE P ICS 31.080.99 PRICE CODE COD

    18、E PRIX ISBN 978-2-88912-937-9 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obten

    19、u cette publication via un distributeur agr. 2 62047-13 IEC:2012 CONTENTS FOREWORD . 3 1 Scope . 5 2 Normative references . 5 3 Terms and definitions . 5 4 Test method . 6 4.1 General . 6 4.2 Data analysis 7 5 Test equipment . 8 5.1 General . 8 5.2 Actuator 8 5.3 Force measurement sensor . 8 5.4 Ali

    20、gnment system 8 5.5 Recorder . 8 6 Test pieces . 9 6.1 Design of test pieces . 9 6.2 Preparation of test pieces 9 7 Test conditions . 9 7.1 Method for gripping . 9 7.2 Speed of testing 9 7.3 Alignment of test piece 9 7.4 Test environment. 10 8 Test report 10 Annex A (informative) Technical backgroun

    21、d . 11 Bibliography 14 Figure 1 Columnar test pieces . 6 Figure 2 Adhesive strength test method . 7 Figure 3 Alignment between columnar test piece and loading tool 10 Figure A.1 Example of the RRT results (see 1) 11 Figure A.2 Effects of aspect ratio of columnar test piece on the stress condition in

    22、 bend type test (see 2) . 12 Figure A.3 Effects of knife edge angle of loading tool and aspect ratio of columnar test piece on the stress condition in bend test . 13 62047-13 IEC:2012 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 13: Bend -

    23、and shear - type test methods of measuring adhesive strength for MEMS structures FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to prom

    24、ote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides

    25、(hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC als

    26、o participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possi

    27、ble, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. Whi

    28、le all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake

    29、to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestati

    30、on of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of th

    31、is publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or in

    32、direct, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for

    33、the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62047-13 has been p

    34、repared by subcommittee 47F: Micro- electromechanical systems, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47F/109/FDIS 47F/119/RVD Full information on the voting for the approval of this standard can be f

    35、ound in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 62047-13 IEC:2012 A list of all parts of IEC 62047 series, published under the general title Semiconductor devices Micro-electromechanical devices, can be

    36、 found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, wi

    37、thdrawn, replaced by a revised edition, or amended. 62047-13 IEC:2012 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures 1 Scope This part of IEC 62047 specifies the adhesive testing method between

    38、micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 m to 1 mm, respectively. Micro-sized elements of MEMS devices are mad

    39、e up of laminated fine pattern films on a substrate, which are fabricated by deposition, plating, and/or coating with photolithography. MEMS devices include a large number of interfaces between dissimilar materials, at which delamination occasionally occurs during fabrication or in operation. Combin

    40、ation of the materials at the junction determines the adhesive strength; moreover, defects and residual stress in the vicinity of the interface, which are changing by processing condition, strongly affect the adhesive strength. This standard specifies the adhesive testing method for micro- sized-ele

    41、ments in order to optimally select materials and processing conditions for MEMS devices. This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine

    42、for micro-sized materials has not been generalized. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edi

    43、tion of the referenced document (including any amendments) applies. IEC 62047-2:2006, Semiconductor devices Micro-electromechanical devices Part 2: Tensile testing method of thin film materials 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. 3.1

    44、adhesive bend strength nominal strength at failure on adhesive joint area by bending mode 3.2 adhesive shear strength nominal strength at failure on adhesive joint area by shear mode 6 62047-13 IEC:2012 D S T 3 1 2 l c 4 3 4S 4 D l c3 2 4 3 1 T IEC 192/12 Key Configurations or specimen Dimensions of

    45、 specimen 1 Top view D diameter of columnar test piece 2 Side view l clength of columnar test piece 3 Column type test piece l c /D aspect ratio of columnar test piece 4 Substrate thickness of substrate S spacing between columnar test pieces Figure 1 Columnar test pieces 4 Test method 4.1 General Th

    46、is standard specifies the adhesive testing methods between a columnar test piece (see Figure 1) and substrate. Displacement or force is applied to a columnar test piece at a constant speed and the force at delamination is measured to analyze the adhesive strength between the columnar test piece and

    47、substrate. A knife edge shape with tapered tip is utilized as the loading tool to apply the force to a columnar test piece. The angle of the knife edge is changed by loading types of measuring adhesive strength as follows. In case of measuring adhesive bend strength by applying bending force at the

    48、end of a columnar test piece (bend type test), the knife edge of loading tool is used by slanting its apex in the upper direction against the test piece as shown in Figure 2 a). In such a case, it is easier to align the loading tool and a test piece since point load is applied at the end of the colu

    49、mnar test piece. Attention should be drawn to the fact that the bend type test is not pure bending, which includes compression component to the columnar root. The compression component increases by increasing the contact angle of the knife edge. In order to minimize the effect of compression component, the contact angle of the knife edge ( b ) should be within a range of from 10 to 20.


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