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    IEC 61837-1-2012 Surface mounted piezoelectric devices for frequency control and selection - Standard outline and terminal lead connections - Part 1 Plastic mou.pdf

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    IEC 61837-1-2012 Surface mounted piezoelectric devices for frequency control and selection - Standard outline and terminal lead connections - Part 1 Plastic mou.pdf

    1、 IEC 61837-1 Edition 2.0 2012-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounted piezoelectric devices for frequency control and selection Standard outlines and terminal lead connections Part 1: Plastic moulded enclosure outlines Dispositifs pizolectriques montage en surface pour la comm

    2、ande et le choix de la frquence Encombrements normaliss et connexions des sorties Partie 1: Encombrements des enveloppes en plastique moules IEC61837-1:2012 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2012 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of thi

    3、s publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or h

    4、ave an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise s

    5、ous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de la CEI ou du Comit national de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmenta

    6、ires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de la CEI de votre pays de rsidence. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electro

    7、technical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that

    8、you have the latest edition, a corrigenda or an amendment might have been published. Useful links: IEC publications search - www.iec.ch/searchpub The advanced search enables you to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives informatio

    9、n on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published details all new publications released. Available on-line and also once a month by email. Electropedia - www.electropedia.org The worlds l

    10、eading online dictionary of electronic and electrical terms containing more than 30 000 terms and definitions in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical Vocabulary (IEV) on-line. Customer Service Centre - webstore.iec.ch/csc

    11、 If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. A propos de la CEI La Commission Electrotechnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des Normes internationales pou

    12、r tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications CEI Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Liens uti

    13、les: Recherche de publications CEI - www.iec.ch/searchpub La recherche avance vous permet de trouver des publications CEI en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Elle donne aussi des informations sur les projets et les publications remplaces ou retires. Just Publishe

    14、d CEI - webstore.iec.ch/justpublished Restez inform sur les nouvelles publications de la CEI. Just Published dtaille les nouvelles publications parues. Disponible en ligne et aussi une fois par mois par email. Electropedia - www.electropedia.org Le premier dictionnaire en ligne au monde de termes le

    15、ctroniques et lectriques. Il contient plus de 30 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International (VEI) en ligne. Service Clients - webstore.iec.ch/csc Si vous dsirez nous do

    16、nner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61837-1 Edition 2.0 2012-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounted piezoelectric devices for frequency control and selection Standard outlines and terminal lead connections P

    17、art 1: Plastic moulded enclosure outlines Dispositifs pizolectriques montage en surface pour la commande et le choix de la frquence Encombrements normaliss et connexions des sorties Partie 1: Encombrements des enveloppes en plastique moules INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTR

    18、OTECHNIQUE INTERNATIONALE S ICS 31.140 PRICE CODE CODE PRIX ISBN 978-2-88912-042-0 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor.

    19、 Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 61837-1 IEC:2012 CONTENTS FOREWORD . 3 1 Scope . 5 2 Normative references . 5 3 Configuration of enclosures 5 4 Designation of types . 5 5 Plastic moulded enclosure dimensions . 6 6 Lead connections .

    20、 6 7 Plastic moulded enclosures 6 Table 1 Designation of plastic moulded enclosures 6 61837-1 IEC:2012 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS Part 1: Plastic moulded enclo

    21、sure outlines FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standard

    22、ization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation

    23、is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the

    24、 International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects

    25、since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical cont

    26、ent of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possib

    27、le in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformit

    28、y assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors

    29、, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out

    30、 of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn t

    31、o the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. lnternational Standard IEC 61837-1 has been prepared by IEC technical committee 49: Piezoelectric, dielectric and

    32、electrostatic devices and associated materials for frequency control, selection and detection. This second edition cancels and replaces the first edition published in 1999. It is a technical revision. This edition includes the following significant technical changes with respect to the previous edit

    33、ion: one enclosure type (SIP-L5/01) has been deleted; Configuration symbol of enclosures is currently consolidated into one as DCC (dual chip carrier). 4 61837-1 IEC:2012 The text of this standard is based on the following documents: CDV Report on voting 49/930/CDV 49/969/RVC Full information on the

    34、 voting for the approval of this standard can be found in the report on voting indicated in the above table. This lnternational Standard shall be read in conjunction with IEC 61240:1994. IEC 61240:1994 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency con

    35、trol and selection in plastic moulded enclosures. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 61837 series, published under the general title Surface mounted piezoelectric devices for frequency control and selection Standard out

    36、lines and terminal lead connections, can be found on the IEC web site. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this d

    37、ate, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 61837-1 IEC:2012 5 SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS Part 1: Plastic moulded enclosure outlines 1 Scope This part of

    38、 IEC 61837 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in plastic moulded enclosures and is based on IEC 61240. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document an

    39、d are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 61240: 1994, Piezoelectric devices Preparation of outline drawings of surface-mounted devices (

    40、SMD), for frequency control and selection General rules13 Configuration of enclosures These enclosures are made of plastic moulded materials with the terminal leads based on the descriptive designation system for semiconductors, devices package. The configuration symbols are shown as follows: DCC (d

    41、ual chip carrier) 4 Designation of types The designation of types is shown in four parts as follows: A: Configuration symbol of enclosures: DCC (dual chip carrier); B: Structure of terminal leads: J: leaded type; C: Number of terminal leads D: Two digit serial number _ 1A new edition is under consid

    42、eration. B C D D A 6 61837-1 IEC:2012 5 Plastic moulded enclosure dimensions The dimensions in this standard apply to all the completed SMD-devices for frequency control and selection. Only those dimensions are given which meet the requirements of IEC 61240. 6 Lead connections Recommendations for th

    43、e lead connections of all completed SMD-devices for frequency control and selection are given in the following individual sheets. Lead connections shall always be given in the detail specification. 7 Plastic moulded enclosures The following table sets out the designation of the plastic moulded enclo

    44、sures as outlined in the ensuing specification sheets. Table 1 Designation of plastic moulded enclosures No. Type Sheet No. Description 1 DCC-J4/01 Sheet 1 Plastic, moulded, four folded leads SMD outline 2 DCC-J4/02 Sheet 2 Plastic, moulded, four folded leads SMD outline 3 DCC-J4/03 Sheet 3 Plastic,

    45、 moulded, four folded leads SMD outline 4 DCC-J4/04 Sheet 4 Plastic, moulded, four folded leads SMD outline 5 DCC-J4/05 Sheet 5 Plastic, moulded, four folded leads SMD outline 6 DCC-J4/06 Sheet 6 Plastic, moulded, four folded leads SMD outline 7 DCC-J4/07 Sheet 7 Plastic, moulded, four folded leads

    46、SMD outline 8 DCC-J4/08 Sheet 8 Plastic, moulded, four folded leads SMD outline 61837-1 IEC:2012 7 Ref.Dimensions (mm)NotesMin. Nom. Max.5,087,62ABGG1K1K2FLBee1b2l2yA3bpLp0,400,209,401,700,401,0014,008,904,704,200,600,309,802,100,802,300,100,601,604 31 2AB Fy SSG1GeK1LBb2l2ee1A3K2LpbpActual sizeTerm

    47、inal configurationTerminal land areas0,30Plastic, moulded, four folded leads SMD outline, type DCC-J4/01 Scale 2:1 Sheet 1 IEC 519/12 8 61837-1 IEC:2012 Terminal lead connections If the presence of any leads is optional, or if an enclosure is supplied with less than the maximum number of leads, this

    48、 shall be indicated in the detail specification. Type of SMD Lead No. Crystal unit Crystal oscillator Crystal filter DCC-J4/01 1 2 3 4 Control voltage Ground Output DC supply 61837-1 IEC:2012 9 Ref.Dimensions (mm)NotesMin. Nom. Max.5,084,60ABGG1K1K2FLBee1b2l2yA3bpLp0,400,150,800,400,6010,505,302,702

    49、,500,600,255,801,200,801,400,100,601,200,20A3421B FG G1SSyeK1 LBA3K2Lpbpb2l2ee1Actual sizeTerminal configurationTerminal land areasPlastic, moulded, four folded leads SMD outline, type DCC-J4/02 Scale 2:1 Sheet 2 IEC 520/12 10 61837-1 IEC:2012 Terminal lead connections If the presence of any leads is optional, or if an enclosure is supplied with less than the maximum number of


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