1、 IEC 61188-5-5 Edition 1.0 2007-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Printed boards and printed board assemblies Design and use Part 5-5: Attachment (land/joint) considerations Components with gull-wing leads on four sides Cartes imprimes et cartes imprimes quipes Conception et utilisation
2、 Partie 5-5: Considrations sur les liaisons pistes-soudures Composants sorties en aile de mouette sur quatre cts IEC 61188-5-5:2007 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be repr
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17、d boards and printed board assemblies Design and use Part 5-5: Attachment (land/joint) considerations Components with gull-wing leads on four sides Cartes imprimes et cartes imprimes quipes Conception et utilisation Partie 5-5: Considrations sur les liaisons pistes-soudures Composants sorties en ail
18、e de mouette sur quatre cts INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE X ICS 31.180 PRICE CODE CODE PRIX ISBN 2-8318-1061-6 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2
19、61188-5-5 IEC:2007 CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references .7 3 General information7 3.1 General component description .7 3.2 Marking .7 3.3 Carrier packaging format.8 3.4 Process considerations .8 4 PQFP (square) .8 4.1 Field of application 8 4.2 Component descriptions8
20、4.3 Component dimensions .9 4.4 Solder joint fillet design .13 4.5 Land pattern dimensions .14 5 PQFP (rectangular) 17 5.1 Field of application 17 5.2 Component descriptions18 5.3 Component dimensions .19 5.4 Solder joint fillet design .19 5.5 Land pattern dimensions .21 6 PLQFP (square) .23 6.1 Fie
21、ld of application 23 6.2 Component descriptions23 6.3 Component dimensions .24 6.4 Solder joint fillet design .26 6.5 Land pattern dimensions .28 7 PLQFP (rectangular) 31 7.1 Field of application 31 7.2 Component descriptions31 7.3 Component dimensions .32 7.4 Solder joint fillet design .33 7.5 Land
22、 pattern dimensions .34 8 PTQFP (square) .35 8.1 Field of application 35 8.2 Component descriptions35 8.3 Component dimensions .36 8.4 Solder joint fillet design .39 8.5 Land pattern dimensions .40 Bibliography43 Figure 1 PQFP (square).9 Figure 2 PQFP (square) component dimensions 10 Figure 3 Solder
23、 joint fillet design14 Figure 4 PQFP (square) land pattern dimensions.17 61188-5-5 IEC:2007 3 Figure 5 PQFP (rectangular)18 Figure 6 PQFP (rectangular) component dimensions .19 Figure 7 Solder joint fillet design21 Figure 8 PQFP (rectangular) land pattern dimensions 22 Figure 9 PLQFP (square).23 Fig
24、ure 10 PLQFP (square) component dimensions 24 Figure 11 Solder joint fillet design28 Figure 12 PLQFP (square) land pattern dimensions .31 Figure 13 PLQFP (rectangular) 32 Figure 14 PLQFP (rectangular) component dimensions32 Figure 15 Solder joint fillet design34 Figure 16 PLQFP (rectangular) land pa
25、ttern dimensions 35 Figure 17 PTQFP (square).36 Figure 18 PTQFP component dimensions 37 Figure 19 Solder joint fillet design40 Figure 20 PTQFP land pattern dimensions.42 4 61188-5-5 IEC:2007 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES DESIGN AND USE Part 5
26、-5: Attachment (land/joint) considerations Components with gull-wing leads on four sides FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is
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35、eliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of th
36、e elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61188-5-5 has been prepared by IEC technical committee 91: Electronics assembly technology. This bilingual version, publ
37、ished in 2009-09, corresponds to the English version. The text of this standard is based on the following documents: FDIS Report on voting 91/704/FDIS 91/736/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The Fr
38、ench version of this standard has not been voted upon. 61188-5-5 IEC:2007 5 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. IEC 61188-5-5 is to be read in conjunction with IEC 61188-5-1. A list of all parts of the IEC 61188 series, under the general title Printed
39、 boards and printed board assemblies Design and use, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specifi
40、c publication. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. 6 61188-5-5 IEC:2007 INTRODUCTION This part of IEC 61188 covers land patterns for components with gull-wing leads on four sides. Each clause gives information in accordance with th
41、e following format. The proposed land pattern dimensions in this standard are based upon the fundamental tolerance calculation combined with the given land protrusions and courtyard excesses (see IEC 61188-5-1, Generic requirements). The courtyard includes all issues of the normal manufacturing nece
42、ssities. The unaltered land pattern dimensions of this part are generally applicable for the solder paste application plus reflow soldering process. For application of the wave soldering process, the land pattern dimensions normally have to be modified. Orientation parallel to the wave direction is
43、preferable and special, suitably dimensioned solder thieves should be added. This standard offers a threefold land pattern dimensioning (levels 1, 2, and 3) on the basis of a threefold set of land protrusions and courtyard excesses: maximum (max.); median (mdn) and minimum (min.). Each land pattern
44、has been assigned an identification number to indicate the characteristics of the specific robustness of the land patterns. Users also have the opportunity to organize the information so that it is most useful for their particular design. If a user has good reason to use a concept different from tha
45、t of IEC 61188-5-1, or if the user prefers unusual land protrusions, this standard should be used for checking the resulting solder fillet size. It is the responsibility of the user to verify the SMD land patterns used for achieving an undisturbed mounting process including testing and an ensured re
46、liability for the product stress conditions in use. Component dimensions listed in this standard are those available on the market and should be regarded as for reference only. 61188-5-5 IEC:2007 7 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES DESIGN AND USE Part 5-5: Attachment (land/joint) considera
47、tions Components with gull-wing leads on four sides 1 Scope This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate
48、 size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, prov
49、iding information on the component, the component dimensions, the solder joint design and the land pattern dimensions. The land pattern dimensions are based on a mathematical model that establishes a platform for a solder joint attachment to the printed board. The existing models create a platform that is capable of establishing a reliable solder a
