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    IEC 61000-4-23-2016 Electromagnetic compatibility (EMC) - Part 4-23 Testing and measurement techniques - Test methods for protective devices for HEMP and other .pdf

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    IEC 61000-4-23-2016 Electromagnetic compatibility (EMC) - Part 4-23 Testing and measurement techniques - Test methods for protective devices for HEMP and other .pdf

    1、 IEC 61000-4-23 Edition 2.0 2016-10 INTERNATIONAL STANDARD Electromagnetic compatibility (EMC) Part 4-23: Testing and measurement techniques Test methods for protective devices for HEMP and other radiated disturbances IEC 61000-4-23:2016-10(en) BASIC EMC PUBLICATION colour inside THIS PUBLICATION IS

    2、 COPYRIGHT PROTECTED Copyright 2016 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from eith

    3、er IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. IEC

    4、Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical

    5、, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. IEC Catalogue - webstore.iec.ch/catalogue The s

    6、tand-alone application for consulting the entire bibliographical information on IEC International Standards, Technical Specifications, Technical Reports and other documents. Available for PC, Mac OS, Android Tablets and iPad. IEC publications search - www.iec.ch/searchpub The advanced search enables

    7、 to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published details all ne

    8、w publications released. Available online and also once a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing 20 000 terms and definitions in English and French, with equivalent terms in 15 additional languages. Also

    9、known as the International Electrotechnical Vocabulary (IEV) online. IEC Glossary - std.iec.ch/glossary 65 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002. Some entries have been collected from earli

    10、er publications of IEC TC 37, 77, 86 and CISPR. IEC Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. IEC 61000-4-23 Edition 2.0 2016-10 INTERNATIONAL STANDARD Elec

    11、tromagnetic compatibility (EMC) Part 4-23: Testing and measurement techniques Test methods for protective devices for HEMP and other radiated disturbances INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 33.100.99 ISBN 978-2-8322-3687-1 BASIC EMC PUBLICATION Registered trademark of the International El

    12、ectrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. colour inside 2 IEC 61000-4-23:2016 IEC 2016 CONTENTS FOREWORD . 6 INTRODUCTION . 8 1 Scope 9 2 Normative references 9 3 Terms and definitions 10 4 HEMP test concepts 15 4.1 General . 15 4

    13、.2 Testing of shielding enclosures . 16 4.2.1 General . 16 4.2.2 Buildings . 19 4.2.3 Shelters and shielded rooms 20 4.2.4 Cabinets, racks and boxes . 21 4.3 Testing of shielded cables and connectors 23 4.3.1 General . 23 4.3.2 Testing of cable shields . 23 4.3.3 Testing of cable connectors . 26 4.4

    14、 Testing of shielding materials 27 4.4.1 General . 27 4.4.2 Conducting gaskets . 27 4.4.3 Conducting sheets and screens . 29 4.4.4 Cut-off waveguides and honeycombs . 32 4.5 Summary of test concepts . 33 5 Test methods for measuring the shielding effectiveness of HEMP protection facilities . 34 5.1

    15、General . 34 5.2 Electromagnetic field testing . 34 5.2.1 General . 34 5.2.2 Pulse field testing 34 5.2.3 CW field testing . 40 5.3 Current injection test procedures 55 5.3.1 General . 55 5.3.2 Injection testing of enclosures . 55 5.3.3 Transfer impedance and admittance of cable shields and connecto

    16、rs 57 5.3.4 Testing of gasket material 57 Annex A (informative) HEMP test concepts for electrical systems 60 A.1 Overview. 60 A.2 Types of HEMP tests 60 A.2.1 General . 60 A.2.2 System-level transient tests . 60 A.2.3 CW field illumination tests . 61 A.2.4 Current injection testing . 61 A.2.5 Partia

    17、l illumination testing 62 A.2.6 Subsystem and component testing 62 A.3 Definition of the testing interface . 63 A.4 Use of test data 65 A.4.1 General . 65 IEC 61000-4-23:2016 IEC 2016 3 A.4.2 Acceptance of new systems . 65 A.4.3 System assessments . 65 A.4.4 Hardness surveillance monitoring 65 A.4.5

    18、 System design . 65 A.5 Testing uncertainties . 66 Annex B (informative) Characterization of shielded cables . 67 B.1 Fundamentals of cable shielding . 67 B.2 Definitions of transfer impedance and transfer admittance 68 B.3 Relative significance of Z tand Y t. 71 Annex C (informative) Equipment for

    19、HEMP pulse measurements 72 C.1 General . 72 C.2 Sensors for HEMP measurements . 72 C.2.1 B- and H-field sensors . 72 C.2.2 D- and E-field sensors . 74 C.2.3 Current sensors . 76 C.3 Signal transmission . 77 C.3.1 General . 77 C.3.2 Fibre optic links . 77 C.3.3 Fibre optic transducers 78 C.4 Signal d

    20、etection and processing . 78 Annex D (informative) Equipment for CW testing . 80 D.1 General . 80 D.2 Antenna system 80 D.3 Power amplifier . 82 D.4 Receiver (network analyser) 83 D.5 Reference and response sensors 83 D.6 Fibre optic system . 85 D.7 Limitations of measurements 88 Annex E (informativ

    21、e) Characterization of a planar shield for HEMP protection 89 E.1 General . 89 E.2 Problem geometry . 90 E.3 Equivalent circuit representation . 91 E.3.1 General . 91 E.3.2 Chain parameter representation of the shield . 92 E.3.3 Circuit responses . 93 Annex F (informative) Inside-to-out measurement

    22、method . 97 F.1 Purpose 97 F.2 Comparison of existing SE test methods . 97 F.3 Inside-to-out SE test of shielded rooms . 98 F.3.1 Measurements of the inside-to-out SE . 98 F.3.2 Summary . 101 Bibliography 102 Figure 1 Example of measured magnitude and phase of the transfer function T( ) = H in /H ou

    23、tfor a shielded enclosure 17 Figure 2 Electric field and magnetic field shielding effectiveness of a 0,5 mm thick aluminum enclosure 29 . 18 Figure 3 Measured magnetic field shielding effectiveness SE Hfor a building 19 4 IEC 61000-4-23:2016 IEC 2016 Figure 4 Conceptual illustration of the HEMP test

    24、 of a building 19 Figure 5 Illustration of a shielded room or enclosure excited by HEMP fields . 21 Figure 6 Illustration of equipment racks, cabinets and box excited by internal HEMP disturbance . 21 Figure 7 A general shield excited by current injection 22 Figure 8 Basic configuration for transfer

    25、 impedance measurement . 24 Figure 9 Measured transfer impedance magnitude and phase of transfer impedance per unit length for four braided shield cables with good shielding properties . 25 Figure 10 Basic configuration for transfer admittance measurement . 26 Figure 11 Test configuration for transf

    26、er impedance measurement of a cable connector 26 Figure 12 Examples of conducting gaskets used as HEMP protection devices . 28 Figure 13 Circuit model representing the behaviour of a conducting gasket for HEMP protection . 28 Figure 14 Measurement configuration for the resistivity of a sample . 29 F

    27、igure 15 Test concept for measuring the resistivity with surface probes . 30 Figure 16 Concepts for shielding effectiveness measurement of conducting sheets and screens 32 Figure 17 Example of the calculated plane-wave shielding effectiveness of a 0,01 mm thick plate of different material as a funct

    28、ion of frequency 32 Figure 18 Cut-off waveguides and honeycomb used as protective elements . 33 Figure 19 Examples of full-scale, pulse-radiating HEMP simulators 37 Figure 20 Test procedure for the pulse test 39 Figure 21 Typical configuration of a CW test facility . 40 Figure 22 Example CW measurem

    29、ent set-up . 41 Figure 23 Test and analysis procedures for conducting a CW test 42 Figure 24 Analysis flow diagram for extrapolating a measured CW spectrum to the HEMP response 43 Figure 25 Example scan from 9 kHz to 3 GHz for the ambient electromagnetic field from communication signals 44 Figure 26

    30、 Test procedure for the ambient EM excitation test 45 Figure 27 Double-ended TEM cell for field illumination testing of small enclosures 46 Figure 28 Example test set-up for field illumination in the TEM cell 47 Figure 29 Illustration of the single-ended TEM cell and associated equipment . 48 Figure

    31、 30 Test set-up for the plane-wave shielding effectiveness measurements . 50 Figure 31 Test set-up for the H-field shielding effectiveness measurements . 51 Figure 32 Example of antenna locations for the localized antenna tests for a hypothetical shielded enclosure or facility . 52 Figure 33 Test co

    32、ncept and equipment configuration for current injection testing of a shielded enclosure or box . 56 Figure 34 Surface probe for volume resistivity measurement . 59 Figure A.1 Sample HEMP interaction diagram illustrating penetration mechanisms, system responses and generic test interface locations 64

    33、 Figure B.1 Geometry of a shielded coaxial line with an internal circuit . 67 Figure B.2 Coaxial cable located over a conducting ground plane 68 Figure B.3 Two per-unit-length circuits formed by the sheath and its ground return, and the sheath and the internal conductor 69 IEC 61000-4-23:2016 IEC 20

    34、16 5 Figure C.1 Magnetic field sensors 23 . 73 Figure C.2 Single-slot, cylindrical coil sensor 23 73 Figure C.3 Two- and four-slot cylindrical coil sensors 23 74 Figure C.4 Electrical configuration of an E-field sensor 23 . 74 Figure C.5 Biconical E-field sensor 75 Figure C.6 E-field sensor mounted

    35、on a conducting ground plane 23 . 75 Figure C.7 Equipotential shapes for an optimally designed E-field sensor 23 . 75 Figure C.8 Rogowski coil used for current measurements 23 . 76 Figure C.9 Toroidal current sensor made of magnetic material 23 76 Figure C.10 Voltage pick-up points on the edges of t

    36、he toroidal sensor 23 . 76 Figure C.11 Example of a single-channel fibre optic transmission system 23 . 77 Figure C.12 Attenuation of coaxial lines and fibre optic cables as a function of frequency 78 Figure D.1 Various antennas for CW testing. 81 Figure D.2 Relationship between the CW antenna and t

    37、he incident HEMP field . 82 Figure D.3 Incident and ground-reflected field contributions to the reference sensor excitations 84 Figure D.4 Measured reference H-field spectrum and its inverse Fourier transform 85 Figure D.5 Measured sensor responses and calibration function 87 Figure D.6 Measured tra

    38、nsfer function, corrected by calibration file . 87 Figure E.1 Example of a general shielding problem 89 Figure E.2 Behaviour of the impedance ratio EH as a function of distance from a source 29 90 Figure E.3 Conducting slab of thickness, d, and infinite extent serving as an electromagnetic barrier .

    39、 91 Figure E.4 Equivalent circuit representation of the shielding problem . 92 Figure E.5 Two-port representation of a circuit . 93 Figure F.1 Test set-up for the outside-to-in and inside-to-out SE measurement 100 Table 1 Recommended test procedure for different test objects . 34 Table 2 Dimensions

    40、and composition of distances d 1to d 3 , with reference to Figure 30 50 Table 3 Dimensions and composition of distances d 1to d 3 , with reference to Figure 31 51 Table 4 Measurement frequencies and antennas in plane-wave . 52 Table 5 Measurement frequencies and antennas in magnetic field . 54 Table

    41、 E.1 Surface resistance and electrical parameters for selected materials . 95 Table F.1 Comparison with other standards . 98 Table F.2 Test shielded rooms . 99 Table F.3 Comparison of the SE measurement results . 101 6 IEC 61000-4-23:2016 IEC 2016 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ELECTROM

    42、AGNETIC COMPATIBILITY (EMC) Part 4-23: Testing and measurement techniques Test methods for protective devices for HEMP and other radiated disturbances FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechni

    43、cal committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

    44、Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, gove

    45、rnmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions

    46、 or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for internatio

    47、nal use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order t

    48、o promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly

    49、 indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest editi


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