1、INTERNATIONALSTANDARDIEC60539-2First edition2003-11Directly heated negative temperaturecoefficient thermistors Part 2:Sectional specification Surface mount negative temperaturecoefficient thermistorsReference numberIEC 60539-2:2003(E)Copyright International Electrotechnical Commission Provided by IH
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9、hout license from IHS-,-INTERNATIONALSTANDARDIEC60539-2First edition2003-11Directly heated negative temperaturecoefficient thermistors Part 2:Sectional specification Surface mount negative temperaturecoefficient thermistors IEC 2003 Copyright - all rights reservedNo part of this publication may be r
10、eproduced or utilized in any form or by any means, electronic ormechanical, including photocopying and microfilm, without permission in writing from the publisher.International Electrotechnical Commission, 3, rue de Varemb, PO Box 131, CH-1211 Geneva 20, SwitzerlandTelephone: +41 22 919 02 11 Telefa
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12、on or networking permitted without license from IHS-,- 2 60539-2 IEC:2003(E)CONTENTSFOREWORD 41 General . 61.1 Scope. 61.2 Normative references . 61.3 Information to be given in a detail specification. 61.3.1 Outline drawing and dimensions . 71.3.2 Mounting. 71.3.3 Ratings and characteristics. 71.4
13、Terminology 72 Preferred ratings and characteristics 72.1 Tolerances on rated zero-power resistance 72.2 Climatic categories . 73 Quality assessment procedures . 83.1 Primary stage of manufacture . 83.2 Structurally similar components 83.3 Qualification approval procedures. 83.3.1 The manufacturer s
14、hall comply with 3.4 of IEC 60539-1 83.4 Quality conformance inspection 83.4.1 Qualification approval on the basis of the fixed sample sizeprocedure . 83.5 Quality conformance inspection .103.5.1 Formation of inspection lots .103.5.2 Test schedule 113.5.3 Delayed delivery 113.5.4 Assessment level.11
15、4 Test and measurement procedures .124.1 Mounting .124.2 Drying and recovery.124.2.1 Drying124.2.2 Recovery .124.3 Visual examination and check of dimensions .124.3.1 Visual examination.124.3.2 Requirements 124.3.3 Marking144.3.4 Dimensions144.4 Electrical tests .144.4.1 Zero-power resistance .144.4
16、.2 B-value or resistance ratio .144.4.3 Resistance/temperature characteristic .154.5 Thermal tests.154.5.1 Dissipation factor ()154.5.2 Thermal time constant by cooling after self-heating (c).15Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo
17、 reproduction or networking permitted without license from IHS-,-60539-2 IEC:2003(E) 3 4.6 Resistance to soldering heat .154.6.1 Initial measurement .154.6.2 Test conditions 154.6.3 Recovery.164.6.4 Final inspection, measurements and requirements 164.7 Solderability 164.7.1 Test conditions 164.7.2 R
18、ecovery.174.7.3 Final inspection, measurements and requirements 174.8 Rapid change of temperature 174.9 Thermal shock.174.10 Climatic sequence .184.10.1 Initial measurements .184.10.2 Dry heat 184.10.3 Damp heat (cyclic), first cycle184.10.4 Cold 184.10.5 Damp heat (cyclic), remaining cycles.184.10.
19、6 Final measurements 194.11 Damp heat, steady state194.12 Endurance.194.12.1 Endurance at 3and Pmax.194.12.2 Endurance at upper category temperature .194.13 Shear (adhesion) test 204.14 Substrate bending test 204.15 Component solvent resistance.204.16 Solvent resistance of marking20Annex A (normativ
20、e) Guide for the specification and coding of dimensions of surfacemount negative temperature coefficient thermistors 21Table 1 Upper and lower category temperatures and duration of the damp heat test8Table 2 Fixed sample size test schedule for qualification approval of surface mountnegative temperat
21、ure coefficient thermistors Assessment level EZ .10Table 3 Lot-by-lot inspection11Table 4 Periodic test 12Table 5 Number of cycles 18Table A.1 Dimensions 21Figure 1 Fault: fissure or defect .13Figure 2 Fault: crack 13Figure 3 Separation or delamination 13Figure 4 Exposed electrodes13Figure 5 Princip
22、al faces .14Figure A.1 Dimensioning of surface mount thermistors.21Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,- 4 60539-2 IEC:2003(E)INTERNATIONAL ELECTROTECHNICAL COMMISSIO
23、N_DIRECTLY HEATED NEGATIVE TEMPERATURECOEFFICIENT THERMISTORS Part 2: Sectional specification Surface mount negative temperature coefficient thermistorsFOREWORD1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprisingall national electrotechnic
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33、the possibility that some of the elements of this IEC Publication may be the subject ofpatent rights. IEC shall not be held responsible for identifying any or all such patent rights.International Standard IEC 60539-2 has been prepared by IEC technical committee 40:Capacitors and resistors for electr
34、onic equipment.The text of this standard is based on the following documents:FDIS Report on voting40/1346/FDIS 40/1368/RVDFull information on the voting for the approval of this standard can be found in the report onvoting indicated in the above table.This publication has been drafted in accordance
35、with the ISO/IEC Directives, Part 2.Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-60539-2 IEC:2003(E) 5 The committee has decided that the contents of this publication will re
36、main unchanged until2008. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended.A bilingual edition of this document may be issued at a later date.Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for Resal
37、eNo reproduction or networking permitted without license from IHS-,- 6 60539-2 IEC:2003(E)DIRECTLY HEATED NEGATIVE TEMPERATURECOEFFICIENT THERMISTORS Part 2: Sectional specification Surface mount negative temperature coefficient thermistors1 General1.1 ScopeThis part of IEC 60539 is applicable to su
38、rface mount directly heated negative temperaturecoefficient thermistors, typically made from transition metal oxide materials withsemiconducting properties. These thermistors have metallized connecting pads or solderingstrips and are intended to be mounted directly on to substrates for hybrid circui
39、ts or on toprinted boards.1.2 Normative referencesThe following referenced documents are indispensable for the application of this document.For dated references, only the edition cited applies. For undated references, the latest editionof the referenced document (including any amendments) applies.IE
40、C 60068-2-2:1974, Environmental testing Part 2: Tests Tests B: Dry heatAmendment 1 (1993)Amendment 2 (1994)IEC 60068-2-14:1984, Environmental testing Part 2: Tests Test N: Change of temperatureAmendment 1 (1986)IEC 60068-2-30:1980, Environmental testing Part 2: Tests Test Db and guidance: Dampheat,
41、cyclic (12 + 12-hour cycle)Amendment 1 (1985)IEC 60068-2-58:1999, Environmental testing Part 2-58: Tests Test Td: Test methods forsolderability, resistance to dissolution of metallization and to soldering heat of surfacemounting devices (SMD)IEC 60068-2-78: Environmental testing Part 2-78: Tests Tes
42、t Cab: Damp heat, steadystateIEC 60410:1973, Sampling plans and procedures for inspection by attributesIEC 60539-1:2002, Directly heated negative temperature coefficient thermistors Part 1:Generic specification1.3 Information to be given in a detail specificationDetail specifications shall be derive
43、d from the relevant blank detail specification.Detail specifications shall not specify requirements inferior to those of the generic, sectionalor blank detail specification. When more severe requirements are included, they shall belisted in 1.9 of the detail specification and indicated in the test s
44、chedules, for example, by anasterisk.Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-60539-2 IEC:2003(E) 7 NOTE The information given in 1.3.1 may for convenience, be presented
45、in tabular form.The following information shall be given in each detail specification and the values quotedshall preferably be selected from those given in the appropriate clause of this sectionalspecification.1.3.1 Outline drawing and dimensionsThere shall be an illustration of the thermistor as an
46、 aid to easy recognition and forcomparison with others. Dimensions and their associated tolerances, which affect inter-changeability and mounting, shall be given in the detail specification. All dimensions shallpreferably be stated in millimetres; however, when the original dimensions are given inin
47、ches, the converted metric dimensions in millimetres shall be added.Normally, the numerical values shall be given for the length, width and height of the body.When necessary, for example when a number of items are covered by a detail specification,the dimensions and their associated tolerances shall
48、 be placed in a table below the drawing.When the configuration is other than described above, the detail specification shall state suchdimensional information as will adequately describe the thermistor.1.3.2 MountingThe detail specification shall give guidance on methods of mounting for normal use. Mountingfor test and measurement purposes (when required) shall be in accordance with 4.27 ofIEC 60539-1.1.3.3 Ratings and characteristics1.3.3.1 Particular characteristicsAdditional characteristics may be listed when they are considered necessary to specify
