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    IEC 60191-6-2009 Mechanical standardization of semiconductor devices - Part 6 General rules for the preparation of outline drawings of surface mounted semicondu.pdf

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    IEC 60191-6-2009 Mechanical standardization of semiconductor devices - Part 6 General rules for the preparation of outline drawings of surface mounted semicondu.pdf

    1、 IEC 60191-6Edition 3.0 2009-11INTERNATIONAL STANDARD NORME INTERNATIONALEMechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Normalisation mcanique des dispositifs semi-conducteurs Partie

    2、6: Rgles gnrales pour la prparation des dessins dencombrement des botiers pour dispositifs semi-conducteurs pour montage en surface IEC60191-6:2009 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2009 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publica

    3、tion may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an en

    4、quiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelq

    5、ue forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de la CEI ou du Comit national de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur

    6、cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de la CEI de votre pays de rsidence. IEC Central Office 3, rue de Varemb CH-1211 Geneva 20 Switzerland Email: inmailiec.ch Web: www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leadin

    7、g global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigend

    8、a or an amendment might have been published. Catalogue of IEC publications: www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, withdrawn and replaced publications. IEC Ju

    9、st Published: www.iec.ch/online_news/justpub Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available on-line and also by email. Electropedia: www.electropedia.org The worlds leading online dictionary of electronic and electrical term

    10、s containing more than 20 000 terms and definitions in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical Vocabulary online. Customer Service Centre: www.iec.ch/webstore/custserv If you wish to give us your feedback on this publication

    11、 or need further assistance, please visit the Customer Service Centre FAQ or contact us: Email: csciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 A propos de la CEI La Commission Electrotechnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des normes internati

    12、onales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications CEI Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi.

    13、 Catalogue des publications de la CEI: www.iec.ch/searchpub/cur_fut-f.htm Le Catalogue en-ligne de la CEI vous permet deffectuer des recherches en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Il donne aussi des informations sur les projets et les publications retires ou remp

    14、laces. Just Published CEI: www.iec.ch/online_news/justpub Restez inform sur les nouvelles publications de la CEI. Just Published dtaille deux fois par mois les nouvelles publications parues. Disponible en-ligne et aussi par email. Electropedia: www.electropedia.org Le premier dictionnaire en ligne a

    15、u monde de termes lectroniques et lectriques. Il contient plus de 20 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International en ligne. Service Clients: www.iec.ch/webstore/custserv/

    16、custserv_entry-f.htm Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 60191-6Edition 3.0 2009-11INTERNATIONAL STANDARD NORME INTERNATI

    17、ONALEMechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Normalisation mcanique des dispositifs semi-conducteurs Partie 6: Rgles gnrales pour la prparation des dessins dencombrement des bot

    18、iers pour dispositifs semi-conducteurs pour montage en surface INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE WICS 31.080.01 PRICE CODECODE PRIXISBN 2-8318-1069-6 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission

    19、 Electrotechnique Internationale 2 60191-6 IEC:2009 CONTENTS FOREWORD.4 1 Scope.6 2 Normative references .6 3 Terms and definitions .6 4 Design rules .7 5 Dimensions to be specified.8 6 Notes .8 Annex A (informative) Illustration of the rules.12 Annex B (informative) Optional table format.36 Bibliog

    20、raphy38 Figure A.1 Illustrations of terminal projection zone.13 Figure A.2 Isometric view of an example of gauge .13 Figure A.3a Top view .14 Figure A.3b Side view 14 Figure A.3c Lead section .14 Figure A.3d Lead side view14 Figure A.4 Pattern of terminal position areas .14 Figure A.5a Top view .17

    21、Figure A.5b Side view 17 Figure A.5c Lead section .17 Figure A.5d Lead side view17 Figure A.6 Pattern of terminal position areas .17 Figure A.7a Top view .20 Figure A.7b Side view 20 Figure A.7c Lead section .20 Figure A.7d Lead side view20 Figure A.8 Pattern of terminal position areas .20 Figure A.

    22、9a Top view .23 Figure A.9b Side view 23 Figure A.9c Side view 23 Figure A.9d Lead shape.23 Figure A.9e Lead side view23 Figure A.9f Lead section 23 Figure A.10 Pattern of terminal position areas .23 Figure A.11a Top view .26 Figure A.11b Side view 26 Figure A.11c Side view 26 Figure A.11d Lead sect

    23、ion .27 Figure A.11e Lead shape .27 Figure A.11f Lead side view.27 60191-6 IEC:2009 3 Figure A.12 Pattern of terminal position areas .27 Figure A.13a Top View.30 Figure A.13b Side View30 Figure A.13c Bottom view 30 Figure A.14 Pattern of terminal position areas .30 Figure A.15a Top view .33 Figure A

    24、.15b Side view 33 Figure A.15c Bottom view 33 Figure A.16 Pattern of terminal position areas .33 Table 1 Dimensions to be specified for Group 1 .9 Table 2 Dimensions to be specified for Group 2 .10 4 60191-6 IEC:2009 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDU

    25、CTOR DEVICES Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC Nationa

    26、l Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly

    27、 Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-government

    28、al organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on tec

    29、hnical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by

    30、IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international unif

    31、ormity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5)

    32、 IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensu

    33、re that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of a

    34、ny nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the ref

    35、erenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. Inte

    36、rnational Standard IEC 60191-6 has been prepared by subcommittee 47D: Mechanical standardization of semiconductor devices, of IEC technical committee 47: Semiconductor devices. This third edition of IEC 60191-6 cancels and replaces the second edition, published in 2004 and constitutes a technical re

    37、vision. This edition includes the following significant changes with respect to the previous edition: a) scope is modified to cover all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8; b) editorial modifications on several pages; and c) technical revision to

    38、ball grid array package (BGA) especially its geometrical drawing format. (two types of BGA would unify as one type as a result of revising drawing format.) 60191-6 IEC:2009 5 The text of this standard is based on the following documents: CDV Report on voting 47D/736/CDV 47D/749/RVC Full information

    39、on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of IEC 60191 series under the general title Mechanical standardization of semico

    40、nductor devices can be found on the IEC website. The committee has decided that the contents of this amendment and the base publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication.

    41、 At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. 6 60191-6 IEC:2009 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages 1 Scope This

    42、 part of IEC 60191 gives general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits

    43、classified as form E in Clause 3 of IEC 60191-4. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including an

    44、y amendments) applies. IEC 60191-1:2007, Mechanical standardization of semiconductor devices Part 1: General rules for the preparation of outline drawings of discrete devices IEC 60191-4:2002, Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of

    45、package outlines for semiconductor device packages ISO 1101:2004 Geometrical Product Specifications (GPS) Geometrical tolerancing Tolerances of form, orientation, location and run-out 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. 3.1 seating pl

    46、ane plane which designates the plane of contact of the package, including any stand-off, with the surface on which it will be mounted NOTE This plane is often used as the reference plane. 3.2 reference plane plane parallel to the seating plane at a distance A3 above seating plane (does not apply to

    47、leadless package) NOTE 1 The distance A3 is known as the reference plane distance. It determines the terminal projection zone (see Figure 1). NOTE 2 This distance is a theoretical dimension which is not related to any feature of the package. Its value is chosen for each package so the length of term

    48、inal projection zone Lpis a good approximation of the terminal length used for mounting, e.g. the length of the part of the terminal that is soldered to the substrate. 60191-6 IEC:2009 7 3.3 terminal position area maximum area on the seating plane within which the terminal projection zone is located

    49、, taking into account the maximum values of Lpand bp NOTE 1 The surface of the terminal position area is equal to l1 b3with, generally l1= Lpmax. + (HDmax. HDmin.)/2 = Lpmax. + (HEmax. HEmin.)/2 and b3 = bpmax. + x NOTE 2 Checking can be carried out by means of an appropriate gauge (see Figure 2) 3.4 pattern of ter


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