1、 IEC/TR 62658 Edition 1.0 2013-07 TECHNICAL REPORT Roadmap of optical circuit boards and their related packaging technologies IEC/TR 62658:2013(E) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2013 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of
2、 this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright
3、or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland ww
4、w.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under co
5、nstant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. Useful links: IEC publications search - www.iec.ch/searchpub The advanced search enables you to find IEC publications by a variety of criteria (reference number, text,
6、 technical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published details all new publications released. Available on-line and also once a month by email.
7、Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 30 000 terms and definitions in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical Vocabulary (IEV) on-lin
8、e. Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. IEC/TR 62658 Edition 1.0 2013-07 TECHNICAL REPORT Roadmap of optical circuit boards and their related packaging
9、 technologies INTERNATIONAL ELECTROTECHNICAL COMMISSION R ICS 33.180.01; 33.180.99 PRICE CODE ISBN 978-2-8322-0915-8 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. colour inside 2 TR 62658 IE
10、C:2013(E) CONTENTS FOREWORD . 3 1 Scope . 5 2 General 5 2.1 Background of optical packaging technology road map 5 2.2 Advantages of optical interconnects 7 2.3 Planar embedded optical waveguides 9 3 Standardization of board-level optical packaging 9 3.1 Role of IEC TC86/JWG9 (with TC91) . 9 3.2 Opti
11、cal circuit boards 20 10 3.3 Optical backplanes 22 . 11 3.4 Optical circuit board connectors 23 13 3.5 Opto-electronic modules on boards . 14 3.6 Originating standards 15 4 Standardization road map . 16 4.1 Performance trends for optical circuit boards . 16 5 Standardization road map of optical circ
12、uit boards 17 Bibliography 18 Figure 1 Data transmission speed and capability trends for network traffic and server systems 2. 6 Figure 2 Internet traffic and router power consumption in Japan 5 . 7 Figure 3 Increase of power consumption in future network . 8 Figure 4 Comparison of power consumption
13、 of 10 Tbps electrical and optical routers . 9 Figure 5 Discussion field in IEC TC86/JWG9 (with TC91) 10 Figure 6 Classification of optical circuit boards 11 Figure 7 Four types of optical backplane applications 13 Figure 8 Classification of optical circuit board connectors 14 Figure 9 Classificatio
14、n of optical modules on boards 15 Figure 10 De facto-standards in Japan 24 15 Figure 11 Performance trends for optical circuit boards 16 Figure 12 Standardization roadmap of optical circuit board and its related optical packaging . 17 TR 62658 IEC:2013(E) 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION
15、_ ROADMAP OF OPTICAL CIRCUIT BOARDS AND THEIR RELATED PACKAGING TECHNOLOGIES FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
16、international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (her
17、eafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also pa
18、rticipate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible,
19、 an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While a
20、ll reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to a
21、pply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation o
22、f conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this p
23、ublication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indire
24、ct, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the
25、correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to pr
26、epare International Standards. However, a technical committee may propose the publication of a technical report when it has collected data of a different kind from that which is normally published as an International Standard, for example “state of the art“. IEC 62658, which is a technical report, h
27、as been prepared by IEC technical committee 86: Fibre optics. The text of this technical report is based on the following documents: Enquiry draft Report on voting 86/442/DTR 86/453/RVC Full information on the voting for the approval of this technical report can be found in the report on voting indi
28、cated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 TR 62658 IEC:2013(E) The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec
29、.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IMPORTANT The colour inside logo on the cover page of this publication
30、 indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. TR 62658 IEC:2013(E) 5 ROADMAP OF OPTICAL CIRCUIT BOARDS AND THEIR RELATED PACKAGING TECHNOLOGIES 1 Scope This Techn
31、ical Report covers the roadmap of optical circuit boards, and its related packaging technologies including optical circuit board connectors and optical modules on boards. 2 General 2.1 Background of optical packaging technology road map The volume of network traffic is dramatically increasing due to
32、 the amount of data being captured, processed, conveyed and stored as digital information. This information is generated from many sources, including critical business applications, email communications, the Internet and multimedia applications which have collectively fuelled an increase in demand f
33、or data networking and storage capacity. In addition, the proliferation of media rich applications, such as digital music and video sharing services is fuelling a concurrent increase in data processing in data centres 1 1 . The growth in network traffic attributed to personalized content is 20 % per
34、 month, giving rise to a doubling of network traffic every 1,5 years. However, this is out of step with the input/output (I/O) performance or I/O throughput of servers, which doubles every 2 years. Therefore, there is an increasing gap between the performance evolution of network equipment such as s
35、ervers, and the growth in network traffic (Figure 1) 2. _ 1Figures in square brackets refer to the Bibliography. 6 TR 62658 IEC:2013(E) Figure 1 Data transmission speed and capability trends for network traffic and server systems 2 In general, system power consumption will increase as the volume of
36、internet traffic expands. By 2020, power consumption in network routers in Japan will reach the gross power generation of Japan in 2005. An energy saving by 3 to 4 orders of magnitude in network router technology is required in 2030 to meet the stipulated targets in the Kyoto protocol 3 (Figure 2).
37、In addition, the bandwidth and density requirements for interconnects within high-performance computing systems are becoming unmanageable, due to increasing chip speeds, wider buses and larger numbers of processors per system 4. The increase in system bandwidth and density required to satisfy this d
38、emand would impose unmanageable cost and performance burdens on future data networking and storage technologies. An alternative to the current electrical printed circuit board (PCB) interconnect technology is required across multiple high-speed application spaces to mitigate this common trend. Optic
39、al interconnects are expected to bridge the performance gap between network hardware and traffic, and give rise to a reduction in hardware power consumption while increasing bandwidth density by over two orders of magnitude. IEC 1588/13 TR 62658 IEC:2013(E) 7 Figure 2 Internet traffic and router pow
40、er consumption in Japan 5 2.2 Advantages of optical interconnects Optical interconnects will be fundamental in further scaling the performance of networking, server, router, data storage and high performance computing technologies. The design and development of future higher capacity network hardwar
41、e will be hindered by high-frequency electronic constraints such as crosstalk, dielectric loss, skin effect, electro- magnetic interference (EMI) and high sensitivity to impedance matching. The maximum permissible density of electronic transmission lines is determined by the crosstalk incurred betwe
42、en electronic channels. The higher the signal frequency, the greater the separation between electronic channels required to keep crosstalk within acceptable levels. For example, the line pitch between adjacent electronic channels required to convey a signal data rate of 10 Gbps is 3 times larger tha
43、n that required to convey a signal data rate of 3 Gbps. This makes it more difficult to design and manufacture a high-capacity printed circuit board, as the electronic transmission line density must decrease as the signal speeds increase. The adoption of optical interconnects will mitigate these des
44、ign constraints. Optical waveguides neither produce nor are affected by electro-magnetic interference, and are therefore not constrained by electromagnetic compatibility regulations that impose a severe cost burden on the design of high-speed copper printed circuit boards (PCBs) and supporting inter
45、connect technologies, such as connectors. The layout advantages offered by optical waveguides will give rise to a reduction in the functional area and layer count of the PCB. The level of reduction will strongly depend on the application, with the more I/O intensive applications subject to the great
46、est potential reduction in PCB volume. Another advantage of the adoption of embedded optical interconnects in high-capacity networking, server, router, data storage and high performance computing technologies is a reduction in power consumption. As the network traffic increases, the power consumptio
47、n of network hardware is expected to increase 5 fold by 2025 and 12 fold by 2050 6. For data transmission at speeds greater than 10 Gbps, current electrical interconnects will need to be enhanced by active signal conditioning devices such as pre-emphasis and equaliser circuitry to ensure that the si
48、gnal distortion or degradation due to the mitigating factors described above remains within IEC 1589/13 8 TR 62658 IEC:2013(E) acceptable levels. In addition, the power consumption of electronic signal drivers will also increase. As signal frequencies increase, an electronic signal driver will need
49、to ramp up the signal power in order to overcome the fundamental loss mechanisms on a copper transmission line. These loss mechanisms include dielectric loss, skin effect, and the surface roughness of the copper trace, which accentuates skin effect by increasing the effective surface area. Dielectric loss effects can be mitigated to some extent by using specially high frequency printed circuit board laminate materials, however at mounting cost to t
