1、 IEC 62739-3 Edition 1.0 2017-01 INTERNATIONAL STANDARD Test method for erosion of wave soldering equipment using molten lead-free solder alloy Part 3: Selection guidance of erosion test methods IEC 62739-3:2017-01(en) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2017 IEC, Geneva, Switzerland A
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11、-free solder alloy Part 3: Selection guidance of erosion test methods INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.190; 31.240 ISBN 978-2-8322-3769-4 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized dis
12、tributor. 2 IEC 62739-3:2017 IEC 2017 CONTENTS FOREWORD . 4 1 Scope 6 2 Normative references 6 3 Terms and definitions 6 4 General remarks 7 5 Selection of the appropriate erosion test method . 8 5.1 Correlation between test methods and stresses induced in the field 8 5.2 Recommended test method by
13、materials . 9 6 Common items for each test method 10 6.1 Specimen preparation . 10 6.2 Solder alloy . 10 6.3 Accelerated stress conditions 10 6.3.1 Test temperature . 10 6.3.2 Rotation speed 10 6.3.3 Bending stress to the specimen . 11 6.4 Dross 11 6.4.1 Dross generation and removal interval . 11 6.
14、4.2 Dross removal method . 11 6.4.3 Molten solder volume after dross removal 11 6.5 Erosion depth measurement method . 11 6.5.1 Post test treatment 11 6.5.2 Local erosion depth . 12 6.5.3 General (uniform) erosion depth 13 6.5.4 Evaluation . 14 7 Overview of the test methods 14 7.1 Test methods 14 7
15、.2 Metal material without surface processing . 14 7.2.1 General . 14 7.2.2 Rotation test at 350 C 15 7.3 Metal material with surface processing 16 7.3.1 Test method 16 7.3.2 Rotation test at 450 C 16 7.3.3 Rotation test at 450 C with 2 mm bending 17 Annex A (informative) Selection of test temperatur
16、e, test duration and bending stress 18 A.1 Specimen without surface processing . 18 A.2 Specimen with surface processing 20 Annex B (informative) Maximum depth and other measurements . 23 B.1 General . 23 B.2 Maximum depth measurement 23 Annex C (informative) Erosion mechanism . 26 C.1 Specimen with
17、out surface processing . 26 C.2 Specimen with surface processing 26 C.3 Further guidance . 27 Annex D (informative) Thermal acceleration for erosion . 28 D.1 Specimen without surface processing . 28 D.2 Specimen with surface processing 28 IEC 62739-3:2017 IEC 2017 3 D.3 Further guidance document 30
18、Bibliography 31 Figure 1 Schematic example of wave soldering equipment . 8 Figure 2 Example of dross removal tool . 11 Figure 3 Schematic general definition of erosion depth 12 Figure 4 Schematic definition of erosion depth by focal depth method 12 Figure 5 Examples of local erosion 13 Figure 6 Exam
19、ple of evaluation region . 13 Figure 7 Examples with non-erosion area 14 Figure 8 Examples without a non-erosion area and an example of a cross section . 14 Figure 9 Configuration example of test equipment 15 Figure 10 Configuration example of test equipment for rotation test at 450 C with 2 mm bend
20、ing 17 Figure A.1 Specimen configuration for preliminary test . 18 Figure A.2 Erosion depth against molten solder temperature . 19 Figure A.3 Erosion depth against rotation speed 19 Figure A.4 Erosion depth against immersion time . 20 Figure C.1 Erosion mechanism for material with nitriding . 27 Fig
21、ure D.1 Tin (Sn) diffusion layer growth in the plasma nitriding layer for various stainless steel . 29 Table 1 Location of erosion in the field and examples of problems 8 Table 2 Correlation between test methods and stresses induced in the field 9 Table 3 Applicable test method depending on the mate
22、rials . 9 Table 4 Test conditions for rotation test at 350 C 16 Table 5 Test conditions for rotation test at 350 C 16 Table A.1 Erosion test results for the materials of gas nitriding and nitrocarburizing . 21 Table A.2 Erosion test results for the materials of coating type surface processing . 22 T
23、able B.1 Measurement methods, features and accuracy. 24 Table B.2 Example of measurement equipment 25 Table D.1 Plasma nitriding layer peeling off period (incubation period in Figure D.1) 29 Table D.2 Initial growth rate for tin (Sn) diffusion layer . 30 4 IEC 62739-3:2017 IEC 2017 INTERNATIONAL ELE
24、CTROTECHNICAL COMMISSION _ TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY Part 3: Selection guidance of erosion test methods FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all nationa
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35、tifying any or all such patent rights. International Standard IEC 62739-3 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this International Standard is based on the following documents: The text of this standard is based on the following documents: CDV
36、Report on voting 91/1368/CDV 91/1400/RVC Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. IEC 62739-3:2017 IEC 2017 5 A l
37、ist of all the parts in the IEC 62739 series, under the general title Test method for erosion of wave soldering equipment using molten lead-free solder alloy, can be found on the IEC website. The committee has decided that the contents of this document will remain unchanged until the stability date
38、indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. 6 IEC 62739-3:2017 IEC
39、 2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY Part 3: Selection guidance of erosion test methods 1 Scope This part of IEC 62739 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without
40、or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitu
41、tes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-2-20:2008, Environmental testing Part 2-20: Tests Test T: Test methods for solderability and re
42、sistance to soldering heat of devices with leads IEC 61190-1-3, Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications IEC 62739-1:2013, Test method for erosion of wave solder
43、ing equipment using molten lead- free solder alloy Part 1: Erosion test method for metal materials without surface processing IEC 62739-2, Test method for erosion of wave soldering equipment using molten lead-free solder alloy Part 2: Erosion test method for metal materials with surface processing 3
44、 Terms and definitions For the purposes of this document, the following terms and definitions apply. ISO and IEC maintain terminological databases for use in standardization at the following addresses: IEC Electropedia: available at http:/www.electropedia.org/ ISO Online browsing platform: available
45、 at http:/www.iso.org/obp 3.1 erosion phenomenon where a base material is dissolved and made thinner by coming into contact with molten solder SOURCE: IEC 62739-1:2013, 3.1 IEC 62739-3:2017 IEC 2017 7 3.2 lead-free solder alloy that does not contain more than 0,1 % mass fraction of lead (Pb) as its
46、constituent and used for joining components to substrates or for coating surfaces SOURCE: IEC 60194:2015, 75.1904 modified “mass fraction“ is used instead of “weight“ and “as its constituent“ has been added 3.3 dross oxide and other contaminants that form on the surface of molten solder SOURCE: IEC
47、60194:2015, 75.0410 4 General remarks Figure 1 shows a schematic example of wave soldering equipment showing a solder bath and auxiliaries which are subjected to evaluation. Table 1 shows the location of the erosion in the field, and an example of the problems. The tests specified in IEC 62739-1 and
48、 IEC 62739-2 are intended to provide an appropriate maintenance inspection cycle and replacement period of a solder bath and other metal components, by assessing the anti-erosion capability of material and other metal components, including surface processing, subjected to solder baths. Except for th
49、e duration, test conditions such as molten solder temperature and rotation speed, specified in IEC 62739-1 and IEC 6273-2, are predetermined. Thus, the erosion occurrence durations vary depending upon the type of metal and the surface processing employed. For this reason, an adequate test duration needs to be pre-set so as to clearly identify the non- erosion which is used as the baseline of the erosion depth by the focal depth method
