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    IEC 62137-4-2014 Electronics assembly technology - Part 4 Endurance test methods for solder joint of area array type package surface mount devices《电子组装技术 第4部分 区域阵列类型包装表面安装设备的焊接接缝的耐久性试验方法》.pdf

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    IEC 62137-4-2014 Electronics assembly technology - Part 4 Endurance test methods for solder joint of area array type package surface mount devices《电子组装技术 第4部分 区域阵列类型包装表面安装设备的焊接接缝的耐久性试验方法》.pdf

    1、 IEC 62137-4 Edition 1.0 2014-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices Technique dassemblage des composants lectroniques Partie 4: Mthodes dessais dendurance des joi

    2、nts brass des composants pour montage en surface botiers de type matriciel IEC 62137-4:2014-10(en-fr) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2014 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utiliz

    3、ed in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional

    4、 rights to this publication, please contact the address below or your local IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucu

    5、n procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de lIEC ou du Comit national de lIEC du pays du demandeur. Si vous avez des questions sur le copyright de lIEC ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordo

    6、nnes ci-aprs ou contactez le Comit national de lIEC de votre pays de rsidence. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global

    7、organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an a

    8、mendment might have been published. IEC Catalogue - webstore.iec.ch/catalogue The stand-alone application for consulting the entire bibliographical information on IEC International Standards, Technical Specifications, Technical Reports and other documents. Available for PC, Mac OS, Android Tablets a

    9、nd iPad. IEC publications search - www.iec.ch/searchpub The advanced search enables to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justp

    10、ublished Stay up to date on all new IEC publications. Just Published details all new publications released. Available online and also once a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 30 000 terms a

    11、nd definitions in English and French, with equivalent terms in 14 additional languages. Also known as the International Electrotechnical Vocabulary (IEV) online. IEC Glossary - std.iec.ch/glossary More than 55 000 electrotechnical terminology entries in English and French extracted from the Terms an

    12、d Definitions clause of IEC publications issued since 2002. Some entries have been collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEC Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact

    13、 the Customer Service Centre: csciec.ch. A propos de lIEC La Commission Electrotechnique Internationale (IEC) est la premire organisation mondiale qui labore et publie des Normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publicatio

    14、ns IEC Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Catalogue IEC - webstore.iec.ch/catalogue Application autonome pour consulter tous les renseignements bibliographique

    15、s sur les Normes internationales, Spcifications techniques, Rapports techniques et autres documents de lIEC. Disponible pour PC, Mac OS, tablettes Android et iPad. Recherche de publications IEC - www.iec.ch/searchpub La recherche avance permet de trouver des publications IEC en utilisant diffrents c

    16、ritres (numro de rfrence, texte, comit dtudes,). Elle donne aussi des informations sur les projets et les publications remplaces ou retires. IEC Just Published - webstore.iec.ch/justpublished Restez inform sur les nouvelles publications IEC. Just Published dtaille les nouvelles publications parues.

    17、Disponible en ligne et aussi une fois par mois par email. Electropedia - www.electropedia.org Le premier dictionnaire en ligne de termes lectroniques et lectriques. Il contient plus de 30 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans 14 langues additionnelle

    18、s. Egalement appel Vocabulaire Electrotechnique International (IEV) en ligne. Glossaire IEC - std.iec.ch/glossary Plus de 55 000 entres terminologiques lectrotechniques, en anglais et en franais, extraites des articles Termes et Dfinitions des publications IEC parues depuis 2002. Plus certaines entr

    19、es antrieures extraites des publications des CE 37, 77, 86 et CISPR de lIEC. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 62137-4 Edition 1.0 2014-10 INTERNATIONAL STANDARD NORME I

    20、NTERNATIONALE Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices Technique dassemblage des composants lectroniques Partie 4: Mthodes dessais dendurance des joints brass des composants pour montage en surface botiers de typ

    21、e matriciel INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE X ICS 31.190 PRICE CODE CODE PRIX ISBN 978-2-8322-1873-0 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make

    22、sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 IEC 62137-4:2014 IEC 2014 CONTENTS FOREWORD . 6 1 Scope 8 2 Normative references 8 3 Terms definitions and abbrevia

    23、tions 9 3.1 Terms and definitions 9 3.2 Abbreviations 9 4 General . 9 5 Test apparatus and materials 10 5.1 Specimen 10 5.2 Reflow soldering equipment 10 5.3 Temperature cycling chamber . 10 5.4 Electrical resistance recorder 10 5.5 Test substrate . 10 5.6 Solder paste . 11 6 Specimen preparation 11

    24、 7 Temperature cycling test . 13 7.1 Pre-conditioning 13 7.2 Initial measurement 13 7.3 Test procedure 13 7.4 End of test criteria. 15 7.5 Recovery 15 7.6 Final measurement . 15 8 Temperature cycling life 15 9 Items to be specified in the relevant product specification . 15 (informative) Acceleratio

    25、n of the temperature cycling test for solder joints . 17 Annex A A.1 General . 17 A.2 Acceleration of the temperature cycling test for an Sn-Pb solder joint . 17 A.3 Temperature cycling life prediction method for an Sn-Ag-Cu solder joint . 18 A.4 Factor that affects the temperature cycling life of t

    26、he solder joint 22 (informative) Electrical continuity test for solder joints of the package 23 Annex B B.1 General . 23 B.2 Package and daisy chain circuit 23 B.3 Mounting condition and materials 23 B.4 Test method 23 B.5 Temperature cycling test using the continuous electric resistance monitoring

    27、system 23 (informative) Reflow solderability test method for package and test substrate Annex C land 25 C.1 General . 25 C.2 Test equipment . 25 C.2.1 Test substrate 25 C.2.2 Pre-conditioning oven 25 C.2.3 Solder paste 25 C.2.4 Metal mask for screen printing . 25 C.2.5 Screen printing equipment . 25

    28、 IEC 62137-4:2014 IEC 2014 3 C.2.6 Package mounting equipment 25 C.2.7 Reflow soldering equipment . 25 C.2.8 X-ray inspection equipment . 26 C.3 Standard mounting process 26 C.3.1 Initial measurement . 26 C.3.2 Pre-conditioning 26 C.3.3 Package mounting on test substrate 26 C.3.4 Recovery . 27 C.3.5

    29、 Final measurement 27 C.4 Examples of faulty soldering of area array type packages . 27 C.4.1 Repelled solder by contamination on the ball surface of the BGA package . 27 C.4.2 Defective solder ball wetting caused by a crack in the package . 27 C.5 Items to be given in the product specification 28 (

    30、informative) Test substrate design guideline . 29 Annex D D.1 General . 29 D.2 Design standard 29 D.2.1 General . 29 D.2.2 Classification of substrate specifications 29 D.2.3 Material of the test substrate . 31 D.2.4 Configuration of layers of the test substrate . 31 D.2.5 Land shape of test substra

    31、te 31 D.2.6 Land dimensions of the test substrate 31 D.3 Items to be given in the product specification 32 (informative) Heat resistance to reflow soldering for test substrate 33 Annex E E.1 General . 33 E.2 Test apparatus 33 E.2.1 Pre-conditioning oven 33 E.2.2 Reflow soldering equipment . 33 E.3 T

    32、est procedure 33 E.3.1 General . 33 E.3.2 Pre-conditioning 33 E.3.3 Initial measurement . 33 E.3.4 Moistening process (1) 34 E.3.5 Reflow heating (1) . 34 E.3.6 Moistening process (2) 34 E.3.7 Reflow heating process (2) 34 E.3.8 Final measurement 34 E.4 Items to be given in the product specification

    33、 34 (informative) Pull strength measurement method for the test substrate land 35 Annex F F.1 General . 35 F.2 Test apparatus and materials 35 F.2.1 Pull strength measuring equipment 35 F.2.2 Reflow soldering equipment . 35 F.2.3 Test substrate 35 F.2.4 Solder ball . 35 F.2.5 Solder paste 35 F.2.6 F

    34、lux . 35 F.3 Measurement procedure . 36 4 IEC 62137-4:2014 IEC 2014 F.3.1 Pre-conditioning 36 F.3.2 Solder paste printing 36 F.3.3 Solder ball placement 36 F.3.4 Reflow heating process . 36 F.3.5 Pull strength measurement 36 F.3.6 Final measurement 37 F.4 Items to be given in the product specificati

    35、on 37 (informative) Standard mounting process for the packages 38 Annex G G.1 General . 38 G.2 Test apparatus and materials 38 G.2.1 Test substrate 38 G.2.2 Solder paste 38 G.2.3 Metal mask for screen printing . 38 G.2.4 Screen printing equipment . 38 G.2.5 Package mounting equipment 38 G.2.6 Reflow

    36、 soldering equipment . 38 G.3 Standard mounting process 39 G.3.1 Initial measurement . 39 G.3.2 Solder paste printing 39 G.3.3 Package mounting . 39 G.3.4 Reflow heating process . 39 G.3.5 Recovery . 40 G.3.6 Final measurement 40 G.4 Items to be given in the product specification 40 (informative) Me

    37、chanical stresses to the packages 41 Annex H H.1 General . 41 H.2 Mechanical stresses . 41 Bibliography 42 Figure 1 Region for evaluation of the endurance test . 10 Figure 2 Typical reflow soldering profile for Sn63Pb37 solder alloy 12 Figure 3 Typical reflow soldering profile for Sn96,5Ag3Cu,5 sold

    38、er alloy 13 Figure 4 Test conditions of temperature cycling test. 14 Figure A.1 FBGA package device and FEA model for calculation of acceleration factors AF . 20 Figure A.2 Example of acceleration factors AF with an FBGA package device using Sn96,5Ag3Cu,5 solder alloy 21 Figure A.3 Fatigue character

    39、istics of Sn96,5Ag3Cu,5 an alloy micro solder joint (N f= 20 % load drop from initial load) . 22 Figure B.1 Example of a test circuit for the electrical continuity test of a solder joint . 23 Figure B.2 Measurement example of continuously monitored resistance in the temperature cycling test 24 Figur

    40、e C.1 Temperature measurement of specimen using thermocouples 26 Figure C.2 Repelled solder caused by contamination on the solder ball surface 27 Figure C.3 Defective soldering as a result of a solder ball drop 28 Figure D.1 Standard land shapes of the test substrate . 31 Figure F.1 Measuring method

    41、s for pull strength . 36 IEC 62137-4:2014 IEC 2014 5 Figure G.1 Example of printed conditions of solder paste . 39 Figure G.2 Temperature measurement of the specimen using thermocouples 40 Table 1 Test conditions of temperature cycling test 14 Table A.1 Example of test results of the acceleration fa

    42、ctor (Sn63Pb37 solder alloy) 18 Table A.2 Example test results of the acceleration factor (Sn96,5Ag3Cu,5 solder alloy) 20 Table A.3 Material constant and inelastic strain range calculated by FEA for FBGA package devices as shown in Figure A.1 (Sn96,5Ag3Cu,5 solder alloy) 21 Table D.1 Types classific

    43、ation of the test substrate 30 Table D.2 Standard layers configuration of test substrates 31 Table G.1 Stencil design standard for packages 38 Table H.1 Mechanical stresses to mounted area array type packages 41 6 IEC 62137-4:2014 IEC 2014 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ELECTRONICS ASSE

    44、MBLY TECHNOLOGY Part 4: Endurance test methods for solder joint of area array type package surface mount devices FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committee

    45、s). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available

    46、Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organiz

    47、ations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical mat

    48、ters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC Nation

    49、al Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum exten


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