1、 IEC 62137-3 Edition 1.0 2011-11 INTERNATIONAL STANDARD NORME INTERNATIONALE Electronics assembly technology Part 3: Selection guidance of environmental and endurance test methods for solder joints Techniques dassemblage des composants lectroniques Partie 3: Guide de choix des mthodes dessai denviro
2、nnement et dendurance des joints brass IEC 62137-3:2011 colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2011 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or
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16、lication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62137-3 Edition 1.0 2011-11 INTERNATIONAL STANDARD NORME INTERNATIONALE Electronics assembly technology Part 3: Selection guidance of environm
17、ental and endurance test methods for solder joints Techniques dassemblage des composants lectroniques Partie 3: Guide de choix des mthodes dessai denvironnement et dendurance des joints brass INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE X ICS 31.190 PRICE CODE
18、 CODE PRIX ISBN 978-2-88912-711-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale colour inside 2 62137-3 IEC:2011 CONTENTS FOREWORD . 5 1 Scope . 7 2 Normative references . 7 3 Terms and definitions . 7 4 General re
19、marks . 9 5 Procedure of selecting the applicable test method 10 5.1 Stress to solder joints in the field and test methods . 10 5.2 Selection of test methods based on the shapes and terminations/leads of electronic devices 12 5.2.1 Surface mount devices 12 5.2.2 Lead insertion type device . 13 6 Com
20、mon subjects in each test method . 14 6.1 Mounting device and materials used 14 6.2 Soldering condition 15 6.2.1 General . 15 6.2.2 Reflow soldering 15 6.2.3 Wave soldering 17 6.3 Accelerated stress conditioning . 18 6.3.1 Rapid temperature change (applies to all solder alloys in this document) . 18
21、 6.3.2 Dry heat (applies to Bi58Sn42 alloy solder only) 19 6.3.3 Damp heat (steady state) (applies to Sn91Zn9 and Sn89Zn8Bi3 alloy solder) . 19 6.4 Selection of test conditions and judgement of test results 19 7 Evaluation test method . 19 7.1 Solder joint strength test of SMD . 19 7.1.1 General . 1
22、9 7.1.2 Pull strength test . 19 7.1.3 Shear strength test 20 7.1.4 Torque shear strength test . 21 7.1.5 Monotonic bending strength test 21 7.2 Cyclic bending strength test 22 7.3 Mechanical shear fatigue test 23 7.4 Cyclic drop test and cyclic steel ball drop strength test 24 7.4.1 Overview . 24 7.
23、4.2 Cyclic steel ball drop strength test . 25 7.5 Solder joint strength test for lead insertion type device 26 7.5.1 Pull strength test for insertion type device . 26 7.5.2 Creep strength test for lead insertion type device 26 Annex A (informative) Condition of rapid temperature change 28 Annex B (i
24、nformative) Electrical continuity test for solder joint . 30 Annex C (informative) Torque shear strength test 31 Annex D (informative) Monotonic bending strength test . 34 Annex E (informative) Cyclic steel ball drop strength test . 36 Annex F (informative) Pull strength test . 38 Annex G (informati
25、ve) Creep strength test . 39 62137-3 IEC:2011 3 Annex H (informative) Evaluation method for the fillet lifting phenomenon of a lead insertion type device solder joint . 41 Bibliography 43 Figure 1 Joint regions for the reliability tests 9 Figure 2 Factors affecting the joint reliability made by lead
26、-free solder 10 Figure 3 An example of the mounting position of SMD for monotonic bending and cyclic bending tests 15 Figure 4 An example of reflow soldering temperature profile (Sn96,5Ag3Cu,5) 16 Figure 5 Examples of reflow soldering temperature profile other than Sn96,5Ag3Cu,5 16 Figure 6 An examp
27、le of wave soldering temperature profile (Sn96,5Ag3Cu,5) 17 Figure 7 An example of wave soldering temperature profile . 18 Figure 8 Pull strength test 20 Figure 9 Shear strength test. 20 Figure 10 Torque shear strength test . 21 Figure 11 Monotonic bending strength test . 21 Figure 12 Cyclic bending
28、 strength test . 22 Figure 13 Structure of cyclic bending strength test . 23 Figure 14 Schematic diagram of mechanical shear fatigue for solder joint 24 Figure 15 Cyclic drop test 25 Figure 16 Cyclic steel ball drop test . 25 Figure 17 Pull strength test 26 Figure 18 Creep strength test 27 Figure A.
29、1 Stress relation curve for a given strain to a solder joint (Sn96,5Ag3Cu,5) . 28 Figure A.2 Time to reach steady state in the temperature cycle chamber . 29 Figure B.1 Example of the test circuit for an electrical continuity test of a solder joint 30 Figure C.1 Fixing of substrate for torque shear
30、strength test 32 Figure C.2 Torque shear strength test jig and position adjustment . 33 Figure C.3 Torque shear strength test for a connector . 33 Figure D.1 Example of a board bending jig . 34 Figure E.1 Cyclic steel ball drop test 37 Figure E.2 Comparison of cyclic drop test and cyclic steel ball
31、drop test 37 Figure F.1 Pull strength test . 38 Figure G.1 Creep strength test . 39 Figure H.1 Fillet lifting phenomenon of solder joint . 41 Figure H.2 Example of an electrical continuity test circuit for a lead insertion type device solder joint . 42 Table 1 Correlations between test methods and a
32、ctual stresses in the field . 11 Table 2 Recommended test methods suitable for specific shapes and terminations/leads of SMDs 12 Table 3 Recommended test methods suitable for application and mass of the lead insertion type device . 13 Table 4 Solder alloy composition . 14 4 62137-3 IEC:2011 Table 5
33、Diameters of through holes and lands in respect to the nominal cross section and nominal diameter of lead wire 15 Table 6 Temperature condition for rapid temperature change. 18 62137-3 IEC:2011 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ELECTRONICS ASSEMBLY TECHNOLOGY Part 3: Selection guidance o
34、f environmental and endurance test methods for solder joints FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co
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44、ion of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62137-3 has been prepared by IEC techni
45、cal committee 91: Electronics assembly technology. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following: no technical changes; some editorial changes and corrections; for the
46、sake of convenience some constitutive changes. 6 62137-3 IEC:2011 The text of this standard is based on the following documents: FDIS Report on voting 91/986/FDIS 91/1011/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above
47、table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of IEC 62137 under the general title Electronics assembly technology can be found in the IEC website. Future standards in this series will carry the new general title as cited above. Title
48、s of existing standards in this series will be updated at the time of the next edition. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publi
49、cation. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The “colour inside” logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this publication using
