1、 IEC 62137-1-2 Edition 1.0 2007-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Environmental and endurance test methods for surface mount solder joint Part 1-2: Shear strength test Technologie de montage en surface Mthodes dessais denvironnement et dendurance des joints b
2、rass monts en surface Partie 1-2: Essai de rsistance au cisaillement IEC 62137-1-2:2007 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any mea
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16、ires sur cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62137-1-2 Edition 1.0 2007-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Environmental and endu
17、rance test methods for surface mount solder joint Part 1-2: Shear strength test Technologie de montage en surface Mthodes dessais denvironnement et dendurance des joints brass monts en surface Partie 1-2: Essai de rsistance au cisaillement INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTRO
18、TECHNIQUE INTERNATIONALE Q ICS 31.190 PRICE CODE CODE PRIX ISBN 2-8318-9783-1 2 62137-1-2 IEC:2007 CONTENTS FOREWORD.3 1 Scope.5 2 Normative references .5 3 Terms and definitions .6 4 General remarks.6 5 Test equipment and materials.7 5.1 Shear test equipment 7 5.2 Pushing tool 7 5.3 Optical microsc
19、ope7 5.4 Scanning electron microscope (SEM) 7 5.5 Reflow soldering oven .7 5.6 Test substrate .7 5.7 Solder alloy .8 5.8 Solder paste8 6 Mounting method for reflow soldering .8 7 Test conditions.9 7.1 Test: Rapid change of temperature9 7.2 Shear strength test9 8 Test procedure .9 8.1 Test sequence.9
20、 8.2 Pre-conditioning 10 8.3 Initial shear strength10 8.4 Rapid change of temperature 10 8.5 Recovery.10 8.6 Intermediate / final shear strength .10 9 Items to be included in the test report.10 10 Items to be given in the product specification .11 Annex A (normative) Shear strength test Details.15 B
21、ibliography17 Figure 1 Area under evaluation in the shear strength test 6 Figure 2 Typical reflow soldering profile.9 Figure 3 Test procedure.10 Figure 4 Failure modes in shear strength test (5-faced electrodes) 12 Figure 5 Failure modes in shear strength test (two electrodes type).13 Figure 6 Failu
22、re modes in shear strength test (switches)14 Figure A.1 Fixing of substrate for shear strength test .16 Figure A.2 Position of pushing tool (leadless components).16 62137-1-2 IEC:2007 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS F
23、OR SURFACE MOUNT SOLDER JOINT Part 1-2: Shear strength test FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-
24、operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred t
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32、ation or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Public
33、ation may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62137-1-2 has been prepared by IEC technical committee 91: Electronics assembly technology. This bilingual version, published in 2008-05, corresponds
34、 to the English version. The text of this standard is based on the following documents: FDIS Report on voting 91/683/FDIS 91/699/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of this standard
35、 has not been voted upon. 4 62137-1-2 IEC:2007 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 62137 series, under the general title Surface mounting technology Environmental and endurance test methods for surface mount solder j
36、oint, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication wi
37、ll be reconfirmed; withdrawn; replaced by a revised edition; or amended. 62137-1-2 IEC:2007 5 SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT Part 1-2: Shear strength test 1 Scope The test method described in this part of IEC 62137 is applicable to
38、 leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a subs
39、trate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate. 2 Normative references The following referenced documents are indispensable for the appli
40、cation of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-1, Environmental testing Part 1: General and guidance IEC 60068-2-14, Environmental testing Part 2-14: Te
41、sts Test N: Change of temperature IEC 60194, Printed board design, manufacture and assembly Terms and definitions (only available in English) IEC 61188-5-2, Printed boards and printed board assemblies Design and use Part 5-2: Attachment (land/joint) considerations Discrete components IEC 61188-5-5,
42、Printed boards and printed board assemblies Design and use Part 5-5: Attachment (land/joint) considerations Components with gull-wing leads on four sides (only available in English) IEC 61190-1-2, Attachment materials for electronic assembly Part 1-2: Requirements for solder pastes for high-quality
43、interconnects in electronics assembly (only available in English) IEC 61190-1-3, Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (only available in English) IEC 61249-
44、2-7, Materials for printed boards and other interconnecting structures Part 2-7: Reinforced base materials clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad IEC 61760-1, Surface mounting technology Part 1: Standard method for the speci
45、fication of surface mounting components (SMDs) (only available in English) 6 62137-1-2 IEC:2007 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. NOTE Key terms used in this standard are taken mostly from IEC 60068-1 and IEC 60194. 3.1 shear streng
46、th maximum force applied parallel to the substrate and perpendicular to the specimen lateral surface to break the joint of SMD mounted on a board 3.2 displacement rate speed of the pushing tool, which is used to break the joint 3.3 shear height distance between the bottom surface of the pushing tool
47、 and the surface of the substrate 4 General remarks The mechanical properties of the joint between a terminal to a land on a printed wiring board using lead-free solder are not the same for the joint using tin-lead solder due to the difference in composing elements of the solders. Thus it becomes im
48、portant to test the mechanical properties of solder joints, using different solder alloys, and after temperature cycling stresses have been applied. In this test method, the test specimens are mounted on a substrate by reflow soldering. The durability of the solder joint is evaluated by exposing the
49、 electronic components to a rapid change of temperature and applying a shear stress to the solder joint. NOTE 1 The exposure temperatures in this test may exceed the rated temperature range of the specific electronic component. NOTE 2 This test is not a test to measure the strength of the electronic components. The test method to evaluate the robustness of the joint to
