1、 IEC 62047-10 Edition 1.0 2011-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 10: Micro-pillar compression test for MEMS materials Dispositifs semiconducteur Dispositifs microlectromcaniques Partie 10: Essai de compression utilisant la techn
2、ique des micro-piliers pour les matriaux des MEMS IEC 62047-10:2011 colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2011 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, el
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16、ur cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62047-10 Edition 1.0 2011-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Par
17、t 10: Micro-pillar compression test for MEMS materials Dispositifs semiconducteur Dispositifs microlectromcaniques Partie 10: Essai de compression utilisant la technique des micro-piliers pour les matriaux des MEMS INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE
18、L ICS 31.080.99 PRICE CODE CODE PRIX ISBN 978-2-88912-606-4 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale colour inside 2 62047-10 IEC:2011 CONTENTS FOREWORD . 3 1 Scope . 5 2 Normative references . 5 3 Symbols and
19、 designations 5 4 Test piece 6 4.1 General . 6 4.2 Shape of test piece . 6 4.3 Measurement of dimensions 6 5 Testing method and test apparatus . 7 5.1 Test principle 7 5.2 Test machine . 7 5.3 Test procedure 8 5.4 Test environment. 8 6 Test report 8 Annex A (informative) Error estimation using finit
20、e element method . 10 Bibliography 11 Figure 1 Shape of cylindrical pillar (See Table 1 for symbols) 5 Figure 2 Schematic of Micro-pillar compression test 7 Figure A.1 Error estimation with the aspect ratio and friction coefficient in the elastic modulus measurement 10 Table 1 Symbols and designatio
21、ns of test piece . 6 62047-10 IEC:2011 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 10: Micro-pillar compression test for MEMS materials FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standar
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31、rawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall n
32、ot be held responsible for identifying any or all such patent rights. International Standard IEC 62047-10 has been prepared by subcommittee 47F: Micro- electromechanical systems, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS
33、 Report on voting 47F/85/FDIS 47F/94/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of IEC 62047, under th
34、e general title Semiconductor devices Micro- electromechanical devices, can be found on the IEC website. 4 62047-10 IEC:2011 The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in t
35、he data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The “colour inside” logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the
36、correct understanding of its contents. Users should therefore print this publication using a colour printer. 62047-10 IEC:2011 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 10: Micro-pillar compression test for MEMS materials 1 Scope This part of IEC 62047 specifies micro-pillar compr
37、ession test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be ob
38、tained. The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micro- machining technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be more than 3. This standard is applicable to metallic, ceramic, and polymeric materials. 2 Norm
39、ative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62047-8, Semiconductor devic
40、es Micro-electromechanical devices Part 8: Strip bending test method for tensile property measurement of thin films 3 Symbols and designations For the purposes of this document, the shape of test piece and symbols are given in Figure 1 and Table 1, respectively. Test piece in this standard is often
41、referred to as a pillar specimen. Cylindrical pillar Substrate D H IEC 1708/11 Key Components Dimensions of cylindrical pillar cylindrical pillar: a part of micro-pillars fabricated on a substrate using micro-machining process shaped in a cylinder as a test piece D: diameter of a test piece substrat
42、e: a kind of rigid (or highly stiff) material supporting the test piece H: height of a test piece Figure 1 Shape of cylindrical pillar (See Table 1 for symbols) 6 62047-10 IEC:2011 Table 1 Symbols and designations of test piece Symbol Unit Designation H m height of a test piece D m diameter of a tes
43、t piece 4 Test piece 4.1 General The test piece shall be prepared by using the same fabrication process as the actual device fabrication. To minimize the size effect of a test piece, the structure and size of the test piece should be similar to those of the device components. There are many fabricat
44、ion methods of the test piece depending on the applications. 4.2 Shape of test piece This standard specifies the compressive properties of a cylindrical micro-pillar. The micro- pillars are fabricated on a substrate using micro-machining process. The shape and the verticality of the pillars should b
45、e checked using electron or optical microscopy. The boundary condition on the bottom surface of the pillar is usually regarded as the fixed boundary, and these boundary conditions are different from those of bulk scale pillars where the top and bottom surfaces are usually lubricated and regarded as
46、the frictionless boundary. Since it is also difficult to directly measure the compressive strain of the micro-pillar during the test, the strain is estimated from the displacement of the rigid punch using the Equation (2) of 5.1. This leads to errors in strain, and consequently errors in elastic mod
47、ulus and yield strength as described in Annex A. The accuracy of this method depends on the friction coefficient between the punch and the top surface, and the aspect ratio of the micro-pillar. The pillar with high aspect ratio is desirable for reducing the errors in strain estimation unless the buc
48、kling occurs. The upper limit of aspect ratio is dependent on boundary conditions and material properties of the pillar. The maximum aspect ratio is suggested as 10 4 1 . When there is no buckling after test for a pillar with an aspect ratio larger than 10, the test data should be considered as a va
49、lid one. The friction coefficient on the top surface can be reduced by applying a lubricating layer for bulk pillars (see 4), but it is very difficult to apply the lubricating layer to micro-pillars. The maximum variation in diameter of a cross-section of a pillar should be less than 1 % of the nominal diameter. When this is not the case, the actual cross-sectional area should be measured. 4.3 M
