1、 IEC 61784-5-1 Edition 1.0 2013-09 INTERNATIONAL STANDARD NORME INTERNATIONALE Industrial communication networks Profiles Part 5-1: Installation of fieldbuses Installation profiles for CPF 1 Rseaux de communication industriels Profils Partie 5-1: Installation des bus de terrain Profils dinstallation
2、 pour CPF 1 IEC 61784-5-1:2013 colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2013 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including pho
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16、-1 Edition 1.0 2013-09 INTERNATIONAL STANDARD NORME INTERNATIONALE Industrial communication networks Profiles Part 5-1: Installation of fieldbuses Installation profiles for CPF 1 Rseaux de communication industriels Profils Partie 5-1: Installation des bus de terrain Profils dinstallation pour CPF 1
17、INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE W ICS 25.040.40; 35.100.40 PRICE CODE CODE PRIX ISBN 978-2-8322-1059-8 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Mak
18、e sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 61784-5-1 IEC:2013 CONTENTS FOREWORD . 7 INTRODUCTION . 9 1 Scope . 10 2 Normative references . 10 3 Terms, defin
19、itions and abbreviated terms . 10 4 CPF 1: Overview of installation profiles 10 5 Installation profile conventions . 10 6 Conformance to installation profiles 11 Annex A (Normative) CP 1/1 (FOUNDATION H1) specific installation profile 13 A.1 Installation profile scope . 13 A.2 Normative references .
20、 13 A.3 Installation profile terms, definitions, and abbreviated terms . 13 A.3.1 Terms and definitions 13 A.3.2 Abbreviated terms . 13 A.3.3 Conventions for installation profiles . 13 A.4 Installation planning . 13 A.4.1 General . 13 A.4.2 Planning requirements . 13 A.4.2.1 Safety 13 A.4.2.2 Securi
21、ty . 13 A.4.2.3 Environmental considerations and EMC . 13 A.4.2.4 Specific requirements for generic cabling in accordance with ISO/IEC 24702 13 A.4.3 Network capabilities 14 A.4.3.1 Network topology . 14 A.4.3.2 Network characteristics . 16 A.4.4 Selection and use of cabling components 18 A.4.4.1 Ca
22、ble selection . 18 A.4.4.2 Connecting hardware selection . 19 A.4.4.3 Connections within a channel/permanent link 20 A.4.4.4 Terminators 21 A.4.4.5 Device location and connection . 21 A.4.4.6 Coding and labelling . 21 A.4.4.7 Earthing and bonding of equipment and devices and shielded cabling 22 A.4.
23、4.8 Storage and transportation of cables . 23 A.4.4.9 Routing of cables 24 A.4.4.10 Separation of circuit 24 A.4.4.11 Mechanical protection of cabling components . 24 A.4.4.12 Installation in special areas . 24 A.4.5 Cabling planning documentation 24 A.4.5.1 Common description 24 A.4.5.2 Cabling pla
24、nning documentation for CPs . 24 A.4.5.3 Network certification documentation 24 61784-5-1 IEC:2013 3 A.4.5.4 Cabling planning documentation for generic cabling in accordance with ISO/IEC 24702 . 24 A.4.6 Verification of cabling planning specification . 24 A.5 Installation implementation . 24 A.5.1 G
25、eneral requirements 24 A.5.2 Cable installation . 24 A.5.2.1 General requirements for all cabling types . 24 A.5.2.2 Installation and routing 25 A.5.2.3 Specific cable installation requirements for CPs 25 A.5.2.4 Specific requirements for wireless installation 25 A.5.2.5 Specific requirements for ge
26、neric cabling in accordance with ISO/IEC 24702 25 A.5.3 Connector installation 25 A.5.3.1 Common description 25 A.5.3.2 Shielded connectors 25 A.5.3.3 Unshielded connectors 25 A.5.3.4 Specific requirements for CPs . 25 A.5.3.5 Specific requirements for generic cabling in accordance with ISO/IEC 2470
27、2 25 A.5.4 Terminator installation . 25 A.5.5 Device installation . 26 A.5.6 Coding and labelling 26 A.5.7 Earthing and bonding of equipment and devices and shield cabling . 26 A.5.7.1 Common description 26 A.5.7.2 Bonding and earthing of enclosures and pathways 26 A.5.7.3 Earthing methods 26 A.5.7.
28、4 Shield earthing methods 26 A.5.7.5 Specific requirements for CPs . 26 A.5.7.6 Specific requirements for generic cabling in accordance with ISO/IEC 24702 26 A.5.8 As-implemented cabling documentation . 26 A.6 Installation verification and installation acceptance test 26 A.6.1 General . 26 A.6.2 Ins
29、tallation verification . 26 A.6.3 Installation acceptance test . 26 A.6.3.1 General . 26 A.6.3.2 Acceptance test of Ethernet-based cabling 26 A.6.3.3 Acceptance test of non-Ethernet-based cabling . 26 A.6.3.4 Specific requirements for wireless installation 26 A.6.3.5 Acceptance test report . 27 A.7
30、Installation administration . 27 A.7.1 General . 27 A.7.2 Fields covered by the administration . 27 A.7.3 Basic principles for the administration system . 27 A.7.4 Working procedures 27 A.7.5 Device location labelling 27 A.7.6 Component cabling labelling 27 A.7.7 Documentation 27 A.7.8 Specific requ
31、irements for administration 27 4 61784-5-1 IEC:2013 A.8 Installation maintenance and installation troubleshooting . 27 A.8.1 General . 27 A.8.2 Maintenance 27 A.8.3 Troubleshooting 27 A.8.4 Specific requirements for maintenance and troubleshooting 27 Annex B (normative) CP 1/2 (FOUNDATION HSE) speci
32、fic installation profile 28 B.1 Installation profile scope . 28 B.2 Normative references . 28 B.3 Installation profile terms, definitions, and abbreviated terms . 28 B.3.1 Terms and definitions 28 B.3.2 Abbreviated terms . 28 B.3.3 Conventions for installation profiles . 28 B.4 Installation planning
33、 . 28 B.4.1 General . 28 B.4.2 Planning requirements . 28 B.4.3 Network capabilities 28 B.4.3.1 Network topology . 28 B.4.3.2 Network characteristics . 28 B.4.4 Selection and use of cabling components 29 B.4.4.1 Cable selection . 29 B.4.4.2 Connecting hardware selection . 31 B.4.4.3 Connections with
34、in a channel/permanent link 31 B.4.4.4 Terminators 31 B.4.4.5 Device location and connection . 31 B.4.4.6 Coding and labelling . 32 B.4.4.7 Earthing and bonding of equipment and devices and shielded cabling 32 B.4.4.8 Storage and transportation of cables . 32 B.4.4.9 Routing of cables 32 B.4.4.10 Se
35、paration of circuits 32 B.4.4.11 Mechanical protection of cabling components . 32 B.4.4.12 Installation in special areas . 32 B.4.5 Cabling planning documentation 32 B.4.6 Verification of cabling planning specification . 32 B.5 Installation implementation . 33 B.5.1 General requirements 33 B.5.2 Cab
36、le installation . 33 B.5.2.1 General requirements for all cabling types . 33 B.5.2.2 Installation and routing 33 B.5.2.3 Specific cable installation requirements for CPs 33 B.5.2.4 Specific requirements for wireless installation 33 B.5.2.5 Specific requirements for generic cabling in accordance with
37、 ISO/IEC 24702 34 B.5.3 Connector installation 34 B.5.4 Terminator installation . 34 B.5.5 Device installation . 34 B.5.5.1 Common description 34 B.5.5.2 Specific requirements for CPs . 34 61784-5-1 IEC:2013 5 B.5.6 Coding and labelling 34 B.5.6.1 Common description 34 B.5.6.2 Specific requirements
38、for CPs . 34 B.5.7 Earthing and bonding of equipment and devices and shield cabling . 34 B.5.7.1 Common description 34 B.5.7.2 Bonding and earthing of enclosures and pathways 34 B.5.7.3 Earthing methods 34 B.5.7.4 Shield earthing methods 34 B.5.7.5 Specific requirements for CPs . 34 B.5.7.6 Specific
39、 requirements for generic cabling in accordance with ISO/IEC 24702 34 B.5.8 As-implemented cabling documentation . 34 B.6 Installation verification and installation acceptance test 34 B.6.1 General . 34 B.6.2 Installation verification . 34 B.6.2.1 General . 34 B.6.2.2 Verification according to cabli
40、ng planning documentation 34 B.6.2.3 Verification of earthing and bonding 34 B.6.2.4 Verification of shield earthing 35 B.6.2.5 Verification of cabling system 35 B.6.2.6 Cable selection verification . 35 B.6.2.7 Connector verification . 35 B.6.2.8 Connection verification 35 B.6.2.9 Terminators verif
41、ication . 35 B.6.2.10 Coding and labelling verification . 35 B.6.2.11 Verification report . 35 B.6.3 Installation acceptance test . 35 B.6.3.1 General . 35 B.6.3.2 Acceptance test of Ethernet-based cabling 35 B.6.3.3 Acceptance test of non-Ethernet-based cabling . 35 B.6.3.4 Specific requirements fo
42、r wireless installation 36 B.6.3.5 Acceptance test report . 36 B.7 Installation administration . 36 B.7.1 General . 36 B.7.2 Fields covered by the administration . 36 B.7.3 Basic principles for the administration system . 36 B.7.4 Working procedures 36 B.7.5 Device location labelling 36 B.7.6 Compon
43、ent cabling labelling 36 B.7.7 Documentation 36 B.7.8 Specific requirements for administration 36 B.8 Installation maintenance and installation troubleshooting . 36 B.8.1 General . 36 B.8.2 Maintenance 36 B.8.3 Troubleshooting 36 B.8.4 Specific requirements for maintenance and troubleshooting 36 Bib
44、liography 37 Figure 1 Standards relationships 9 6 61784-5-1 IEC:2013 Figure A.1 Tree topology . 14 Figure A.2 Bus topology . 15 Figure A.3 Combination of the tree topology and the bus topology . 15 Figure A.4 Fieldbus extension 16 Table A.1 Limit values for distortion, reflection and signal delay. 1
45、7 Table A.2 Recommended maximum cable lengths including spurs . 17 Table A.3 Recommended length of the spurs . 17 Table A.4 Maximum length of the splices . 18 Table A.5 Information relevant to copper cable: fixed cables 19 Table A.6 Connectors for copper cabling CPs not based on Ethernet . 20 Table
46、A.7 Parameters for balanced cables . 25 Table B.1 Network characteristics for balanced cabling based on Ethernet 29 Table B.2 Information relevant to copper cable: fixed cables . 30 Table B.3 Information relevant to copper cable: cords 30 Table B.4 Connectors for balanced cabling CPs based on Ethern
47、et . 31 Table B.5 Parameters for balanced cables . 33 61784-5-1 IEC:2013 7 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ INDUSTRIAL COMMUNICATION NETWORKS PROFILES Part 5-1: Installation of fieldbuses Installation profiles for CPF 1 FOREWORD 1) The International Electrotechnical Commission (IEC) is a
48、worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to oth
49、er activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- government
