1、 IEC 61760-4 Edition 1.0 2015-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices Technique du montage en surface (SMT) Partie 4: Classification, emballage, tiquetage et manipulation des di
2、spositifs sensibles lhumidit IEC 61760-4:2015-05(en-fr) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2015 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or
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20、 4: Classification, packaging, labelling and handling of moisture sensitive devices Technique du montage en surface (SMT) Partie 4: Classification, emballage, tiquetage et manipulation des dispositifs sensibles lhumidit INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIO
21、NALE ICS 31.190 ISBN 978-2-8322-2666-7 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous a
22、vez obtenu cette publication via un distributeur agr. colour inside 2 IEC 61760-4:2015 IEC 2015 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 7 2 Normative references 7 3 Terms and definitions 7 4 General information . 9 4.1 Moisture sensitive devices 9 4.2 Moisture sensitivity level (MSL) . 10 4.3
23、 Relation to other environmental test methods (humidity tests) . 10 5 Assessment of moisture sensitivity 10 5.1 Identification of non moisture sensitive devices . 10 5.2 Classification 10 6 Test procedure 11 6.1 General . 11 6.1.1 Structurally similar components . 11 6.1.2 Verification and validatio
24、n tests . 11 6.1.3 Selection of applicable soak conditions and temperature profile 12 6.2 Drying . 12 6.3 Moisture soak . 12 6.4 Temperature load 13 6.4.1 Classification temperature profile . 13 6.4.2 Classification temperature profile for special devices . 14 6.5 Recovery 14 6.6 Final measurements
25、14 6.6.1 Requirements 14 6.6.2 Visual inspection . 15 6.6.3 Electrical measurements 15 6.6.4 Non-destructive inspection (if required) . 15 6.7 Classification 15 6.8 Information to be given in the relevant specification 15 7 Requirements to packaging and labelling . 16 7.1 Packaging process 16 7.1.1
26、Drying of MSDs and carrier materials before being sealed in MBBs . 16 7.1.2 Evacuation and sealing 17 7.2 Packaging material for dry pack 17 7.2.1 Moisture barrier bag (MBB) 17 7.2.2 Desiccant 17 7.2.3 Humidity indicator 19 7.3 Information to be given on labels 20 8 Handling of moisture sensitive de
27、vices 21 8.1 Storage . 21 8.1.1 Recommended storage conditions . 21 8.1.2 Shelf life 21 8.1.3 Floor life 21 8.2 ESD 22 IEC 61760-4:2015 IEC 2015 3 8.3 Humidity indication 22 8.3.1 Humidity indicator card (HIC) . 22 8.3.2 Moisture indicating desiccant . 22 8.4 Unpacking and re-packing . 22 9 Drying 2
28、3 9.1 Drying options . 23 9.2 Methods 24 9.2.1 General considerations for baking . 24 9.2.2 Bakeout times 24 9.2.3 ESD protection 25 9.2.4 Reuse of carriers . 25 9.2.5 Solderability limitations 25 Annex A (informative) Moisture sensitivity of assemblies . 26 Annex B (informative) Mass/gain loss anal
29、ysis . 27 Annex C (informative) Baking of devices 28 C.1 Baking time and conditions . 28 C.2 Example of a baking process 28 Annex D (normative) Moisture sensitivity labels . 30 D.1 Object . 30 D.2 Graphical symbols and labels . 30 D.2.1 Graphical symbol for moisture-sensitivity . 30 D.2.2 Moisture-s
30、ensitivity identification label (MSID) . 30 D.2.3 Moisture-sensitivity caution label (MSCL) 31 Bibliography 32 Figure 1 Classification temperature profile . 13 Figure 2 Examples of humidity indicator cards . 20 Figure C.1 Baking process . 29 Figure D.1 Standardized graphical symbol for use on equipm
31、ent . 30 Figure D.2 Alternative moisture sensitivity symbol (also in market use) 30 Figure D.3 MSID labels (examples) 31 Table 1 Moisture sensitivity levels 11 Table 2 Moisture soak conditions . 12 Table 3 Parameters of the classification temperature profile 14 Table 4 Classification temperatures T
32、c14 Table 5 MBB material properties 17 Table 6 Conditions for re-bake Example for one type of plastic encapsulated devices . 23 Table 7 Conditions for baking prior to dry pack Example for one type of plastic encapsulated devices . 24 4 IEC 61760-4:2015 IEC 2015 INTERNATIONAL ELECTROTECHNICAL COMMISS
33、ION _ SURFACE MOUNTING TECHNOLOGY Part 4: Classification, packaging, labelling and handling of moisture sensitive devices FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National
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44、national Standard IEC 61760-4 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/1244FDIS 91/1259/RVD Full information on the voting for the approval of this standard can be found i
45、n the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 61760, published under the general title Surface mounting technology, can be found on the IEC website. IEC 61760-4:2015 IEC 2015 5
46、The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revis
47、ed edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. 6 IEC 61760-4:2015 IEC
48、 2015 INTRODUCTION Due to the higher temperature profiles of reflow soldering processes using tin-silver-copper alloys or other lead-free solder alloys with higher melting temperatures than Sn-Pb eutectic solder, the sensitivity of components against soldering heat, when being exposed to moisture be
49、fore soldering, becomes an increasingly important factor. The currently existing standards describing the moisture sensitivity classification of devices are applicable for plastic encapsulated semiconductors and similar solid state packages (e.g. IEC 60749-20), but not for other types of components. This part of IEC 61760 also extends the classification and packaging methods as described in J-STD-020 an
