1、 IEC 61249-2-38Edition 1.0 2008-11INTERNATIONAL STANDARD NORME INTERNATIONALEMaterials for printed boards and other interconnecting structures Part 2-38: Reinforced base materials, clad and unclad Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test),
2、copper-clad for lead-free assembly Matriaux pour circuits imprims et autres structures dinterconnexion Partie 2-38: Matriaux de base renforcs, plaqus et non plaqus Feuilles stratifies en tissu de verre de type E poxyde non halognes, plaques cuivre, dinflammabilit dfinie (essai de combustion vertical
3、e) pour les assemblages sans plomb IEC61249-2-38:2008 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2008 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, incl
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17、 avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.chTl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 61249-2-38Edition 1.0 2008-11INTERNATIONAL STANDARD NORME INTERNATIONALEMaterials for printed boards and other interconnecting structures Part 2-38: Reinforced ba
18、se materials, clad and unclad Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly Matriaux pour circuits imprims et autres structures dinterconnexion Partie 2-38: Matriaux de base renforcs, plaqus et non plaqus Feu
19、illes stratifies en tissu de verre de type E poxyde non halognes, plaques cuivre, dinflammabilit dfinie (essai de combustion verticale) pour les assemblages sans plomb INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE SICS 31.180 PRICE CODECODE PRIXISBN 2-8318-1018
20、-4 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 61249-2-38 IEC:2008 CONTENTS FOREWORD.4 1 Scope.6 2 Normative references6 3 Materials and construction 6 3.1 Resin system.6 3.2 Metal foil .7 3.3 Reinforcement .7
21、4 Internal marking7 5 Electrical properties 7 6 Non-electrical properties of the copper-clad laminate 8 6.1 Appearance of the copper-clad sheet.8 6.1.1 Indentations (pits and dents)8 6.1.2 Wrinkles 8 6.1.3 Scratches 8 6.1.4 Raised areas .8 6.1.5 Surface waviness.9 6.2 Appearance of the unclad face.9
22、 6.3 Laminate thickness9 6.4 Bow and twist 9 6.5 Properties related to the copper foil bond.10 6.6 Punching and machining11 6.7 Dimensional stability11 6.8 Sheet sizes12 6.8.1 Typical sheet sizes 12 6.8.2 Tolerances for sheet sizes .12 6.9 Cut panels.12 6.9.1 Cut panel sizes 12 6.9.2 Size tolerances
23、 for cut panels 12 6.9.3 Rectangularity of cut panels .13 7 Non-electrical properties of the base material after complete removal of the copper foil13 7.1 Appearance of the dielectric base material.13 7.2 Flexural strength13 7.3 Flammability14 7.4 Water absorption .14 7.5 Measling15 7.6 Glass transi
24、tion temperature and cure factor15 7.7 Decomposition temperature .15 7.8 Thermal resistance 16 7.9 Z-axis expansion .16 8 Quality assurance .16 8.1 Quality system .16 8.2 Responsibility for inspection.16 8.3 Qualification inspection16 8.4 Quality conformance inspection .16 8.5 Certificate of conform
25、ance.17 61249-2-38 IEC:2008 3 8.6 Safety data sheet.17 9 Packaging and marking.17 10 Ordering information .17 Annex A (informative) Engineering information .18 Annex B (informative) Common laminate constructions.20 Annex C (informative) Guideline for qualification and conformance inspection.22 Bibli
26、ography23 Table 1 Electrical properties .7 Table 2 Nominal thickness and tolerance of metal-clad laminate.9 Table 3 Bow and twist 10 Table 4 Pull-off and peel strength .11 Table 5 Dimensional stability12 Table 6 Size tolerance for cut panels12 Table 7 Rectangularity of cut panels.13 Table 8 Flexural
27、 strength14 Table 9 Flammability 14 Table 10 Water absorption .14 Table 11 Measling15 Table 12 Glass transition temperature and cure factor 15 Table 13 Decomposition temperature .15 Table 14 Thermal resistance 16 Table 15 Z-axis expansion16 4 61249-2-38 IEC:2008 INTERNATIONAL ELECTROTECHNICAL COMMIS
28、SION _ MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES Part 2-38: Reinforced base materials, clad and unclad Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly FOREWORD 1) The International Elect
29、rotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields.
30、To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC Nat
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32、ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation
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34、e held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. A
35、ny divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publi
36、cation. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, prop
37、erty damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in
38、this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any
39、 or all such patent rights. International Standard IEC 61249-2-38 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/812/FDIS 91/834/RVD Full information on the voting for the appro
40、val of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 61249-2-38 IEC:2008 5 A list of all parts of the IEC 61249 series, under the general title Materials for printed boards and oth
41、er interconnecting structures, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this
42、 date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 61249-2-38 IEC:2008 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES Part 2-38: Reinforced base materials, clad and unclad Non-halogenated epoxide woven E-glass laminate sheets of def
43、ined flammability (vertical burning test), copper-clad for lead-free assembly 1 Scope This part of IEC 61249 gives requirements for properties of di-functional non-halogenated epoxide woven E-glass laminate sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The
44、 glass transition temperature is defined to be 120 C minimum. Its flame resistance is defined in terms of the flammability requirements of 7.3. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order otherwise the default class
45、of material will be supplied. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) appli
46、es. IEC 61189-2:2006, Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test method for interconnection structures IEC 61249-5-1:1995, Materials for interconnection structures Part 5 : Sectional specification set for conductive foils an
47、d films with and without coatings Section 1: Copper foils (for the manufacture of copper-clad base materials) ISO 9000, Quality management systems Fundamentals and vocabulary ISO 11014-1, Safety data sheet for chemical products Part 1: Content and order of sections ISO 14001, Environmental managemen
48、t systems Requirements with guidance for use 3 Materials and construction The sheet consists of an insulating base with metal-foil bonded to one side or both. 3.1 Resin system Majority di-functional non-halogenated epoxide, modified non-halogenated epoxide, woven E-glass laminate with a glass transi
49、tion temperature of 120 C minimum. The flammability rating is achieved through the use of non-halogenated flame retardants reacted into the polymer. Inorganic fillers may be used. Contrast agents may be added to enhance processing such as automated optical inspection (AOI). 61249-2-38 IEC:2008 7 The maximum total halogens contained in the resin plus