1、 IEC 61193-3 Edition 1.0 2013-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Quality assessment systems Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing Systme dassurance de la qualit Partie 3: Choix et utilisation de plans dchantillonnag
2、e pour cartes imprimes et produits finis stratifis et audits en cours de fabrication IEC61193-3:2013 colourinsideTHIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2013 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized
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16、ou si vous avez des questions contactez-nous: csciec.ch. IEC 61193-3 Edition 1.0 2013-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Quality assessment systems Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing Systme dassurance de la quali
17、t Partie 3: Choix et utilisation de plans dchantillonnage pour cartes imprimes et produits finis stratifis et audits en cours de fabrication INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE XB ICS 31.190 PRICE CODE CODE PRIX ISBN 978-2-83220-585-3 Registered trade
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19、olourinside 2 61193-3 IEC:2013 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope . 7 2 Normative references 7 3 Terms and definitions . 7 4 Sampling methodologies . 9 4.1 General . 9 4.2 Attribute sampling plans. 10 4.2.1 General . 10 4.2.2 Continuous sampling 10 4.2.3 Production lot attributes . 10 4.
20、2.4 Production lot variables 10 4.3 Non-statistical sampling plans 11 4.4 Defining c = 0 plans . 11 5 Classification of attributes . 16 5.1 General . 16 5.2 Classification assignment 17 5.3 Classification and adjustment of sampling plan criteria . 18 5.4 Process control 18 6 Defects and process devi
21、ation indicator (PDI) evaluation . 19 6.1 General . 19 6.2 Process control and process improvement requirements 19 7 Inspection plans 19 7.1 General . 19 7.2 Zero acceptance number-based sampling plans . 20 7.3 Responsible authority 20 7.4 Application. 20 7.5 Sampling plan specification 20 7.6 Submi
22、ssion of product . 21 8 Classification of defects 23 8.1 General . 23 8.2 Customers detail specification (CDS) data . 23 9 Percent defectives per million opportunities . 23 9.1 General . 23 9.2 Classes of DPMO 24 9.2.1 General . 24 9.2.2 DPMO-1 Functional non-conformances only 24 9.2.3 DPMO-2 Electr
23、ical non-conformances . 24 9.2.4 DPMO-3 Visual/mechanical non-conformances . 24 9.2.5 DPMO-4 hermetic non-conformances 24 9.2.6 DPMO-5 all non-conformances 24 9.3 Estimation of DPMO 24 9.3.1 General . 24 9.3.2 DPMO reporting . 24 9.4 DPMO calculations 25 61193-3 IEC:2013 3 9.4.1 General . 25 9.4.2 S
24、ampling requirements 25 10 Use of sampling plans . 25 10.1 General . 25 10.2 Grouping of tests . 25 10.3 Categorization . 26 10.4 In-process testing and control 26 10.5 Indirect measuring methods . 27 Annex A (informative) Example of consensus sampling plan for three levels of conformance to require
25、ments of IEC 62326-4 multilayer printed boards . 28 Annex B (informative) Example of consensus sampling plan . 49 Annex C (informative) Operating characteristics curves and values . 52 Bibliography 60 Figure 1 Typical OC curve for c 0 plan . 13 Figure 2 OC curve comparisons between c 0 and c = 0 pla
26、ns . 14 Figure 3 Systematic path for implementing process control . 19 Figure 4 Non-conforming attributes with specification requirements 22 Figure C.1 Lot size 2 to 8 . 53 Figure C.2 Lot size 9 to 15 . 53 Figure C.3 Lot size 16 to 25 54 Figure C.4 Lot size 26 to 50 54 Figure C.5 Lot size 51 to 90 5
27、5 Figure C.6 Lot size 91 to 150 55 Figure C.7 Lot size 151 to 280 56 Figure C.8 Lot size 281 to 500 56 Figure C.9 Lot size 501 to 1 200 . 57 Figure C.10 Lot size 1 201 to 3 200 57 Figure C.11 Lot size 3 201 to 10 000 58 Figure C.12 Lot size 10 001 to 35 000 58 Figure C.13 Lot size 35 000 to 150 000.
28、 59 Figure C.14 Lot size 150 001 to 500 000 . 59 Table 1 Inspection plan comparison 14 Table 2 Risk management index values (Associated AQ Limits) 15 Table 3 Sample size selection guideline . 16 Table 4 Worst-case use environments 17 Table 5 General sample plan criteria per industry markets/technolo
29、gy sectors 21 Table 6 Process control 27 Table A.1 Performance requirements . 28 Table B.1 Guideline for qualification and conformance inspection . 50 Table C.1 Lot sizes 52 Table C.2 Small lot characteristics 52 4 61193-3 IEC:2013 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ QUALITY ASSESSMENT SYSTE
30、MS Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committe
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41、Standard IEC 61193-3 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/1061/FDIS 91/1080/RVD Full information on the voting for the approval of this standard can be found in the re
42、port on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 61193-3 IEC:2013 5 A list of all parts of the IEC 61193 series, under the general title Quality assessment systems, can be found on the IEC website. The committee has dec
43、ided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amend
44、ed. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. 6 61193-3 IEC:2013 INTRODUCTION A clear de
45、scription in IEC standards and specifications and their reference to sampling plans in order to insure adherence to customer requirements is essential. All the details should be clear as to their implementation or adjustment for evaluation of the product to be shipped, the use of process control and
46、 SPC, or the applicability for using these principles in controlled experimentation. The general characteristics of these principles relate to a gradual reduction that might be needed in examining the product being manufactured. As such, they are sometimes referred to as the logical steps to process
47、 improvement. These steps are as follows. a) STATISTICAL SAMPLING: where, when, and why To determine a proper amount of examples from a given lot of product and using statistics to evaluate the occurrence of anomalies. b) ZERO DEFECT STANDARDS: role of specifications To adopt the role of attempting
48、to achieve no defects in a production lot through the recommendations identified in standards or specifications that define the product requirements. c) ECONOMICS: AQL versus cost of defects To establishing the highest level of non-conforming product characteristics, determining the cost that is inc
49、urred when these are discovered or delivered accidentally to the customer (cost of quality) and establishing an acceptable quality assessment methodology in order to reduce these occurrences. d) SPC REDUCED INSPECTION: rules for use and control To create a process control program that is based on reject criteria, followed by controlled experimentation to improve the
