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    IEC 61189-5-4-2015 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 5-3 General test methods for materials and assemb.pdf

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    IEC 61189-5-4-2015 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 5-3 General test methods for materials and assemb.pdf

    1、 IEC 61189-5-4 Edition 1.0 2015-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-4: General test methods for materials and assemblies Solder alloys and fluxed and non-fluxed solid wire for

    2、printed board assemblies Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles Partie 5-4: Mthodes dessai gnrales pour les matriaux et les assemblages Alliages braser et brasages solides fluxs et non fluxs pour les assemblages de cartes im

    3、primes IEC 61189-5-4:2015-01(en-fr) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2015 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying

    4、 and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC

    5、member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, san

    6、s laccord crit de lIEC ou du Comit national de lIEC du pays du demandeur. Si vous avez des questions sur le copyright de lIEC ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de lIEC de votre pays de rsidence. I

    7、EC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electri

    8、cal, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. IEC Catalogue - webstore.iec.ch/catalogue Th

    9、e stand-alone application for consulting the entire bibliographical information on IEC International Standards, Technical Specifications, Technical Reports and other documents. Available for PC, Mac OS, Android Tablets and iPad. IEC publications search - www.iec.ch/searchpub The advanced search enab

    10、les to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published details all

    11、 new publications released. Available online and also once a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 30 000 terms and definitions in English and French, with equivalent terms in 15 additional lan

    12、guages. Also known as the International Electrotechnical Vocabulary (IEV) online. IEC Glossary - std.iec.ch/glossary More than 60 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002. Some entries have be

    13、en collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEC Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. A propos de lIEC La Commission Electrot

    14、echnique Internationale (IEC) est la premire organisation mondiale qui labore et publie des Normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications IEC Le contenu technique des publications IEC est constamment revu. Veuillez

    15、vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Catalogue IEC - webstore.iec.ch/catalogue Application autonome pour consulter tous les renseignements bibliographiques sur les Normes internationales, Spcifications techniques, Rapports techniques

    16、et autres documents de lIEC. Disponible pour PC, Mac OS, tablettes Android et iPad. Recherche de publications IEC - www.iec.ch/searchpub La recherche avance permet de trouver des publications IEC en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Elle donne aussi des informatio

    17、ns sur les projets et les publications remplaces ou retires. IEC Just Published - webstore.iec.ch/justpublished Restez inform sur les nouvelles publications IEC. Just Published dtaille les nouvelles publications parues. Disponible en ligne et aussi une fois par mois par email. Electropedia - www.ele

    18、ctropedia.org Le premier dictionnaire en ligne de termes lectroniques et lectriques. Il contient plus de 30 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans 15 langues additionnelles. Egalement appel Vocabulaire Electrotechnique International (IEV) en ligne. Gl

    19、ossaire IEC - std.iec.ch/glossary Plus de 60 000 entres terminologiques lectrotechniques, en anglais et en franais, extraites des articles Termes et Dfinitions des publications IEC parues depuis 2002. Plus certaines entres antrieures extraites des publications des CE 37, 77, 86 et CISPR de lIEC. Ser

    20、vice Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61189-5-4 Edition 1.0 2015-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards and other

    21、interconnection structures and assemblies Part 5-4: General test methods for materials and assemblies Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles Par

    22、tie 5-4: Mthodes dessai gnrales pour les matriaux et les assemblages Alliages braser et brasages solides fluxs et non fluxs pour les assemblages de cartes imprimes INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.180 ISBN 978-2-8322-1999-7 Registered tradem

    23、ark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2

    24、IEC 61189-5-4:2015 IEC 2015 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 7 2 Normative references 7 3 Accuracy, precision and resolution 7 3.1 General . 7 3.2 Accuracy . 8 3.3 Precision . 8 3.4 Resolution 9 3.5 Report. 9 3.6 Students t distribution 9 3.7 Suggested uncertainty limits . 10 4 C: Chem

    25、ical test methods 11 4.1 Test 5-4C01: Determination of the percentage of flux on/in flux-coated and/or flux-cored solder 11 Object 11 4.1.1Test specimen . 11 4.1.2Apparatus 11 4.1.3Test procedure 11 4.1.4 4.2 Test 5-4CXX . 12 5 X: Miscellaneous test methods 12 5.1 Test 5-4X01: Spread test, extracted

    26、 cored wires or preforms 12 Object 12 5.1.1Method A . 12 5.1.2Method B . 13 5.1.3Additional information 15 5.1.4 5.2 Test 5-4X02: Spitting test of flux-cored wire solder . 15 Object 15 5.2.1Method A . 15 5.2.2Method B . 16 5.2.3Additional information 19 5.2.4 5.3 Test 5-4X03: Solder pool test 20 Obj

    27、ect 20 5.3.1Test specimen . 20 5.3.2Apparatus and reagents . 20 5.3.3Test procedure 20 5.3.4Evaluation . 21 5.3.5Additional information 21 5.3.6 Bibliography 22 Figure 1 Test apparatus for spitting test . 16 Figure 2 Test apparatus for spitting test, method B 18 Figure 3 Collecting paper with printe

    28、d concentric circles with 1 cm pitch 19 IEC 61189-5-4:2015 IEC 2015 3 Table 1 Students t distribution . 10 Table 2 Typical spread areas defined in mm 213 Table 3 Example of a test report Spitting of flux-cored wire . 19 4 IEC 61189-5-4:2015 IEC 2015 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST M

    29、ETHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 5-4: General test methods for materials and assemblies Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies FOREWORD 1) The International Electrotechnical Commission (I

    30、EC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in additi

    31、on to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee intereste

    32、d in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with

    33、conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC

    34、 National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for t

    35、he way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between an

    36、y IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformi

    37、ty. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members

    38、of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or an

    39、y other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may b

    40、e the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61189-5-4 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS

    41、Report on voting 91/1212/FDIS 91/1225/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. IEC 61189-5-4:2015 IEC 2015 5 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. This Intern

    42、ational Standard is used in conjunction with IEC 61189-1:1997, IEC 61189-2:2006, IEC 61189-3:2007. A list of all parts in the IEC 61189 series, published under the general title Test methods for electrical materials, printed boards and other interconnection structures and assemblies, can be found on

    43、 the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, r

    44、eplaced by a revised edition, or amended. 6 IEC 61189-5-4:2015 IEC 2015 INTRODUCTION IEC 61189 relates to test methods for materials or component robustness for printed board assemblies, irrespective of their method of manufacture. The standard is divided into separate parts, covering information fo

    45、r the designer and the test methodology engineer or technician. Each part has a specific focus; methods are grouped according to their application and numbered sequentially as they are developed and released. In some instances test methods developed by other TCs (for example, TC 104) have been repro

    46、duced from existing IEC standards in order to provide the reader with a comprehensive set of test methods. When this situation occurs, it will be noted on the specific test method; if the test method is reproduced with minor revision, those paragraphs that are different are identified. This part of

    47、IEC 61189 contains test methods for evaluating robustness of materials or component for printed board assemblies. The methods are self-contained, with sufficient detail and description so as to achieve uniformity and reproducibility in the procedures and test methodologies. The tests shown in this s

    48、tandard are grouped according to the following principles: P: preparation/conditioning methods V: visual test methods D: dimensional test methods C: chemical test methods M: mechanical test methods E: electrical test methods N: environmental test methods X: miscellaneous test methods To facilitate r

    49、eference to the tests, to retain consistency of presentation, and to provide for future expansion, each test is identified by a number (assigned sequentially) added to the prefix (group code) letter showing the group to which the test method belongs. The test method numbers have no significance with respect to a possible test sequence; that responsibility rests with the relevant specificat


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