1、 IEC 61189-5-2 Edition 1.0 2015-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-2: General test methods for materials and assemblies Soldering flux for printed board assemblies Mthodes des
2、sai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles Partie 5-2: Mthodes dessai gnrales pour les matriaux et les assemblages Flux de brasage pour les assemblages de cartes imprimes IEC 61189-5-2:2015-01(en-fr) THIS PUBLICATION IS COPYRIGHT PROTECTED
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20、res sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61189-5-2 Edition 1.0 2015-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-2: General test methods fo
21、r materials and assemblies Soldering flux for printed board assemblies Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles Partie 5-2: Mthodes dessai gnrales pour les matriaux et les assemblages Flux de brasage pour les assemblages de ca
22、rtes imprimes INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.180 ISBN 978-2-8322-1997-3 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtaine
23、d this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 IEC 61189-5-2:2015 IEC 2015 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Accuracy, precision and resolution 8 3.1 Gener
24、al . 8 3.2 Accuracy . 9 3.3 Precision . 9 3.4 Resolution 10 3.5 Report. 10 3.6 Students t distribution 10 3.7 Suggested uncertainty limits . 11 4 C: Chemical test methods 12 4.1 Test 5-2C01: Corrosion, flux . 12 4.1.1 Object 12 4.1.2 Test specimen . 12 4.1.3 Apparatus and reagents . 12 4.1.4 Procedu
25、res 12 4.1.5 Additional information 14 4.2 Test 5-2C02: Determination of acid value of liquid soldering flux potentiometric and visual titration methods . 14 4.2.1 Object 14 4.2.2 Test specimen . 14 4.2.3 Apparatus and reagents . 14 4.2.4 Procedures 15 4.2.5 Additional information 16 4.3 Test 5-2C03
26、: Acid number of rosin 16 4.4 Test 5-2C04: Determination of halides in fluxes, silver chromate method 16 4.4.1 Object 16 4.4.2 Test specimen . 17 4.4.3 Apparatus and reagents . 17 4.4.4 Procedure 17 4.4.5 Evaluation . 17 4.4.6 Additional information 17 4.5 Test 5-2C05: Solids content, flux 18 4.5.1
27、Object 18 4.5.2 Test specimen . 18 4.5.3 Apparatus and reagents . 18 4.5.4 Procedures 19 4.5.5 Evaluation . 19 4.5.6 Additional information 19 4.6 Test 5-2C06: Quantitative determination of halide content in fluxes (chloride and bromide) 19 4.6.1 Object 19 4.6.2 Test specimen . 20 4.6.3 Apparatus an
28、d reagents . 20 IEC 61189-5-2:2015 IEC 2015 3 4.6.4 Procedure 21 4.6.5 Calculations . 22 4.6.6 Report . 23 4.6.7 Additional information 23 4.7 Test 5-2C07: Qualitative analysis of fluorides and fluxes by spot test 24 4.7.1 Object 24 4.7.2 Test specimen . 24 4.7.3 Apparatus and reagents . 24 4.7.4 Pr
29、ocedure 24 4.8 Test 5-2C08: Quantitative determination of fluoride concentration in fluxes . 24 4.8.1 Object 24 4.8.2 Test specimen . 25 4.8.3 Apparatus and reagents . 25 4.8.4 Procedure 25 4.8.5 Additional information 27 4.8.6 Informative references . 27 4.9 Test 5-2C09: Specific gravity 27 4.9.1 O
30、bject 27 4.9.2 Test specimen . 27 4.9.3 Apparatus 28 4.9.4 Test procedure 28 4.9.5 Evaluation . 28 4.10 Test 5-2C10: Flux induced corrosion (copper mirror method) 28 4.10.1 Object 28 4.10.2 Test specimen . 28 4.10.3 Apparatus and reagents . 28 4.10.4 Procedure 29 4.10.5 Evaluation . 29 4.10.6 Additi
31、onal information 30 4.10.7 Reference documents 30 5 X: Miscellaneous test methods 30 5.1 Test 5-2X01: Liquid flux activity, wetting balance method 30 5.1.1 Object 30 5.1.2 Test specimen . 30 5.1.3 Apparatus and reagents . 31 5.1.4 Procedure 31 5.1.5 Evaluation . 31 5.1.6 Additional information 31 5.
32、2 Test 5-2X02: Spread test, liquid or extracted solder flux, solder paste and extracted cored wires or preforms . 34 5.2.1 Object 34 5.2.2 Method A . 34 5.2.3 Method B . 35 5.2.4 Additional information 37 5.3 Test 5-2X03: Flux residues Tackiness after drying . 37 5.3.1 Object 37 5.3.2 Test specimen
33、. 37 5.3.3 Apparatus and reagents . 37 5.3.4 Procedure 38 4 IEC 61189-5-2:2015 IEC 2015 5.3.5 Evaluation . 39 5.3.6 Additional information 39 Bibliography 40 Figure 1 Chlorides and/or bromides test results . 18 Figure 2 Test equipment of specific gravity (hydrometer reading) . 28 Figure 3 Flux type
34、classification by copper mirror test 30 Figure 4 Wetting balance apparatus . 32 Figure 5 Wetting balance curve 33 Table 1 Students t distribution . 11 Table 2 Relation between halide content and mass of specimen 22 Table 3 Mixing ratio from specimen size to water quantity 25 Table 4 Specimen size to
35、 chloroform mixture . 26 Table 5 Typical spread areas defined in mm 235 IEC 61189-5-2:2015 IEC 2015 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 5-2: General test methods for materials and
36、 assemblies Soldering flux for printed board assemblies FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-oper
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46、f this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61189-5-2 has been prepared by IEC technical
47、 committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/1210/FDIS 91/1223/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publi
48、cation has been drafted in accordance with the ISO/IEC Directives, Part 2. 6 IEC 61189-5-2:2015 IEC 2015 This International Standard is used in conjunction with IEC 61189-1:1997, IEC 61189-2:2006, IEC 61189-3:2007. A list of all parts in the IEC 61189 series, published under the general title Test m
49、ethods for electrical materials, printed boards and other interconnection structures and assemblies, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconf
