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    IEC 60917-2-5-2012 Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5 Sectional specification - Interface coordination dimensi.pdf

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    IEC 60917-2-5-2012 Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5 Sectional specification - Interface coordination dimensi.pdf

    1、 IEC 60917-2-5 Edition 1.0 2012-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Modular order for the development of mechanical structures for electronic equipment practices Part 2-5: Sectional specification Interface co-ordination dimensions for the 25 mm equipment practice Cabinet interface dimensi

    2、ons for miscellaneous equipment Ordre modulaire pour le dveloppement des structures mcaniques pour les infrastructures lectroniques Partie 2-5: Spcification intermdiaire Dimensions de coordination pour les interfaces des infrastructures au pas de 25 mm Dimensions pour les interfaces des baies pour q

    3、uipements divers IEC60917-2-5:2012 colourinsideTHIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2012 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including p

    4、hotocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your

    5、 local IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les micr

    6、ofilms, sans laccord crit de la CEI ou du Comit national de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de la CEI de votre

    7、pays de rsidence. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standa

    8、rds for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. Useful links: IEC publica

    9、tions search - www.iec.ch/searchpub The advanced search enables you to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up

    10、 to date on all new IEC publications. Just Published details all new publications released. Available on-line and also once a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 30 000 terms and definitions

    11、in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical Vocabulary (IEV) on-line. Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Custo

    12、mer Service Centre: csciec.ch. A propos de la CEI La Commission Electrotechnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des Normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications CEI L

    13、e contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Liens utiles: Recherche de publications CEI - www.iec.ch/searchpub La recherche avance vous permet de trouver des publi

    14、cations CEI en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Elle donne aussi des informations sur les projets et les publications remplaces ou retires. Just Published CEI - webstore.iec.ch/justpublished Restez inform sur les nouvelles publications de la CEI. Just Published d

    15、taille les nouvelles publications parues. Disponible en ligne et aussi une fois par mois par email. Electropedia - www.electropedia.org Le premier dictionnaire en ligne au monde de termes lectroniques et lectriques. Il contient plus de 30 000 termes et dfinitions en anglais et en franais, ainsi que

    16、les termes quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International (VEI) en ligne. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 60917

    17、-2-5 Edition 1.0 2012-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Modular order for the development of mechanical structures for electronic equipment practices Part 2-5: Sectional specification Interface co-ordination dimensions for the 25 mm equipment practice Cabinet interface dimensions for mi

    18、scellaneous equipment Ordre modulaire pour le dveloppement des structures mcaniques pour les infrastructures lectroniques Partie 2-5: Spcification intermdiaire Dimensions de coordination pour les interfaces des infrastructures au pas de 25 mm Dimensions pour les interfaces des baies pour quipements

    19、divers INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE R ICS 31.240 PRICE CODE CODE PRIX ISBN 978-2-83220-152-7 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure

    20、that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colourinside 2 60917-2-5 IEC:2012 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope . 6 2 Normative references . 6 3 Terms and definitions

    21、. 7 4 Arrangement overview of a frame based cabinet structure 8 5 External coordination dimensions of a cabinet 9 General . 9 5.1Cabinet frame mounting points 9 5.26 Modular frame type cabinet structure 11 General . 11 6.1Modular frame type “M” . 11 6.2Modular frame type “N” 13 6.3Annex A (informati

    22、ve) Illustrative figures 15 Bibliography 19 Figure 1 Arrangement overview of a frame based cabinet structure . 8 Figure 2 External coordination dimensions of cabinet . 9 Figure 3 Frame mounting points of a modular cabinet 10 Figure 4 Modular frame type “M“ 600 mm 600 mm 12 Figure 5 Modular frame typ

    23、e “N” 600 mm 600 mm . 13 Figure A.1 Illustrative figures for coordination dimensions of cabinet . 15 Figure A.2 Examples of arrangements of miscellaneous equipment . 16 Figure A.3 Cabinet mounting uprights mounted on “M” type frame 600 mm 600 mm . 17 Figure A.4 Cabinet mounting uprights mounted on “

    24、N” type frame 600 mm 600 mm . 18 Table 1 External coordination dimensions of cabinet 14 60917-2-5 IEC:2012 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES Part 2-5: Sectional specification Interface co-ordina

    25、tion dimensions for the 25 mm equipment practice Cabinet interface dimensions for miscellaneous equipment FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The

    26、 object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifi

    27、cations (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations l

    28、iaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters exp

    29、ress, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Commi

    30、ttees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC Nation

    31、al Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does n

    32、ot provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have

    33、the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoev

    34、er, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publicatio

    35、ns is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard

    36、 IEC 60917-2-5 has been prepared by subcommittee 48D: Mechanical structures for electronic equipment, of IEC technical committee 48: Electromechanical components and mechanical structures for electronic equipment. The text of this standard is based on the following documents: FDIS Report on voting 4

    37、8D/509/FDIS 48D/516/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 60917-2-5 IEC:2012 A list of all the parts in the IEC 609

    38、17 series, published under the general title Modular order for the development of mechanical structures for electronic equipment practices can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the

    39、IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colou

    40、rs which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. 60917-2-5 IEC:2012 5 INTRODUCTION The standards IEC 60297-3-100 and IEC 60917-2-1 for electronic cabinets have been established for systematically de

    41、fined external dimensions and for the internal mounting dimensions of subracks and chassis considered as the most common mechanical designs of electronic equipment. Comparing the above two mentioned standards it becomes obvious that both follow the same metric footprint but differ with respect to th

    42、e mounting dimensions for the installed equipment. Furthermore, there are no definitions in either standards for the interface dimensions of any other miscellaneous equipment. This kind of equipment is primarily not designed to standardized mounting dimensions insofar as it is meant for subracks or

    43、chassis. The installation of such non-standard equipment into cabinets used to be accomplished by supporting shelves or special mounting devices. In addition to the above mentioned lack of dimensional definitions there are many accessories for special applications where a definition of interface dim

    44、ensions could facilitate the adaptation to a cabinet, e.g. internally or externally mounted cooling device and other miscellaneous devices. It seems worthwhile to create a standard for modular cabinets with the definition of interface mounting planes and mounting points for internally and externally

    45、 mounted miscellaneous devices. Such an attempt could fulfil the dimensional preconditions for an environmentally optimised modular structure, such as: definition of a frame-based cabinet structure for the individual combination of piece parts e.g. doors, side covers, top covers; interfaces for misc

    46、ellaneous devices by definition of mounting planes with mounting points on the cabinet frame structure; mounting of equipment of the IEC 60297 and IEC 60917 series within the same cabinet with associated mounting uprights; modularity of the frame-based structure supporting shipment in the form of ki

    47、ts in order to maximize logistics efficiency and to minimize costs. Legacy cabinets complying with IEC 60917-2-1 and IEC 60297-3-100 may be considered in conjunction with cabinets of IEC 60917-2-5 without significant technical modifications due to the fact that all follow the same coordination dimen

    48、sions. Whilst the internal mounting points for mounting standardized equipment are defined in IEC 60297-3-100 and IEC 60917-2-1 in case of IEC 60917-2-5 additional mounting planes and mounting points are defined to be used for attaching miscellaneous equipment or accessories. 6 60917-2-5 IEC:2012 MO

    49、DULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES Part 2-5: Sectional specification Interface co-ordination dimensions for the 25 mm equipment practice Cabinet interface dimensions for miscellaneous equipment 1 Scope This part of the IEC 60917 series applies to a frame-based cabinet structure with the specification of interface dimensions for t


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