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    IEC 60917-2-1-1993 Modular order for the development of mechanical structures for electronic equipment practices part 2 sectional specification interface co-ordination dimensions f.pdf

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    IEC 60917-2-1-1993 Modular order for the development of mechanical structures for electronic equipment practices part 2 sectional specification interface co-ordination dimensions f.pdf

    1、NORME INTERNATIONALE INTERNATIONAL STANDARD CE1 IEC 91 7-2-1 Premire dition First edition 1993-1 1 Ordre modulaire pour le dveloppement des structures mcaniques pour les infrastructures lectroniques - Partie 2: Spcification intermdiaire - Dimensions de coordination pour les interfaces des infrastruc

    2、tures au pas de 25 mm - Section 1 : Spcification particulire - Dimensions pour baies et btis Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section

    3、 1: Detail specification - Dimensions for cabinets and racks Numro de rfrence Reference number CEIAEC 91 7-2-1 1993 Numros des publications Depuis le ler janvier 1997, les publications de la CE1 sont numrotes partir de 60000. Publications consolides Les versions consolides de certaines publications

    4、de la CE1 incorporant les amendements sont disponibles. Par exemple, les numros ddition 1.0, 1.1 et 1.2 indiquent respectivement la publication de base, la publication de base incorporant lamendement 1, et la publication de base incorporant les amendements 1 et 2. Validit de la prsente publication L

    5、e contenu technique des publications de la CE1 est constamment revu par la CE1 afin quil reflte ltat actuel de la technique. Des renseignements relatifs la date de reconfirmation de la publication sont disponibles dans le Catalogue de la CEI. Les renseignements relatifs des questions ltude et des tr

    6、avaux en cours entrepris par le comit technique qui a tabli cette publication, ainsi que la liste des publications tablies, se trouvent dans les documents ci- dessous: Cite web de la CEI* Catalogue des publications de la CE1 Publi annuellement et mis jour rgulirement (Catalogue en ligne)* Disponible

    7、 la fois au site web de la CEI et comme priodique imprim Bulletin de la CE1 Terminologie, symboles graphiques et littraux En ce qui concerne la terminologie gnrale, le lecteur se reportera la CE1 60050: Vocabulaire Electro- technique International (VE i). Pour les symboles graphiques, les symboles l

    8、ittraux et les signes dusage gnral approuvs par la CEI, le lecteur consultera la CE1 60027: Symboles littraux a utiliser en lectrotechnique, la CE1 6041 7: Symboles graphiques utilisables sur le matriel. Index, relev et compilation des feuilles individuelles, et la CE1 60617: Symboles graphiques pou

    9、r schmas. Voir adresse site web, sur la page de titre. Num ber ng As from 1 January 1997 all IEC publications are issued with a designation in the 60000 series. Consolidated publications Consolidated versions of some IEC publications including amendments are available. For example, edition numbers 1

    10、 .O, 1.1 and 1.2 refer, respectively, to the base publication, the base publication incorporating amendment 1 and the base publication incorporating amendments 1 and 2. Validity of this publication The technical content of IEC publications is kept under constant review by the IEC, thus ensuring that

    11、 the content reflects current technology. Information relating to the date of the reconfirmation of the publication is available in the IEC catalogue. Information on the subjects under consideration and work in progress undertaken by the technical committee which has prepared this publication, as we

    12、ll as the list of publications issued, is to be found at the following IEC sources: IEC web site Catalogue of IEC publications Published yearly with regular updates (On-line catalogue)* Available both at the IEC web site* and as a printed periodical IEC Bulletin Terminology, graphical and letter sym

    13、bols For general terminology, readers are referred to I EC 60050: International Electrotechnical Vocabulary (IEV). For graphical symbols, and letter symbols and signs approved by the IEC for general use, readers are referred to publications IEC 60027: Letter symbols to be used in electrical technolo

    14、gy, IEC 60417: Graphical symbols for use on equipment. Index, survey and compilation of the single sheets and IEC 60617: Graphical symbols for diagrams. * See web site address on title page. NORME I NT E RN AT I ON ALE INTERNATIONAL STANDARD CE1 IEC 91 7-24 Premire dition First edition 1993-1 1 Ordr

    15、e modulaire pour le dveloppement des structures mcaniques pour les infrastructures lectroniques - Partie 2: Spcification intermdiaire - Dimensions de coordination pour les interfaces des infrastructures au pas de 25 mm - Section i : Spcification particulire - Dimensions pour baies et btis Modular or

    16、der for the development of mechanical structures for electronic . equipment practices - Part 2: Sectional specification - Interface Co-ordination dimensions for the 25 mm equipment practice - Section 1 : Detail specification - Dimensions for cabinets and racks 0 CE1 1993 Droits de reproduction rserv

    17、s - Copyright - all rights reserved Aucune partie de iie publication ne peut any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this prepara

    18、tion. The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of the IEC on technical matters, prepared by technical committees on which all t

    19、he National Committees having a special interest therein are represented, express, as nearly as possible, an international consensus of opinion on the subjects dealt with. 3) They have the form of recommendations for international use published in the form of standards, technical reports or guides a

    20、nd they are accepted by the National Committees in that sense. 4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards transparently to the maximum extent possible in their national and regional standards. Any divergence between the IE

    21、C Standard and the corresponding national or regional standard shall be clearly indicated in the latter. International Standard IEC 91 7-2-1 has been prepared by sub-committee 48D: Mechanical structures for electronic equipment, of IEC technical committee 48: Electromechanical components and mechani

    22、cal structures for electronic equipment. The text of this standard is based on the following documents: Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. -6- 917-2-1 OCEI:1993 ORDRE MODULAIRE POUR LE DVELOPPEMENT POUR

    23、LES INFRASTRUCTURES LECTRONIQUES - DES STRUCTURES MCANIQUES Partie 2: Spcification intermdiaire - Dimensions de coordination pour les interfaces des infrastructures au pas de 25 mm - Section 1 : Spcification particulire - Dimensions pour baies et btis 1 Domaine dapplication La prsente section de la

    24、CE1 917-2 qui constitue une spcification particulire est applicable en partie ou en totalit dans tous les domaines de llectronique O les dispositifs et les systmes sont conus selon la spcification intermdiaire CE1 91 7-2. Les dimensions des tableaux de cette spcification particulire ont t choisies d

    25、ans la spcification intermdiaire CE1 91 7-2. Toutes les autres dimensions indiques dans la spcification intermdiaire sont autorises dans cette spcification particulire a condition que les relations entre les dimensions soient maintenues, cest-dire que les diffrences entre les dimensions de coordinat

    26、ion Hc, Wc, D, et les dimensions Hco, Hc, Hc2; Wco, Wc,; D, D, indiques dans les tableaux 1, 2 et 3 soient conserves. Lobjet de cette spcification est de prescrire les dimensions qui assurent linterchangeabilit des baies et btis -entre eux, et linterchangeabilit des bacs qui y sont monts. Les baies

    27、et btis peuvent tre groups en units fonctionnelles plus grandes. Les baies ou btis spcifiques ainsi que leurs quipements et accessoires, tels que les changeurs de temprature, les quipements de commande, les interrupteurs etc. ne sont pas couverts par cette spcification. 2 Rfrences normatives Les doc

    28、uments normatifs suivants contiennent des dispositions qui, par suite de la rfrence qui y est faite, constituent des dispositions valables pour la prsente section de la CE1 917-2. Au moment de la publication, les ditions indiques taient en vigueur. Tout document normatif est sujet rvision et les par

    29、ties prenantes aux accords fonds sur la prsente section de la CE1 917-2 sont invites a rechercher la possibilit dappliquer les ditions les plus rcentes des documents normatifs indiqus ci-aprs. Les membres de la CE1 et de llS0 possdent le registre des Normes internationales en vigueur. CE1 91 6: 1988

    30、, Structures mcaniques pour quipement lectronique - Terminologie CE1 91 7: 1988, Ordre modulaire pour le dveloppement des structures mcaniques pour les infrastructures lectroniques CE1 91 7-0: 1989, Ordre modulaire pour le dveloppement des structures mcaniques pour les infrastructures lectroniques -

    31、 Partie Zro: Guide pour les utilisateurs de la CE/ 9 I7 917-2-1 O lEC11993 -7- MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 1 : Detail sp

    32、ecification - Dimensions for cabinets and racks 1 Scope This section of IEC 917-2 is a detail specification which is to be used in whole or in part in all fields of electronics where devices and systems are designed according to the sectional specification IEC 91 7-2. The dimensions in the tables of

    33、 this detail specification are a selection from the sectional specification IEC 917-2. All other sizes from the sectional specification are valid in this detail specification provided the relationship between the dimensions is maintained, .e. the dimensional difference between the co-ordination dime

    34、nsions H, Wc and D, and dimensions Hco, Hcl, Hc2; Wco, W, and D, D, shown in tables 1, 2 and 3 are to be maintained. The purpose of this publication is the specification of dimensions which will ensure mechanical interchangeability of cabinets and racks, and ensure mechanical interchangeability for

    35、sub- rack mounting. Cabinets and racks can be arranged together to form larger operating units. Application of specific cabinets or racks, attachments and accessories, such as heat exchangers, control elements, switches, etc. does not form part of this specification. 2 Normative references The follo

    36、wing normative documents contain provisions which, through reference in this text, constitute provisions of this section of IEC 917-2. At the time of publication, the editions indicated were valid. All normative documents are subject to revision, and parties to agreements based on this section of IE

    37、C 917-2 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. Members of IEC and IS0 maintain registers of currently valid International Standards. IEC 91 6: 1988, Mechanical structures for electronic equipment - Terminology IEC 91 7: 1988, Modular order for the development of mechanical structures for electronic equipment practices IEC 91 7-0: 1989, Modular order for the development of mechanical structures for electronic equipment practices - Part O: Guide for the users of IEC 917


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