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    IEC 60749-9-2017 Semiconductor devices - Mechanical and climatic test methods - Part 9 Permanence of marking《半导体器件.机械和气候试验方法.第9部分 标记的永久性》.pdf

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    IEC 60749-9-2017 Semiconductor devices - Mechanical and climatic test methods - Part 9 Permanence of marking《半导体器件.机械和气候试验方法.第9部分 标记的永久性》.pdf

    1、 IEC 60749-9 Edition 2.0 2017-03 INTERNATIONAL STANDARD Semiconductor devices Mechanical and climatic test methods Part 9: Permanence of marking IEC 60749-9:2017-03(en) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2017 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no

    2、 part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC co

    3、pyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switze

    4、rland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept

    5、under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. IEC Catalogue - webstore.iec.ch/catalogue The stand-alone application for consulting the entire bibliographical information on IEC International Standards, Tec

    6、hnical Specifications, Technical Reports and other documents. Available for PC, Mac OS, Android Tablets and iPad. IEC publications search - www.iec.ch/searchpub The advanced search enables to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives

    7、 information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published details all new publications released. Available online and also once a month by email. Electropedia - www.electropedia.org Th

    8、e worlds leading online dictionary of electronic and electrical terms containing 20 000 terms and definitions in English and French, with equivalent terms in 16 additional languages. Also known as the International Electrotechnical Vocabulary (IEV) online. IEC Glossary - std.iec.ch/glossary 65 000 e

    9、lectrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002. Some entries have been collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEC Customer Service Centre - webstore.iec.ch/csc If you wish to

    10、 give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. IEC 60749-9 Edition 2.0 2017-03 INTERNATIONAL STANDARD Semiconductor devices Mechanical and climatic test methods Part 9: Permanence of marking INTERNATIONAL ELECTROTECHNICAL

    11、 COMMISSION ICS 31.080.01 ISBN 978-2-8322-4004-5 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. 2 IEC 60749-9:2017 IEC 2017 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Terms an

    12、d definitions 5 4 Equipment . 6 5 Safety precautions . 7 6 Procedure 7 6.1 Solvents test . 7 6.2 Tape pull test 7 7 Failure criteria . 8 8 Summary . 8 Bibliography 9 IEC 60749-9:2017 IEC 2017 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Par

    13、t 9: Permanence of marking FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concer

    14、ning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their

    15、 preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates cl

    16、osely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the rele

    17、vant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the

    18、technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum

    19、 extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies pro

    20、vide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or

    21、 its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expens

    22、es arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attent

    23、ion is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60749-9 has been prepared by IEC technical committee 47: Semiconductor de

    24、vices. This second edition cancels and replaces the first edition published in 2002. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) revision to Clause 4 Equipment by a complete rewriting of Cla

    25、use 3 Terms and definitions; b) additional variant adhesive tape pull test. 4 IEC 60749-9:2017 IEC 2017 The text of this standard is based on the following documents: FDIS Report on voting 47/2348/FDIS 47/2373/RVD Full information on the voting for the approval of this International Standard can be

    26、found in the report on voting indicated in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 60749 series, published under the general title Semiconductor devices Mechanical and climatic test methods, can be found on the

    27、 IEC website. The committee has decided that the contents of this document will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a

    28、revised edition, or amended. A bilingual version of this publication may be issued at a later date. IEC 60749-9:2017 IEC 2017 5 SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 9: Permanence of marking 1 Scope The purpose of this part of IEC 60749 is to determine whether the marks on

    29、solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process. This test is applicable for all pa

    30、ckage types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test. NOTE 1 This procedure does not apply to laser branded packages. Many available solvents that could b

    31、e used are either not sufficiently active, too stringent, or even dangerous to humans when in direct contact or when fumes are inhaled. NOTE 2 The composition of solvents used in this document is considered typical and representative of the desired stringency as far as the usual coatings and marking

    32、s are concerned. 2 Normative references There are no normative references in this document. 3 Terms and definitions For the purpose of this document, the following terms and definitions apply. ISO and IEC maintain terminological databases for use in standardization at the following addresses: IEC El

    33、ectropedia: available at http:/www.electropedia.org/ ISO Online browsing platform: available at http:/www.iso.org/obp 3.1 solvent A mixture consisting of the following: one part by volume of isopropyl alcohol; three parts by volume of volatile petroleum spirits with a flash point greater than 60 C,

    34、or three parts by volume of a mixture of 80 % by volume of kerosene and 20 % by volume of ethylbenzene Note 1 to entry: The solvent should be maintained at a temperature of 20 C to 30 C. 3.2 solvent B semi-aqueous based solvent, (defluxer), e.g. a terpene, aliphatic hydrocarbons, high molecular weig

    35、ht alcohols, etc., or any equivalent national environmental agency-approved HCFC (hydrochlorofluorocarbon), terpene or demonstrated equivalent 6 IEC 60749-9:2017 IEC 2017 3.3 solvent C mixture consisting of the following: a) two parts by volume of deionized water; b) one part by volume of propylene

    36、glycol monomethyl ether (laboratory reagent grade); c) one part by volume of monoethanolamine (laboratory reagent grade) Note 1 to entry: The solvent should be maintained at a temperature of 63 C to 70 C. 3.4 brush toothbrush with a handle made of a non-reactive material Note 1 to entry: The brush s

    37、hould have at least three long rows of hard bristles, the free ends of which should lie substantially in the same plane. The toothbrush should be used exclusively with a single solvent and when there is any evidence of softening, bending, wear, or loss of bristles, it should be replaced. 3.5 brush s

    38、troke brush stroke for solvent resistance testing is with normal hand pressure, approximately 0,6 N to 0,8 N Note 1 to entry: The brush stroke is directed in a forward direction, across the symbolized surface of the device being tested. 3.6 adhesive tape narrow strip of material, typically used to s

    39、tick, hold or fasten, with the following properties: a) physical properties total thickness (mm) 0,06 elongation (%) 20 tensile (N/100mm) 440 adhesion (N/100mm) 25-55 application temperature (C) 10-55 b) electrical properties (required only to make the test non-destructive) static charge generation

    40、(V) (23 2 C, 50 5 %RH) roll strip 50 plate strip 50 surface resistivity () IEC 61340-2-3 5 x 109 charge decay time, seconds FED-STD-101C, Method 4046 0,1 Note 1 to entry: Some adhesive tapes can generate electrostatic charges which cause potential ESD damage to the devices under test. Where this tes

    41、t is to be applied non-destructively, it is recommended that the electrical characteristics of the adhesive tape are verified with the manufacturer. Note 2 to entry: The SI unit of surface resistivity () is sometimes referred to as /sq (ohms per square), to distinguish resistivity values from resist

    42、ance values. However, the use of /sq is deprecated because it can imply a resistance per unit area, which is not correct. 4 Equipment The equipment used consists of the following: a) three brushes as defined above; b) three containers (beakers), a minimum of 400 ml to 500 ml in size, each made from

    43、non- reactive materials such as stainless steel, naldene, or glass; IEC 60749-9:2017 IEC 2017 7 c) an explosive-proof hot plate capable of maintaining solvents B and C at the temperatures defined above. 5 Safety precautions Solvents listed above exhibit some potential health, environmental and safet

    44、y hazards. The following safety requirements and precautions are to be followed at all times: a) always work under a well-vented hood. Avoid inhalation of vapours at all times; b) safety glasses/eye protection and solvent resistant gloves must be worn at all times while performing this test; c) solv

    45、ents are to be kept in covered vessels at all times when not in direct use; d) avoid contact with skin or eyes, and exposures to open flames or hot surfaces. 6 Procedure 6.1 Solvents test The solvents test is performed in the order shown below: a) Label the three vessels, three brushes, and three tw

    46、eezers, A, B, and C. Divide the test specimens into three equal groups and fill the three vessels with the appropriate solvents A, B, and C, respectively. b) Each test group, along with a brush, shall be totally immersed for 1 min in each of the solvents. c) At the end of the exposure time, the spec

    47、imens shall be removed from each solvent and brushed with normal pressure (approximately 0,6 N to 0,8 N) for ten strokes in a forwards direction on the portion of the specimen where the marking is present. d) At the conclusion of the brushing, place the devices and the brush back into the vessel of

    48、the appropriate solvent. e) Repeat the procedure above until a total of three immersions and brushings has occurred. f) Following the third immersion and brushing, rinse the specimens with deionized water, place them on a clean surface, and allow them to dry at room temperature for a minimum of 5 mi

    49、n before inspection. 6.2 Tape pull test The tape pull test is performed in the order shown below: a) Obtain marked devices and ensure the ink has been cured. The parts shall be at room temperature and the surfaces should be clean and dry. b) Place devices mark side up onto the conductive foam mat to provide ESD protection. c) Remove the tape from the dispenser at a continuous rate as opposed to jerking the tape. The amount of tape shall be sufficient to


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