1、 IEC 60191-6-6 Edition 1.0 2001-03 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine pitch land grid array (FLGA) Norma
2、lisation mcanique des dispositifs semiconducteurs Partie 6-6: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs montage en surface Guide de conception des dispositifs FLGA IEC 60191-6-6:2001 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2001 IEC, Geneva,
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16、VEI) en ligne. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 60191-6-6 Edition 1.0 2001-03 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor de
17、vices Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine pitch land grid array (FLGA) Normalisation mcanique des dispositifs semiconducteurs Partie 6-6: Rgles gnrales pour la prparation des dessins dencombrement des
18、dispositifs semiconducteurs montage en surface Guide de conception des dispositifs FLGA INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE M ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-83220-590-7 Registered trademark of the International Electrotechnical Commissi
19、on Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 60191-6-6 IEC:2001 INTERNATIONAL ELECTROTECHNICAL
20、COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine-pitch land grid array (FLGA) FOREWORD 1) The IEC (International Electrotechnical Commission) is a wo
21、rldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to o
22、ther activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work, International, governmental and non-governmental organizations liaising with t
23、he IEC also participate in this preparation. The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of the IEC on technical matters express,
24、as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested National Committees. 3) The documents produced have the form of recommendations for international use and are published in the form of standards
25、, technical specifications, technical reports or guides and they are accepted by the National Committees in that sense. 4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards transparently to the maximum extent possible in their natio
26、nal and regional standards. Any divergence between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter. 5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in c
27、onformity with one of its standards. 6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-6-6 has be
28、en prepared by subcommittee 47D: Mechanical standardization of semiconductor devices, of IEC technical committee 47: Semiconductor devices. This bilingual version (2013-01) corresponds to the monolingual English version, published in 2001-03. The text of this standard is based on the following docum
29、ents: FDIS Report on voting 47D/404/FDIS 47D/421/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of this standard has not been voted upon. This publication has been drafted in accordance with t
30、he ISO/IEC Directives, Part 3. The committee has decided that the contents of this publication will remain unchanged until 2003. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. 60191-6-6 IEC:2001 3 INTRODUCTION The demand for area array style
31、packages exists because of the multi-functions and high performance of electrical equipment. The objective of this design guide is to standardize outlines and to get interchangeability of FLGA packages. The terminal pitch and package outlines of these fine-pitch array packages are smaller than those
32、 of LGA packages. 4 60191-6-6 IEC:2001 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine-pitch land grid array (FLGA) 1 Scope This part of IEC 60191 provides commo
33、n outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. 2 Normative references The following normative documents cont
34、ain provisions which, through reference in this text, constitute provisions of this part of IEC 60191. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. However, parties to agreements based on this part of IEC 60191 are encouraged to investigate
35、 the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. Members of IEC and ISO maintain registers of currently valid International Standards. IEC 60191 (all parts), Mec
36、hanical standardization of semiconductor devices 3 Definitions For the purposes of this part of IEC 60191, the following definitions, as well as those given in the other parts of this standard, apply. 3.1 flanged type type whose package body size (body length and width) consists of its own flange co
37、mposed around the encapsulation or lid 3.2 type of real chip size type whose package body size (body length and width) consists of an encapsulation around the real chip only 3.3 FLGA packages with metal lands or metal bumps of which the terminal height is less than, or equal to, 100 m, and whose ter
38、minal pitch is less than, or equal to, 0,80 mm, positioned in an array on the base plane of the package as external terminals This package structure makes it possible to surface-mount the packages to the printed circuit board 60191-6-6 IEC:2001 5 3.4 material designation FLGA packages are classified
39、 according to the following two material designations: 3.4.1 plastic type (P-FLGA) plastic-type classification is assigned to packages which consist of resin substrate as interposer material (for example, glass-epoxy, poly-imid) 3.4.2 ceramic type (C-FLGA) ceramic-type classification is assigned to
40、packages which consist of ceramic substrate as interposer material 6 60191-6-6 IEC:2001 Design guide for fine-pitch land grid array family IEC 300/01 60191-6-6 IEC:2001 7 NOTE 1 Zone of a visible index on the top surface. NOTE 2 Datum A and B are the axes defined by the terminal positions indicated
41、with datum targets. NOTE 3 Primary datum S and seating plane to be defined by the method of least squares of spherical crowns of terminals. 8 60191-6-6 IEC:2001 Table 1 Group 1: Dimensions appropriate to mounting and interchangeability Ref. Limits to be observed Recommended values for the dimensions
42、 mm Note Min. Nom. Max. n X 1, 2 nD X 1 nE X A X A max. = 1,20, 1,70, 2,00 Includes heat slug Includes package warpage and tilt A 1X A 1max. = 0,10 b X X X At ceramic FLGA (C-FLGA) Min. Nom. Max. at e = 0,80 0,45 0,50 0,55 at e = 0,65 0,35 0,40 0,45 at e = 0,50 0,25 0,30 0,35 at e = 0,40 0,20 0,25 0
43、,30 At plastic FLGA (P-FLGA) Min. Nom. Max. at e = 0,80 0,35 0,40 0,45 at e = 0,65 0,28 0,33 0,38 at e = 0,50 0,20 0,25 0,30 at e = 0,40 0,15 0,20 0,25 D X At flanged type D = 4,0, 5,0, 6,0, 7,0, 8,0, 9,0, 10,0, 11,0, 12,0, 13,0, 14,0, 15,0, 16,0, 17,0, 18,0, 19,0, 20,0, 21,0 At type of real chip si
44、ze D = from 3,1 to 21,0 Dimension range shows nominal value E X At flanged type E = 4,0, 5,0, 6,0, 7,0, 8,0, 9,0, 10,0, 11,0, 12,0, 13,0, 14,0, 15,0, 16,0, 17,0, 18,0, 19,0, 20,0, 21,0 At type of real chip size E = from 3,1 to 21,0 Dimension range shows nominal value e X e = 0,80, 0,65, 0,50, 0,40 v
45、 X v = 0,15 Includes burrs w X at e = 0,80 w = 0,20 at e = 0,65 w = 0,20 at e = 0,50 w = 0,20 at e = 0,40 w = 0,15 x X at e = 0,80 x = 0,08 at e = 0,65 x = 0,08 at e = 0,50 x = 0,05 at e = 0,40 x = 0,05 60191-6-6 IEC:2001 9 Table 1 (continued) Ref. Limits to be observed Recommended values for the di
46、mensions mm Note Min. Nom. Max. y X at e = 0,80 y = 0,10 at e = 0,65 y = 0,10 at e = 0,50 y = 0,08 at e = 0,40 y = 0,08 y 1X y 1 = 0,2 NOTE 1 The values stipulated by the mathematical expression should be applied to the individual overall dimensional standards. NOTE 2 Symbol n refers to the total nu
47、mber of terminal positions. Table 2 Group 2: Dimensions appropriate to mounting and gauging Ref. Limits to be observed Recommended values for the dimensions mm Note Min. Nom. Max. b2 X At ceramic FLGA (C-FLGA) at e = 0,80 b2 = 0,63 at e = 0,65 b2 = 0,53 at e = 0,50 b2 = 0,40 at e = 0,40 b2 = 0,35 At
48、 plastic FLGA (P-FLGA) at e = 0,80 b2 = 0,53 at e = 0,65 b2 = 0,46 at e = 0,50 b2 = 0,35 at e = 0,40 b2 = 0,30 e X e = 0,80, 0,65, 0,50, 0,40 eD X eD = e x (nD 1) 1 aeE X eE = e x (nE 1) aSee note 1 of table 1. 10 60191-6-6 IEC:2001 Table 3 Group 3: Dimensions appropriate to automated handling Ref.
49、Limits to be observed Recommended values for the dimensions mm Note Min. Nom. Max. A X A max. = 1,20, 1,70, 2,00 Includes heat slug Includes package warpage and tilt D X D/E = 4,0, 5,0, 6,0, 7,0, 8,0, 9,0, 10,0, 11,0, 12,0, 13,0, 14,0, 15,0, 16,0, E X 17,0, 18,0, 19,0, 20,0, 21,0 y 1X y 1= 0,2 Table 4 Group 4: Dimensions for information only Ref. Limits to be observed Recommended
