1、 IEC 60191-6-20 Edition 1.0 2010-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of small outl
2、ine J-lead packages (SOJ) Normalisation mcanique des dispositifs semiconducteurs Partie 6-20: Rgles gnrales pour la prparation des dessins dencombrement des botiers pour dispositifs semiconducteurs pour montage en surface Mthodes de mesure pour les dimensions des botiers sortie en J (SOJ) de faible
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17、s, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 60191-6-20 Edition 1.0 2010-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-20: General rules for the preparation of outl
18、ine drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of small outline J-lead packages (SOJ) Normalisation mcanique des dispositifs semiconducteurs Partie 6-20: Rgles gnrales pour la prparation des dessins dencombrement des botiers pour dispositifs se
19、miconducteurs pour montage en surface Mthodes de mesure pour les dimensions des botiers sortie en J (SOJ) de faible encombrement INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE L ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-88912-167-0 Registered trademark of th
20、e International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 60191-6-20 IEC:2010 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-20: General rules for the preparation of outline drawings of surface
21、mounted semiconductor device packages Measuring methods for package dimensions of small outline J-lead packages (SOJ) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Comm
22、ittees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Avail
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30、ture whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenc
31、ed publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. Internati
32、onal Standard IEC 60191-6-20 has been prepared by subcommittee 47D: Mechanical standardization of semiconductor devices, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47D/771/FDIS 47D/775/RVD Full informatio
33、n on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directive, Part 2. 60191-6-20 IEC:2010 3 A list of all the parts in the IEC 60191 series, under the general title Mech
34、anical standardization of semiconductor devices, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication
35、. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 4 60191-6-20 IEC:2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measu
36、ring methods for package dimensions of small outline J-lead packages (SOJ) 1 Scope This part of IEC 60191 specifies methods to measure package dimensions of small outline J- lead-packages (SOJ), package outline form E in accordance with IEC 60191-4. 2 Normative references The following referenced do
37、cuments are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-4, Mechanical standardization of semiconductor devices Part 4: Cod
38、ing system and classification into forms of package outlines for semiconductor device packages IEC 60191-6, Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages 3 Terms and definitions For t
39、he purposes of this document, the terms and definitions given in IEC 60191-6 apply. 4 Measuring methods 4.1 Description of measuring methods The measuring methods described in this standard are for dimension values guaranteed to users on the basis of the following items. a) In general, measuring the
40、 dimensions shall be made with the semiconductor packages mounted on a printed circuit board as the guarantee is made to user. b) In general, measurement may be made either by hand or automatically. c) Even if a measuring method deviates from the original definition of dimensions, it is defined as a
41、n alternative measuring method as long as it is equivalent in view of accuracy and can be used easily. See 4.6.3b. d) The dimensions that cannot be measured unless the package is destroyed may be calculated from other dimensions or replaced by representative values. 60191-6-20 IEC:2010 5 4.2 Referen
42、ce characters and outline drawings An outline drawing is given in Figure 1. 1 A n/2+1 HE n/2 n E D B Terminal 1 index area IEC 2258/09A L eE A2 A1 IEC 2259/09 Figure 1a Top view Figure 1b Side view M e Seating plane S y S S x ZD A-B IEC 2260/09 Figure 1c Side view bp L2 L1 b2 IEC 2261/09A3 Lp P t M
43、P S A-B IEC 2262/09 c c1 b1 bp IEC 2263/09 Figure 1d Lead shape Figure 1e Lead side view Figure 1f Lead section b3 eE e l1 IEC 2264/09 Figure 1g Pattern of terminal position areas Figure 1 SOJ outline drawings 6 60191-6-20 IEC:2010 4.3 Mounting height A 4.3.1 Description Let the height of a package
44、from the seating plane to the top of the package be denoted as the mounting height A. See Figure 2. Figure 2 Mounting height 4.3.2 Measuring method The measuring method shall be as follows. a) Put the package on the surface plate to establish the seating plane. b) From the seating plane, measure the
45、 distance to a highest point. Let the distance be denoted as the mounting height A. 4.4 Stand-off A1 4.4.1 Description Let a distance from the seating plane to the lowest point of a package be denoted as the stand-off A1. See Figure 3. Figure 3 Stand-off 4.4.2 Measuring method The measuring method s
46、hall be as follows. a) Put the package on the surface plate to establish the reference surface (seating plane). b) Measure the distance from the reference surface (surface plate) to the lowest point of the package. Let the distance be denoted as the stand-off A1. S S IEC 2023/10 S S IEC 2024/10 6019
47、1-6-20 IEC:2010 7 4.5 Body thickness A2 4.5.1 Description The body thickness is defined as a distance between two parallel planes. It is tangent to the highest and lowest points of the body. Let the distance be denoted as the body thickness A2. See Figure 4. Figure 4 Body thickness A2 4.5.2 Measurin
48、g method The measuring method shall be as follows. a) Put the package between vertically parallel surface plates. Never touch the leads. b) Measure the total thickness including the surface plates with a micrometer and subtract the thickness of surface plates from the total thickness so as to obtain
49、 the thickness of package. 4.5.3 Quick measuring method Measure the thickness of the package with a slide calipers along each diagonal line. Let the maximum value be denoted as the body thickness A2. 4.6 Lead widths bp and b1, lead thickness c and c1 4.6.1 Description a) The outmost width bp in the range of gage height A3 from seating plane. The outmost width be
