1、 IEC 60191-6-2 Edition 1.0 2001-12 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball
2、 and column terminal packages Normalisation mcanique des dispositifs semiconducteurs Partie 6-2: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs pour montage en surface Guide de conception pour les botiers broches en forme de billes et de colonnes, avec des
3、 pas de 1,50 mm, 1,27 mm et 1,00 mm IEC 60191-6-2:2001 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2001 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, inc
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17、EC 60191-6-2 Edition 1.0 2001-12 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball a
18、nd column terminal packages Normalisation mcanique des dispositifs semiconducteurs Partie 6-2: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs pour montage en surface Guide de conception pour les botiers broches en forme de billes et de colonnes, avec des p
19、as de 1,50 mm, 1,27 mm et 1,00 mm INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE K ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-83220-532-7 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Inte
20、rnationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 60191-6-2 IEC:2001 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCT
21、OR DEVICES Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages FOREWORD 1) The IEC (International Electrotechnical Commission) is a worldwide organizatio
22、n for standardization comprising all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, th
23、e IEC publishes International Standards. Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also partici
24、pate in this preparation. The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possib
25、le, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested National Committees. 3) The documents produced have the form of recommendations for international use and are published in the form of standards, technical specifi
26、cations, technical reports or guides and they are accepted by the National Committees in that sense. 4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards transparently to the maximum extent possible in their national and regional st
27、andards. Any divergence between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter. 5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with one
28、of its standards. 6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-6-2 has been prepared by subc
29、ommittee SC 47D: Mechanical standardization of semiconductor devices, of IEC technical committee 47: Semiconductor devices. This bilingual version (2012-12) corresponds to the monolingual English version, published in 2001-12. The text of this standard is based on the following documents: FDIS Repor
30、t on voting 47D/460/FDIS 47D/471/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of this standard has not been voted upon. This publication has been drafted in accordance with the ISO/IEC Direc
31、tives, Part 3. The committee has decided that the contents of this publication will remain unchanged until 2004. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or 60191-6-2 IEC:2001 3 amended. The contents of the corrigendum of October 2002 have been inc
32、luded in this copy. 4 60191-6-2 IEC:2001 INTRODUCTION This design guide is intended to standardize the requirements for all ball and column terminal packages in order to establish common rules for terminal shapes, irrespective of device and package types. 60191-6-2 IEC:2001 5 MECHANICAL STANDARDIZAT
33、ION OF SEMICONDUCTOR DEVICES Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages 1 Scope This part of IEC 60191 covers the requirements for the preparati
34、on of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA). 2 Normative references The
35、 following normative documents contain provisions, which, through reference in this text, constitute provisions of this part of IEC 60191. For dated references, subsequent amend- ments to, or revisions of, any of these publications do not apply. However, parties to agreements based on this part of I
36、EC 60191 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. Members of IEC and ISO maintain registers of currently valid International
37、 Standards. IEC 60191 (all parts), Mechanical standardization of semiconductor devices 3 Definitions For the purpose of this part of IEC 60191, the following definitions apply. 3.1 ball terminal packages packages that have solder balls attached to a ceramic/laminate/tape substrate for mounting on a
38、PCB surface, e.g. C-BGA, P-BGA and T-BGA 3.2 column terminal packages packages that have solder columns attached to a ceramic/laminate/tape substrate for mounting on a PCB surface, e.g. C-CGA 6 60191-6-2 IEC:2001 4 Ball terminal packages, 1,50 mm, 1,27 mm and 1,00 mm pitch Reference characters and d
39、rawings 1 2 3 A B C S A SE B v S S D E v S A2 A A3 A1 S ee SD X1 S A B X2 S bp Terminal index area IEC 2699/01 y S60191-6-2 IEC:2001 7 4.1 Outline dimensions The ball terminal dimensions are shown in the tables below. 4.2 Package height The package height (A) is the thickness of the package body, in
40、cluding the lid and ball heights. For all BGA packages, the package body thickness (A2) is considered to be design specific. 4.3 Ball terminal diameter Table 1 Solder terminal Terminal pitch e Ball diameter b pnominal C-BGA P-BGA T-BGA LMP aHMP bLMP HMP LMP HMP 1,00 0,60 0,70 0,60 0,60 0,63 1,27 0,7
41、5 0,89 0,75 0,75 0,63 1,50 0,75 0,89 0,75 0,75 0,63 a LMP = Low melting point. b HMP = High melting point. 4.4 Tolerance of ball centre position Table 2 Tolerance of ball centre position Terminal pitch e Tolerance of solder ball centre position Coplanarity X1 X2 y LMP aHMP b1,00 0,25 0,10 0,15 0,15
42、1,27 0,30 0,15 0,20 0,15 1,50 0,30 0,15 0,20 0,15 a LMP = Low melting point. b HMP = High melting point. 4.5 Package body thickness and stand-off heights The relationship between the package body thickness and stand-off heights for each package is shown in the table below. 8 60191-6-2 IEC:2001 Table
43、 3 Package body thickness and stand-off heights Package type Package body thickness A2 nominal Stand-off height A1 nominal Terminal pitch e LMP aHMP bC-BGA Design specific 0,50 0,70 1,00 0,60 0,90 1,27 0,60 0,90 1,50 P-BGA Design specific 0,50 1,00 0,60 1,27 0,60 1,50 T-BGA Design specific 0,50 0,55
44、 1,00 0,60 0,55 1,27 0,60 0,55 1,50 a LMP = Low melting point. b HMP = High melting point. 4.6 Tolerance of terminal centre position and coplanarity Table 4 Tolerance of terminal centre position and coplanarity Package type Terminal pitch e Tolerance of solder ball Centre position Coplanarity X1 X2
45、y LMP aHMP bC-BGA, P-BGA, T-BGA 1,00 0,25 0,10 0,15 0,15 C-BGA, P-BGA, T-BGA 1,27 0,30 0,15 0,20 0,15 C-BGA, P-BGA, T-BGA 1,50 0,30 0,15 0,20 0,15 a LMP = Low melting point. b HMP = High melting point. 4.7 Explanatory notes 4.7.1 Objective of establishment This part of IEC 60191 is intended to stand
46、ardize the requirements of all types of ball terminal packages and to establish common rules, regardless of package type. 4.7.2 Conventional design rules for ball terminal packages Dimensions for the packages with solder ball are listed in tables 1, 2, 3, and 4. 60191-6-2 IEC:2001 9 5 Column termina
47、l packages, 1,50 mm, 1,27 mm and 1,00 mm pitch Reference characters and drawings 1 2 3 A B C S A SE B v S S D E v S A2 A A3 A1 S ee SD X1 S A B X2 S bp Terminal index area IEC 2700/01 y S 10 60191-6-2 IEC:2001 5.1 Outline dimensions The column terminal dimensions are shown in the tables below. 5.2 P
48、ackage height The package height (A) is the thickness of the package body, including the lid and column heights. For all C-CGA packages, the package body thickness (A2) is considered to be design specific. 5.3 Column terminal diameter Table 5 Solder terminal Terminal pitch e Column diameter b pnomin
49、al C-CGA LMP aHMP b1,00 0,50 0,50 1,27 0,50 0,50 1,50 0,50 0,50 a LMP = Low melting point. b HMP = High melting point. 5.4 Tolerance of column centre position Table 6 Tolerance of column centre position Terminal pitch e Tolerance of solder column centre position Coplanarity X1 X2 y LMP aHMP b1,00 0,30 0,10 0,15 0,15 1,27 0,30 0,10 0,20 0,15 1,50 0,30 0,10 0,20 0,15 a LMP =
