1、INTERNATIONAL STANDARD IEC 60191-6-1 First edition 2001-10 Mechanical standardization of semiconductor devices Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals Normalisation mcanique des disposi
2、tifs semi-conducteurs Partie 6-1: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs pour montage en surface Guide de conception pour les botiers broches en forme dailes de mouette Reference number IEC 60191-6-1:2001(E)Publication numbering As from 1 January 1
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9、ATIONAL STANDARD IEC 60191-6-1 First edition 2001-10 Mechanical standardization of semiconductor devices Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals Normalisation mcanique des dispositifs s
10、emi-conducteurs Partie 6-1: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs pour montage en surface Guide de conception pour les botiers broches en forme dailes de mouette PRICE CODE IEC 2001 Copyright - all rights reserved No part of this publication may b
11、e reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission 3, rue de Varemb Geneva, Switzerland Telefax: +41 22 919 0300 e-mail: inmailiec.ch IEC web
12、 site http:/www.iec.ch D For price, see current catalogueCommission Electrotechnique InternationaleInternational Electrotechnical Commission 2 60191-6-1 IEC:2001(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-1: General rules for the prepara
13、tion of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals FOREWORD 1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Commit
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19、andard shall be clearly indicated in the latter. 5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with one of its standards. 6) Attention is drawn to the possibility that some of the elements of this I
20、nternational Standard may be the subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-6-1 has been prepared by subcommittee 47D: Mechanical standardization of semiconductor devices, of IEC technical committee
21、47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47D/459/FDIS 47D/470/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been draft
22、ed in accordance with the ISO/IEC Directives, Part 3. The committee has decided that the contents of this publication will remain unchanged until 2003. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. A bilingual version of this publication may
23、 be issued at a later date.60191-6-1 IEC:2001(E) 3 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals 1 Scope This part of IEC 60191 covers the
24、requirements for the design rule of terminal shape plastic packages with gull-wing leads; e.g., QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4 1) . This publication is intended to establish common rules on terminal shapes irrespective of package types. 2 Normative
25、references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-6:1990, Mechanical standardi
26、zation of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages 3 Definitions For the purpose of this part of IEC 60191, the definitions of IEC 60191-6 apply as well as the following definition: 3.1 gull-wing lead complia
27、nt lead bent down from the body of the package with a foot at the end pointing away from the package 1)IEC 60191-4:1999, Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages 4 60191-6-1 IEC:2001(
28、E) 4 References and drawingsTerminal cross-section 1) 1 Seating plane, with which a package is in contact 1) The dimensions of the terminal section apply to the ranges of 0,1 mm and 0,25 mm from the end of a terminal. Figure 1 Gull-wing lead terminal b b1 c1 c A1 A2 Lp L1 A3 1 IEC 2161/0160191-6-1 I
29、EC:2001(E) 5 5 Outline dimensions The gull-wing lead design guides are shown in the tables below. The nominal value should be respected as the common value when developing packages with gull-wing leads thereby preventing proliferation of terminal shapes in the same package family. The range of value
30、s should be applied in usage on individual standards. The values are re-specified in the package design guide to reflect the specific requirement for each package type. 6 Package height and stand-off height Table 1 below shows the relationship between the package height and the stand-off height. Tab
31、le 1 Package height and stand-off height Dimensions in millimetres Package height A2 nom. (Range) Stand-off height A1 nom. (Range) 1,0 (0,951,05) 0,1 (0,000,15) 1,4 (1,351,55) 0,1 (0,000,15) Low stand-off 0,1 (0,000,25) 2,0 (1,802,20) High stand-off 0,4 (0,250,50) Low stand-off 0,1 (0,000,25) 2,7 (2
32、,502,90) High stand-off 0,4 (0,250,50) Low stand-off 0,1 (0,000,25) 3,4 (3,203,60) High stand-off 0,4 (0,250,50) Low stand-off 0,1 (0,000,25) 3,8 (3,604,00) High stand-off 0,4 (0,250,50) The package height and the stand-off height are defined regardless of the terminal pitch. 6 60191-6-1 IEC:2001(E)
33、 7 Terminal thickness and width Table 2 Terminal width b1 and b Dimensions in millimetres Terminalpitch Terminal width b1 nom. (Range) Terminal width b (Range) Note 1,27 0,40 (0,340,45) (0,340,50) 1,25 0,40 (0,340,45) (0,340,50) 1,0 0,40 (0,340,45) (0,340,50) 0,35 (0,290,41) (0,290,45) QFP only 0,8
34、0,30 (0,250,35) (0,250,40) 0,30 (0,220,36) (0,220,40) QFP only 0,65 0,22 (0,170,27) (0,170,32) 0,5 0,20 (0,170,23) (0,170,27) 0,4 0,16 (0,130,19) (0,130,23) 0,3 0,12 (0,090,15) (0,090,18) Table 3 Terminal thickness c1 and c Dimensions in millimetres Terminalpitch Terminal thickness c1 nom. (Range) T
35、erminal thickness c (Range) Note 1,27 0,25 (0,230,27) 0,20 (0,190,21) 0,15 (0,140,16) 0,125 (0,1150,135) 0,10 (0,090,11) (0,230,32) (0,190,25) (0,140,20) (0,1150,175) (0,090,15)1,251,00,80,650,50,40,3 0,15 (0,140,16) 0,125 (0,1150,135) 0,10 (0,090,11) (0,140,20) (0,1150,175) (0,090,15) e e60191-6-1
36、IEC:2001(E) 7 8 Terminal shape Table 4 Terminal shape Dimensions in millimetres Package height A2 nom. Standard height of soldered part Length of soldered part Lp nom. (Range) Angle of terminal flat portions nom. (Range) Terminal length L1 nom. Notes 1,0 0,60 (0,450,75) 1,0 1,4 0,60 (0,450,75) 1,0 0
37、,60 (0,450,75) 1,0 0,50 2,0 0,88 (0,731,03) 1,6 0,65 0,60 (0,450,75) 1,0 0,50 2,7 0,88 (0,731,03) 1,6 0,65 0,60 (0,450,75) 1,3 0,50 3,4 0,88 (0,731,03) 1,6 0,65 0,60 (0,450,75) 1,3 0,50 3,8 0,25 0,88 (0,731,03) 3 (08) 1,6 0,65 9 Tolerance of terminal center position and coplanarity Table 5 Tolerance
38、 of terminal center position and coplanarity Dimensions in millimetres Terminal pitch Tolerance of terminal centre position X Coplanarity y Note 1,27 0,25 1,25 0,35 1,0 0,20 0,20 QFP only 0,8 0,16 0,65 0,13 0,10 0,5 0,08 0,4 0,07 0,08 0,3 0,06 0,05 _ A3 e e e e e e e e e StandardsSurvey TheIECwouldl
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