欢迎来到麦多课文档分享! | 帮助中心 海量文档,免费浏览,给你所需,享你所想!
麦多课文档分享
全部分类
  • 标准规范>
  • 教学课件>
  • 考试资料>
  • 办公文档>
  • 学术论文>
  • 行业资料>
  • 易语言源码>
  • ImageVerifierCode 换一换
    首页 麦多课文档分享 > 资源分类 > PDF文档下载
    分享到微信 分享到微博 分享到QQ空间

    IEC 60191-6-1-2001 Mechanical standardization of semiconductor devices - Part 6-1 General rules for the preparation of outline drawings of surface mounted semiconductor device pack.pdf

    • 资源ID:1234052       资源大小:255.50KB        全文页数:14页
    • 资源格式: PDF        下载积分:10000积分
    快捷下载 游客一键下载
    账号登录下载
    微信登录下载
    二维码
    微信扫一扫登录
    下载资源需要10000积分(如需开发票,请勿充值!)
    邮箱/手机:
    温馨提示:
    如需开发票,请勿充值!快捷下载时,用户名和密码都是您填写的邮箱或者手机号,方便查询和重复下载(系统自动生成)。
    如需开发票,请勿充值!如填写123,账号就是123,密码也是123。
    支付方式: 支付宝扫码支付    微信扫码支付   
    验证码:   换一换

    加入VIP,交流精品资源
     
    账号:
    密码:
    验证码:   换一换
      忘记密码?
        
    友情提示
    2、PDF文件下载后,可能会被浏览器默认打开,此种情况可以点击浏览器菜单,保存网页到桌面,就可以正常下载了。
    3、本站不支持迅雷下载,请使用电脑自带的IE浏览器,或者360浏览器、谷歌浏览器下载即可。
    4、本站资源下载后的文档和图纸-无水印,预览文档经过压缩,下载后原文更清晰。
    5、试题试卷类文档,如果标题没有明确说明有答案则都视为没有答案,请知晓。

    IEC 60191-6-1-2001 Mechanical standardization of semiconductor devices - Part 6-1 General rules for the preparation of outline drawings of surface mounted semiconductor device pack.pdf

    1、INTERNATIONAL STANDARD IEC 60191-6-1 First edition 2001-10 Mechanical standardization of semiconductor devices Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals Normalisation mcanique des disposi

    2、tifs semi-conducteurs Partie 6-1: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs pour montage en surface Guide de conception pour les botiers broches en forme dailes de mouette Reference number IEC 60191-6-1:2001(E)Publication numbering As from 1 January 1

    3、997 all IEC publications are issued with a designation in the 60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1. Consolidated editions The IEC is now publishing consolidated versions of its publications. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the ba

    4、se publication, the base publication incorporating amendment 1 and the base publication incorporating amendments 1 and 2. Further information on IEC publications The technical content of IEC publications is kept under constant review by the IEC, thus ensuring that the content reflects current techno

    5、logy. Information relating to this publication, including its validity, is available in the IEC Catalogue of publications (see below) in addition to new editions, amendments and corrigenda. Information on the subjects under consideration and work in progress undertaken by the technical committee whi

    6、ch has prepared this publication, as well as the list of publications issued, is also available from the following: IEC Web Site (www.iec.ch) Catalogue of IEC publications The on-line catalogue on the IEC web site (www.iec.ch/catlg-e.htm) enables you to search by a variety of criteria including text

    7、 searches, technical committees and date of publication. On-line information is also available on recently issued publications, withdrawn and replaced publications, as well as corrigenda. IEC Just Published This summary of recently issued publications (www.iec.ch/JP.htm) is also available by email.

    8、Please contact the Customer Service Centre (see below) for further information. Customer Service Centre If you have any questions regarding this publication or need further assistance, please contact the Customer Service Centre: Email: custserviec.ch Tel: +41 22 919 02 11 Fax: +41 22 919 03 00INTERN

    9、ATIONAL STANDARD IEC 60191-6-1 First edition 2001-10 Mechanical standardization of semiconductor devices Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals Normalisation mcanique des dispositifs s

    10、emi-conducteurs Partie 6-1: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs pour montage en surface Guide de conception pour les botiers broches en forme dailes de mouette PRICE CODE IEC 2001 Copyright - all rights reserved No part of this publication may b

    11、e reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission 3, rue de Varemb Geneva, Switzerland Telefax: +41 22 919 0300 e-mail: inmailiec.ch IEC web

    12、 site http:/www.iec.ch D For price, see current catalogueCommission Electrotechnique InternationaleInternational Electrotechnical Commission 2 60191-6-1 IEC:2001(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-1: General rules for the prepara

    13、tion of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals FOREWORD 1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Commit

    14、tees). The object of the IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committee

    15、s; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization for

    16、 Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical commit

    17、tee has representation from all interested National Committees. 3) The documents produced have the form of recommendations for international use and are published in the form of standards, technical specifications, technical reports or guides and they are accepted by the National Committees in that

    18、sense. 4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards transparently to the maximum extent possible in their national and regional standards. Any divergence between the IEC Standard and the corresponding national or regional st

    19、andard shall be clearly indicated in the latter. 5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with one of its standards. 6) Attention is drawn to the possibility that some of the elements of this I

    20、nternational Standard may be the subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-6-1 has been prepared by subcommittee 47D: Mechanical standardization of semiconductor devices, of IEC technical committee

    21、47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47D/459/FDIS 47D/470/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been draft

    22、ed in accordance with the ISO/IEC Directives, Part 3. The committee has decided that the contents of this publication will remain unchanged until 2003. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. A bilingual version of this publication may

    23、 be issued at a later date.60191-6-1 IEC:2001(E) 3 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals 1 Scope This part of IEC 60191 covers the

    24、requirements for the design rule of terminal shape plastic packages with gull-wing leads; e.g., QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4 1) . This publication is intended to establish common rules on terminal shapes irrespective of package types. 2 Normative

    25、references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-6:1990, Mechanical standardi

    26、zation of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages 3 Definitions For the purpose of this part of IEC 60191, the definitions of IEC 60191-6 apply as well as the following definition: 3.1 gull-wing lead complia

    27、nt lead bent down from the body of the package with a foot at the end pointing away from the package 1)IEC 60191-4:1999, Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages 4 60191-6-1 IEC:2001(

    28、E) 4 References and drawingsTerminal cross-section 1) 1 Seating plane, with which a package is in contact 1) The dimensions of the terminal section apply to the ranges of 0,1 mm and 0,25 mm from the end of a terminal. Figure 1 Gull-wing lead terminal b b1 c1 c A1 A2 Lp L1 A3 1 IEC 2161/0160191-6-1 I

    29、EC:2001(E) 5 5 Outline dimensions The gull-wing lead design guides are shown in the tables below. The nominal value should be respected as the common value when developing packages with gull-wing leads thereby preventing proliferation of terminal shapes in the same package family. The range of value

    30、s should be applied in usage on individual standards. The values are re-specified in the package design guide to reflect the specific requirement for each package type. 6 Package height and stand-off height Table 1 below shows the relationship between the package height and the stand-off height. Tab

    31、le 1 Package height and stand-off height Dimensions in millimetres Package height A2 nom. (Range) Stand-off height A1 nom. (Range) 1,0 (0,951,05) 0,1 (0,000,15) 1,4 (1,351,55) 0,1 (0,000,15) Low stand-off 0,1 (0,000,25) 2,0 (1,802,20) High stand-off 0,4 (0,250,50) Low stand-off 0,1 (0,000,25) 2,7 (2

    32、,502,90) High stand-off 0,4 (0,250,50) Low stand-off 0,1 (0,000,25) 3,4 (3,203,60) High stand-off 0,4 (0,250,50) Low stand-off 0,1 (0,000,25) 3,8 (3,604,00) High stand-off 0,4 (0,250,50) The package height and the stand-off height are defined regardless of the terminal pitch. 6 60191-6-1 IEC:2001(E)

    33、 7 Terminal thickness and width Table 2 Terminal width b1 and b Dimensions in millimetres Terminalpitch Terminal width b1 nom. (Range) Terminal width b (Range) Note 1,27 0,40 (0,340,45) (0,340,50) 1,25 0,40 (0,340,45) (0,340,50) 1,0 0,40 (0,340,45) (0,340,50) 0,35 (0,290,41) (0,290,45) QFP only 0,8

    34、0,30 (0,250,35) (0,250,40) 0,30 (0,220,36) (0,220,40) QFP only 0,65 0,22 (0,170,27) (0,170,32) 0,5 0,20 (0,170,23) (0,170,27) 0,4 0,16 (0,130,19) (0,130,23) 0,3 0,12 (0,090,15) (0,090,18) Table 3 Terminal thickness c1 and c Dimensions in millimetres Terminalpitch Terminal thickness c1 nom. (Range) T

    35、erminal thickness c (Range) Note 1,27 0,25 (0,230,27) 0,20 (0,190,21) 0,15 (0,140,16) 0,125 (0,1150,135) 0,10 (0,090,11) (0,230,32) (0,190,25) (0,140,20) (0,1150,175) (0,090,15)1,251,00,80,650,50,40,3 0,15 (0,140,16) 0,125 (0,1150,135) 0,10 (0,090,11) (0,140,20) (0,1150,175) (0,090,15) e e60191-6-1

    36、IEC:2001(E) 7 8 Terminal shape Table 4 Terminal shape Dimensions in millimetres Package height A2 nom. Standard height of soldered part Length of soldered part Lp nom. (Range) Angle of terminal flat portions nom. (Range) Terminal length L1 nom. Notes 1,0 0,60 (0,450,75) 1,0 1,4 0,60 (0,450,75) 1,0 0

    37、,60 (0,450,75) 1,0 0,50 2,0 0,88 (0,731,03) 1,6 0,65 0,60 (0,450,75) 1,0 0,50 2,7 0,88 (0,731,03) 1,6 0,65 0,60 (0,450,75) 1,3 0,50 3,4 0,88 (0,731,03) 1,6 0,65 0,60 (0,450,75) 1,3 0,50 3,8 0,25 0,88 (0,731,03) 3 (08) 1,6 0,65 9 Tolerance of terminal center position and coplanarity Table 5 Tolerance

    38、 of terminal center position and coplanarity Dimensions in millimetres Terminal pitch Tolerance of terminal centre position X Coplanarity y Note 1,27 0,25 1,25 0,35 1,0 0,20 0,20 QFP only 0,8 0,16 0,65 0,13 0,10 0,5 0,08 0,4 0,07 0,08 0,3 0,06 0,05 _ A3 e e e e e e e e e StandardsSurvey TheIECwouldl

    39、iketoofferyouthebestqualitystandardspossible.Tomakesurethatwe continuetomeetyourneeds,yourfeedbackisessential.Wouldyoupleasetakeaminute toanswerthequestionsoverleafandfaxthemtousat+41229190300ormailthemto theaddressbelow.Thankyou! CustomerServiceCentre(CSC) InternationalElectrotechnicalCommission 3,

    40、ruedeVaremb 1211Genve20 Switzerland or Faxto: IEC/CSCat+41229190300 Thankyouforyourcontributiontothestandardsmakingprocess. Nonaff rancare No stamp required Nichtfrank ieren Ne pasaffra nchir APrioritaire RPONSEP AYE SUISSE CustomerServiceCentre(CSC) InternationalElectrotechnicalCommission 3, ruedeV

    41、aremb 1211 GENEVA20 SwitzerlandQ1 Pleasereporton ONESTANDARD and ONESTANDARDONLY .Entertheexact numberofthestandard: (e.g.6060111) . Q2 Pleasetellusinwhatcapacity(ies)you boughtthestandard (tickallthatapply). Iamthe/a: purchasingagent librarian researcher designengineer safetyengineer testingenginee

    42、r marketingspecialist other. Q3 Iworkfor/in/asa: (tickallthatapply) manufacturing consultant government test/certificationfacility publicutility education military other. Q4 Thisstandardwillbeusedfor: (tickallthatapply) generalreference productresearch productdesign/development specifications tender

    43、s qualityassessment certification technicaldocumentation thesis manufacturing other. Q5 Thisstandardmeetsmyneeds: (tickone) notatall nearly fairlywell exactly Q6 IfyoutickedNOTATALLinQuestion5 thereasonis: (tickallthatapply) standardisoutofdate standardisincomplete standardistooacademic standardisto

    44、osuperficial titleismisleading Imadethewrongchoice other Q7 Pleaseassessthestandardinthe followingcategories,using thenumbers: (1)unacceptable, (2)belowaverage, (3)average, (4)aboveaverage, (5)exceptional, (6)notapplicable timeliness. qualityofwriting technicalcontents. logicofarrangementofcontents

    45、tables,charts,graphs,figures. other Q8 Iread/usethe: (tickone) Frenchtextonly Englishtextonly bothEnglishandFrenchtexts Q9 Pleaseshareanycommentonany aspectoftheIECthatyouwouldlike ustoknow: ISBN 2-8318-6053-9 -:HSMINB=UZXY: ICS 31.080.01 Typeset and printed by the IEC Central Office GENEVA, SWITZERLAND


    注意事项

    本文(IEC 60191-6-1-2001 Mechanical standardization of semiconductor devices - Part 6-1 General rules for the preparation of outline drawings of surface mounted semiconductor device pack.pdf)为本站会员(proposalcash356)主动上传,麦多课文档分享仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文档分享(点击联系客服),我们立即给予删除!




    关于我们 - 网站声明 - 网站地图 - 资源地图 - 友情链接 - 网站客服 - 联系我们

    copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
    备案/许可证编号:苏ICP备17064731号-1 

    收起
    展开