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    IEC 60068-3-13-2016 Environmental testing - Part 3-13 Supporting documentation and guidance on Test T - Soldering《环境试验 第3-13部分 试验T的支持文件和指南 钎焊》.pdf

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    IEC 60068-3-13-2016 Environmental testing - Part 3-13 Supporting documentation and guidance on Test T - Soldering《环境试验 第3-13部分 试验T的支持文件和指南 钎焊》.pdf

    1、 IEC 60068-3-13 Edition 1.0 2016-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Environmental testing Part 3-13: Supporting documentation and guidance on Test T Soldering Essais denvironnement Partie 3-13: Documentation daccompagnement et guide sur les essais T Brasage IEC 60068-3-13:2016-05(en-fr)

    2、THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2016 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission i

    3、n writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for furthe

    4、r information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de lIEC ou du Comit n

    5、ational de lIEC du pays du demandeur. Si vous avez des questions sur le copyright de lIEC ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de lIEC de votre pays de rsidence. IEC Central Office Tel.: +41 22 919 0

    6、2 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technolo

    7、gies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. IEC Catalogue - webstore.iec.ch/catalogue The stand-alone application for consul

    8、ting the entire bibliographical information on IEC International Standards, Technical Specifications, Technical Reports and other documents. Available for PC, Mac OS, Android Tablets and iPad. IEC publications search - www.iec.ch/searchpub The advanced search enables to find IEC publications by a va

    9、riety of criteria (reference number, text, technical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published details all new publications released. Availabl

    10、e online and also once a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing 20 000 terms and definitions in English and French, with equivalent terms in 15 additional languages. Also known as the International Electr

    11、otechnical Vocabulary (IEV) online. IEC Glossary - std.iec.ch/glossary 65 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002. Some entries have been collected from earlier publications of IEC TC 37, 77,

    12、 86 and CISPR. IEC Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. A propos de lIEC La Commission Electrotechnique Internationale (IEC) est la premire organisatio

    13、n mondiale qui labore et publie des Normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications IEC Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un

    14、 corrigendum ou amendement peut avoir t publi. Catalogue IEC - webstore.iec.ch/catalogue Application autonome pour consulter tous les renseignements bibliographiques sur les Normes internationales, Spcifications techniques, Rapports techniques et autres documents de lIEC. Disponible pour PC, Mac OS,

    15、 tablettes Android et iPad. Recherche de publications IEC - www.iec.ch/searchpub La recherche avance permet de trouver des publications IEC en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Elle donne aussi des informations sur les projets et les publications remplaces ou reti

    16、res. IEC Just Published - webstore.iec.ch/justpublished Restez inform sur les nouvelles publications IEC. Just Published dtaille les nouvelles publications parues. Disponible en ligne et aussi une fois par mois par email. Electropedia - www.electropedia.org Le premier dictionnaire en ligne de termes

    17、 lectroniques et lectriques. Il contient 20 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans 15 langues additionnelles. Egalement appel Vocabulaire Electrotechnique International (IEV) en ligne. Glossaire IEC - std.iec.ch/glossary 65 000 entres terminologiques

    18、lectrotechniques, en anglais et en franais, extraites des articles Termes et Dfinitions des publications IEC parues depuis 2002. Plus certaines entres antrieures extraites des publications des CE 37, 77, 86 et CISPR de lIEC. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commen

    19、taires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 60068-3-13 Edition 1.0 2016-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Environmental testing Part 3-13: Supporting documentation and guidance on Test T Soldering Essais denvironnement Partie 3-13: Documenta

    20、tion daccompagnement et guide sur les essais T Brasage INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 19.040 ISBN 978-2-8322-3359-7 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internati

    21、onale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 IEC 60068-3-13:2016 IEC 2016 CONTENTS FOREWORD . 4 1 Scope 6 2 Normative references. 6 3 Terms, definitions a

    22、nd abbreviations 6 3.1 Terms and definitions 6 3.2 Abbreviations 7 4 Overview . 7 4.1 Factors influencing the formation and reliability of solder joints (ability to be soldered) 7 4.2 Physics of surface wetting . 8 4.3 Quality and reliability of solder joints . 10 5 Component soldering Processes . 1

    23、0 5.1 General considerations 10 5.1.1 Components ability to be soldered . 10 5.1.2 Soldering processes . 12 5.1.3 Soldering defects . 12 5.1.4 Geometrical factors which may influence the soldering result 12 5.1.5 Process factors 12 5.1.6 Material factors 12 5.2 Solder . 13 5.3 Grouping of soldering

    24、conditions . 13 5.4 Ability to be soldered . 13 5.5 Moisture sensitivity of components 13 5.6 Relation between storage time/storage conditions and solderability 14 5.6.1 Natural and accelerated ageing 14 5.6.2 Oxidation . 14 5.6.3 Growth of intermetallic layers . 14 5.6.4 Effect of ageing to wetting

    25、 characteristics . 14 5.6.5 Test conditions for accelerated ageing 15 5.7 Place of soldering tests in testing 16 6 Soldering tests 17 6.1 General . 17 6.2 Solder . 18 6.3 Fluxes . 18 6.4 Test equipment . 18 6.5 Evaluation methods . 18 6.5.1 Criteria for visual inspection . 18 6.5.2 Criteria for quan

    26、titative evaluation of the wetting characteristic . 19 6.5.3 Special cases 19 6.6 Acceptance criteria . 19 7 Soldering tests Methods 19 7.1 General principles . 19 7.2 Survey of test methods 19 7.3 Bath test . 22 7.4 Reflow test 23 7.4.1 With/without solder land . 23 IEC 60068-3-13:2016 IEC 2016 3 7

    27、.4.2 Selection of solder paste (flux system and activity grade) 23 7.5 Soldering iron test . 23 7.6 Resistance to dissolution of metallization and soldering heat 23 7.6.1 General . 23 7.6.2 Limitations . 23 7.6.3 Choice of severity 24 7.7 Wetting balance test 24 7.7.1 General . 24 7.7.2 Test methods

    28、 available 25 7.7.3 Limitations . 25 8 Requirements and statistical character of results 25 Bibliography . 27 Figure 1 Sessile drop of solder on oxidised copper . 8 Figure 2 Sessile drop of solder plus flux on clean copper 9 Figure 3 Sessile drop equilibrium forces . 9 Figure 4 Typical soldering pro

    29、cesses 12 Figure 5 Soldering tests for devices with leads . 21 Figure 6 Soldering tests for SMDs 22 Table 1 Solder process groups . 13 4 IEC 60068-3-13:2016 IEC 2016 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ENVIRONMENTAL TESTING Part 3-13: Supporting documentation and guidance on Test T Soldering

    30、 FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in th

    31、e electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted

    32、to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the Internation

    33、al Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each t

    34、echnical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC P

    35、ublications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their

    36、national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment

    37、 services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees,

    38、 servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publ

    39、ication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possib

    40、ility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60068-3-13 has been prepared by IEC technical committee 91: Electronics assembly technology. This f

    41、irst edition cancels and replaces IEC 60068-2-44:1995 and constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: information for lead-free solders are added; technical update and restructuring. IEC 60068-3-13:2016 IEC

    42、 2016 5 The text of this standard is based on the following documents: FDIS Report on voting 91/1345/FDIS 91/1356/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance wi

    43、th the ISO/IEC Directives, Part 2. A list of all parts in the IEC 60068 series, published under the general title Environmental testing, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IE

    44、C web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 IEC 60068-3-13:2016 IEC 2016 ENVIRONMENTAL TESTING Part 3-13: Supporting documentation and guidance on

    45、Test T Soldering 1 Scope This part of IEC 60068 provides background information and guidance for writers and users of specifications for electric and electronic components, containing references to the test standards IEC 60068-2-20, IEC 60068-2-58, IEC 60068-2-69, IEC 60068-2-83, and to IEC 61760-1,

    46、 which defines requirements to the specification of surface mounting components. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undat

    47、ed references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-2-20:2008, Environmental testing Part 2: Tests Test T: Test methods for solderability and resistance to soldering heat of devices with leads IEC 60068-2-58, Environmental testing Part 2-58: Tes

    48、ts Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) IEC 60068-2-69, Environmental testing Part 2-69: Tests Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wett

    49、ing balance method 1IEC 60068-2-83, Environmental testing Part 2-83: Tests Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste IEC 61760-1, Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs) IEC 62137-3, Electronics assembly technology Part


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