1、SAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirelyvoluntary, and its applicability and suitability for any particular use, including any patent infringement arising therefro
2、m, is the sole responsibility of the user.”SAE reviews each technical report at least every five years at which time it may be reaffirmed, revised, or cancelled. SAE invites your written comments and suggestions.QUESTIONS REGARDING THIS DOCUMENT: (724) 772-8512 FAX: (724) 776-0243TO PLACE A DOCUMENT
3、 ORDER; (724) 776-4970 FAX: (724) 776-0790SAE WEB ADDRESS http:/www.sae.orgCopyright 1991 Society of Automotive Engineers, Inc.All rights reserved. Printed in U.S.A.SURFACEVEHICLE400 Commonwealth Drive, Warrendale, PA 15096-0001INFORMATIONREPORTAn American National StandardJ359REV.FEB91Issued 1973-0
4、7Revised 1991-02Superseding J359 JUN81(R) INFRARED TESTINGForewordThis Document has also changed to comply with the new SAE Technical Standards Board format.1. ScopeThe scope of this SAE Information Report is to provide general information relative to the nature anduse of infrared techniques for non
5、destructive testing. The document is not intended to provide detailedtechnical information, but will serve as an introduction to the theory and capabilities of infrared testing and as aguide to more extensive references.2. References2.1 Related PublicationsThe following publications are provided for
6、 information purposes only and are not arequired part of this document.Metals Handbook, Vol. 17, 9th edition, 1989, “Thermal Inspection,“ pp. 396404.Tool and Manufacturing Engineers Handbook, Vol. 4, pp. 686 to 690, Quality Control and Assembly,1987, Society of Manufacturing Engineers, Dearborn, MI
7、48121.Kruse, McGlaucklin, McQuistan, Elements of Infrared Technology. New York: John Wiley and it can detect flaws, voids, and lack of bond in welds and solder joints, castings,etc. It has found high acceptance in the form of various infrared “cameras“ which produce in real-time, thermalimages of it
8、ems ranging in size from very large missiles to electronic microcircuits to display actual andpotential defects.4. PrincipleInfrared testing is used to detect electromagnetic radiation with wavelengths between 0.7 and 100m. All objects at a temperature greater than absolute zero radiate infrared lig
9、ht. As the temperature of theobject increases, the intensity and frequency of the infrared radiation increases. Thus, temperature can bemeasured by measuring the intensity of radiation. When the temperature of an object is high enough to radiatein the visible wavelengths of about 0.4 to 0.7 m, ordin
10、ary photography will record shadings corresponding tolocalized heat changes. Upon cooling, the radition changes to the longer red wavelengths where visibledetection of the light begins to fail, some photographic red films can still provide a record. Beyond this narrowthreshold, detection of radiatio
11、n is made possible by the use of infrared detectors and systems.Infrared detectors fall into two general types:a. Photodetectors which produce a signal from a semiconductor, the signal being proportional to theimpinging radiation. These detectors include photoelectromagnetic, photovoltaic, and photo
12、conductivetypes.b. Thermal detectors, which undergo a physical change in response to thermal change. These detectorsinclude thermistors, thermocouples, bolometers, oil film evaporation and radiometer types.An infrared detector will generally include an optical system, a blackbody, electronic circuit
13、ry, and a visualdisplay. The optical system will magnify and/or focus the object. The blackbody is a controlled temperatureradiator which is used as a reference in measuring the infrared emissions from the object.Systems can be selected for measuring temperatures as low as 150C to as high as desired
14、: for detectinggradients as small as 0.05C; for focusing from 12.7 mm (1/2 in) to infinity; and with resolution as small as0.0038 mm (0.00015 in).5. ProcedureMost of the systems are portable and have external power requirements. Readout is rapid andthe system, being remote from the specimens, is inh
15、erently nondestructive. However, a specimen could beenergized or heated to destruction if so desired, while the system recorded points or elements of failure.Operation of most systems requires some training. Experience required for evaluation of the readout isdependent on the type of information des
16、ired; that is, common sense would allow the interpretation of the“Polaroid“ display of a heat leak on a foundry furnace, while evaluation of the same display of relativetemperatures of an electronic microcircuit taken by an infrared microscope would require a knowledge of theoperating thermal charac
17、teristics of the components of the specimen.In a more complex single specimen, such as a printed circuit board, a good knowledge is needed of the theoryof heat transfer as well as the construction of the board. Lateral transfer of heat to another componentfunctioning as a sink could mask a defect wh
18、ich would otherwise be indicated by an abnormal temperature.SAE J359 Revised FEB91-3-Because infrared radiates in the same manner as visible light and because the detector measures the surfaceradiation, a defect in a multilayer specimen could be concealed behind a surface component at normaloperatin
19、g temperature. In evaluation of thermographs or thermoplots of complex specimens, considerationmust be given to the wide variations in emissivity resulting from dissimilar materials, coatings, etc.None of the foregoing present insurmountable problems. It would be expected that in production testing
20、agood standard sample would be made available, then one of many techniques such as “flicker“ comparison ofthermographs, overlays, etc., would quickly distinguish between go and no-go.6. Notes6.1 Marginal IndiciaThe change bar (l) located in the left margin is for the convenience of the user in locat
21、ingareas where technical revisions have been made to the previous issue of the report. An (R) symbol to the leftof the document title indicates a complete revision of the report.PREPARED BY THE SAE IRON & STEEL TECHNICAL COMMITTEESAE J359 Revised FEB91RationaleNot applicable.Relationship of SAE Stan
22、dard to ISO StandardNot applicable.ApplicationThe scope of this SAE Information Report is to provide general information relative to the natureand use of infrared techniques for nondestructive testing. The document is not intended to providedetailed technical information, but will serve as an introd
23、uction to the theory and capabilities of infraredtesting and as a guide to more extensive references.Reference SectionMetals Handbook, Vol. 17, 9th edition, 1989, “Thermal Inspection,“ pp. 396404.Tool and Manufacturing Engineers Handbook, Vol. 4, pp. 6-86 to 6-90, Quality Control and Assembly,1987,
24、Society of Manufacturing Engineers, Dearborn, MI 48121.Kruse, McGlaucklin, McQuistan, Elements of Infrared Technology. New York: John Wiley & Sons, 1963.Jamieson, McFee, Plass, Grube, Richards, Infrared Physics and Engineering, New York: McGraw-HillCo., 1963.Hackforth, Infrared Radiation. New York:
25、McGraw-Hill Book Co., 1960.William G. Hyzer, “Thermography,“ Research Development. February 1978, pp. 4450.W. D. Lawson and J. H. Sabey, “Infrared Techniques,“ Research Techniques in Nondestructive Testing,R. S. Sharpe, editor, Academic Press, 1970, pp. 443479.Transactions of the Infrared Sessions,
26、SNT Convention, February 1965, Society for NondestructiveTesting, 914 Chicago, Ave., Evanston, Ill.Riccardo Vanzetti, Practical Applications of Infrared Technology. New York: John Wiley & Sons, 1972.Applied Optics, Vol. 7, No. 9 (September 1968). (Special edition on infrared containing 23 papers.)P. Vogel, “Thermal Fingerprint.“ Army Research and Development News Magazine, May-June 1972.Developed by the SAE Iron & Steel Technical Committee
